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박유덕,배은정,최정실,김현수,김찬우,정석태,최한석 동아시아식생활학회 2017 동아시아식생활학회지 Vol.27 No.6
This study was investigated to determine the physicochemical changes in makgeolli in response to heat treatment and their effects on the taste and flavor of makgeolli. The main materials used in makgeolli production were rice and wheat flour. The components that affected the taste of makgeolli (organic acids, free sugars and free nitrogen compounds) were compared. There were no differences in organic acids among makgeollies by heat treatment, although there was significant difference in free sugar content. Alanine, arginine, glutamic acid, leucine, lysine, phenylalanine, proline, tyrosine, valine, and methionine were the main free nitrogen compounds in all makgeollies, and there were no changes in content in response to heat treatment. However, the minor free nitrogen compounds such as ammonia, urea, phenylalanine were confirmed to cause off-flavor get the effect of heat treatment. Therefore, the heat treatment did not affect the taste of makgeolli; however, flavor components of makgeolli were changed by heat treatment. It was confirmed that there is a difference due to the complex change of various compounds rather than the any compound in heat treatment.
다양한 조성 변화에 따른 4성분계 폴리이미드 필름 제조와 물성분석
박윤준 ( Yun Jun Park ),유덕만 ( Duk Man Yu ),최종호 ( Jong Ho Choi ),안정호 ( Jeong Ho Ahn ),홍영택 ( Young Taik Hong ) 한국공업화학회 2011 공업화학 Vol.22 No.6
다양한 조성의 PMDA/BPDA/p-PDA/ODA로 이루어진 폴리아믹산을 합성하여 다양한 조성의 4성분계 폴리이미드 필름을 열적 이미드화 공정을 통해 제조하였다. 제조된 폴리이미드 필름의 화학 구조 및 열적·기계적 특성은 퓨리에 변환 적외선 분광기(FT-IR), 열중량 분석기(TGA), 열 기계 분석기(TMA), 동·역학적 거동 분석기(DMA), 그리고 만능 인장 시험기(UTM) 등을 이용하여 조사하였다. 강직한 구조의 PMDA와 p-PDA의 함량이 증가할수록 인장강도, 탄성률 및 열적 특성이 향상되었고, 상대적으로 유연한 구조의 BPDA와 ODA의 함량이 증가할수록 신장률과 흡습률이 각각 증가하였다. 특히, 열팽창계수(CTE)값은 PMDA : BPDA : p-PDA : ODA의 조성이 5 : 5 : 4 : 6 조성일 때 동박의 CTE와 유사한 결과를 나타내었으며, 이와 같은 조성을 갖는 4성분계 폴리이미드 필름의 경우 유연성 회로 기판의 flexible copper clad laminates (FCCL)을 위한 기본 필름으로 적용할 수 있을 것으로 판단된다. Various poly(amic acid)s were synthesized from PMDA/BPDA/p-PDA/ODA with different mole ratios and effectively converted into 4-component polyimide films by thermal imidization. The chemical structures and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FT-IR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer (TMA), dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The tensile strength, modulus, and thermal properties of polyimides films increased with the amount of rigid PMDA and p-PDA, while the elongation and moisture absorption of polyimide films increased with the amount of flexible BPDA and ODA. One of 4-component polyimide films exhibited a similar coefficient of thermal expansion (CTE) value to that of copper when it was composed of PMDA : BPDA : p-PDA : ODA with the ratio of 5 : 5 : 4 : 6. Thus, this polyimide film could be useful for a base film for flexible copper clad laminates (FCCL) of flexible printed circuit boards.
Tuberculosis and Respiratory Diseases : Pulmonary Oxalosis Caused By Aspergillus Niger Infection
박경화 ( Kyung Hwa Park ),김수옥 ( Soo Ok Kim ),오인재 ( In Jae Oh ),최유덕 ( Yoo Duk Choi ),김규식 ( Kyu Sik Kim ),고영춘 ( Young Chun Ko ),임성철 ( Sung Chul Lim ),김영철 ( Young Chul Kim ),박경옥 ( Kyung Ok Park ),남종희 ( Jong 대한결핵 및 호흡기학회 2002 대한결핵 및 호흡기학회 추계학술대회 초록집 Vol.95 No.-
박윤준,홍영택,유덕만,안정호,최종호 한국고분자학회 2012 Macromolecular Research Vol.20 No.2
The surfaces of the polyimide films Kapton-E and Upilex-S are modified by ethylenediamine treatment to improve its adhesion to a subsequently deposited copper layer. The changes in the chemical composition, morphology,and adhesion properties of the modified polyimide surface are characterized by X-ray photoelectron spectroscopy,atomic force microscopy, and the 90o peel test. An ethylenediamine polyimide treatment induces amino group formation from the broken imide group. The peel strength of Kapton-E and Upilex-S with a copper layer increases from 0.3 to 0.65 kgf/cm and 0.25 to 0.46 kgf/cm, respectively. The results show that ethylenediamine treatment is a good modification method to greatly increase the adhesion performance of polyimide films to a copper layer.