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CMP 패드 두께 프로파일 측정 장치 및 방법에 관한 연구
이태경,김도연,강필식,Lee, Tae-kyung,Kim, Do-Yeon,Kang, Pil-sik 한국산업융합학회 2020 한국산업융합학회 논문집 Vol.23 No.6
The chemical mechanical planarization (CMP) is a process of physically and chemically polishing the semiconductor substrate. The planarization quality of a substrate can be evaluated by the within wafer non-uniformity (WIWNU). In order to improve WIWNU, it is important to manage the pad profile. In this study, a device capable of non-contact measurement of the pad thickness profile was developed. From the measured pad profile, the profile of the pad surface and the groove was extracted using the envelope function, and the pad thickness profile was derived using the difference between each profile. Thickness profiles of various CMP pads were measured using the developed PMS and envelope function. In the case of IC series pads, regardless of the pad wear amount, the envelopes closely follow the pad surface and grooves, making it easy to calculate the pad thickness profile. In the case of the H80 series pad, the pad thickness profile was easy to derive because the pad with a small wear amount did not reveal deep pores on the pad surface. However, the pad with a large wear amount make errors in the lower envelope profile, because there are pores deeper than the grooves. By removing these deep pores through filtering, the pad flatness could be clearly confirmed. Through the developed PMS and the pad thickness profile calculation method using the envelope function, the pad life, the amount of wear and the pad flatness can be easily derived and used for various pad analysis.
스윙 암 컨디셔너의 기구학적 해석을 통한 CMP 패드 프로파일 변화에 관한 연구
오지헌,이상직,이호준,조한철,이현섭,김형재,정해도,Oh, Ji-Heon,Lee, Sang-Jik,Lee, Ho-Jun,Cho, Han-Chul,Lee, Hyun-Seop,Kim, Hyoung-Jae,Jeong, Hae-Do 한국전기전자재료학회 2008 전기전자재료학회논문지 Vol.21 No.11
There are many factors to affect polishing performance normally in chemical mechanical polishing (CMP) process. One of the factors is a pad profile. A pad profile has not been considered as a significant factor. However, a pad profile is easily changed by conditioning process in CMP, and then changed pad profile affects polishing performance. Therefore, understanding how the pad profile is changed by conditioning process is very important. In this paper, through the simulation based on kinematic analysis, the variation of the pad profile was described in accordance with difference condition of conditioning process. A swing-arm type conditioner was applied in this simulation. A swing-arm type conditioner plays a role of generating asperities on pad surface. The conditions of conditioing process to get uniform removal were also investigated by comparing the simulation with the experiment.
CMP 컨디셔너의 다이아몬드 입자 모양이 연마 패드 표면 형상 제어에 미치는 영향
이동환,이기훈,정선호,김형재,조한철,정해도 한국트라이볼로지학회 2019 한국트라이볼로지학회지 (Tribol. Lubr.) Vol.35 No.6
Conditioning is a process involving pad surface scraping by a moving metallic disk that is electrodeposited with diamond abrasives. It is an indispensable process in chemical-mechanical planarization, which regulates the pad roughness by removing the surface residues. Additionally, conditioning maintains the material removal rates and increases the pad lifetime. As the conditioning continues, the pad profile becomes unevenly to be deformed, which causes poor polishing quality. Simulation calculates the density at which the diamond abrasives on the conditioner scratch the unit area on the pad. It can predict the profile deformation through the control of conditioner dwell time. Previously, this effect of the diamond shape on conditioning has been investigated with regard to microscopic areas, such as surface roughness, rather than global pad-profile deformation. In this study, the effect of diamond shape on the pad profile is evaluated by comparing the simulated and experimental conditioning using two conditioners: a) random-shaped abrasive conditioner (RSC) and b) uniform-shaped abrasive conditioner (USC). Consequently, it is confirmed that the USC is incapable of controlling the pad profile, which is consistent with the simulation results.
컨디셔닝 공정에 의한 연마 패드 형상 변화의 기구학 해석에 관한 연구
이상직(Sang-Jik Lee),서헌덕(Heon-Deok Seo),오지헌(Ji-Heon Oh),김형재(Hyoung-Jae Kim),정해도(Hae-Do Jeong) 한국기계가공학회 2007 한국기계가공학회 춘추계학술대회 논문집 Vol.2007 No.-
The pad is one of the most important components in the polishing process. The mechanical properties of the pad determine the removal rate and the polishing characteristics. The asperities on the pad surface involve with the mechanical removal from the workpiece surface and the pad profile is affecting the flatness across the workpiece. However, as the polishing is going on, the pad asperities are gradually worn down and the glazed area increases. The removal rate is reduced and the polishing quality becomes poorer due to the pad surface degradation. Therefore, the pad conditioning process is necessary to regenerate the pad surface by breaking up the glazed. The most common conditioning method is to use a rotating disk coated one side with diamond abrasives. The pad surface is restored by the pad cutting of the diamond abrasives. The accumulation of these cutting by the diamond conditioning is unfortunately affecting the profile of the polishing pad, which results in the unstable polishing results. This paper describes the kinematical model for the pad wear and analyzes the effects of kinematical and geometrical parameters in the pad conditioning process using the diamond disk. The kinematical modeling results were correlated with the actual pad profile induced by the pad conditioning.
CMP 패드 컨디셔닝에서 딥러닝을 활용한 컨디셔너 스윙에 따른 패드 마모 프로파일에 관한 연구
박병훈,황해성,이현섭 한국트라이볼로지학회 2024 한국트라이볼로지학회지 (Tribol. Lubr.) Vol.40 No.2
Chemical mechanical planarization (CMP) is an essential process for ensuring high integration when manufacturing semiconductor devices. CMP mainly requires the use of polyurethane-based polishing pads as an ultraprecise process to achieve mechanical material removal and the required chemical reactions. A diamond disk performs pad conditioning to remove processing residues on the pad surface and maintain sufficient surface roughness during CMP. However, the diamond grits attached to the disk cause uneven wear of the pad, leading to the poor uniformity of material removal during CMP. This study investigates the pad wear rate profile according to the swing motion of the conditioner during swing-arm-type CMP conditioning using deep learning. During conditioning, the motion of the swing arm is independently controlled in eight zones of the same pad radius. The experiment includes six swing-motion conditions to obtain actual data on the pad wear rate profile, and deep learning learns the pad wear rate profile obtained in the experiment. The absolute average error rate between the experimental values and learning results is 0.01%. This finding confirms that the experimental results can be well represented by learning. Pad wear rate profile prediction using the learning results reveals good agreement between the predicted and experimental values.
패드 마모 균일성 향상을 위한 CMP 컨디셔닝 시스템설계 변수 연구
박병훈,박범영,전언찬,이현섭 한국트라이볼로지학회 2022 한국트라이볼로지학회지 (Tribol. Lubr.) Vol.38 No.1
Chemical-mechanical polishing (CMP) process is a semiconductor process that planarizes a wafer surface using mechanical friction between a polishing pad and a substrate surface during a specific chemical reaction. During the CMP process, polishing pad conditioning is applied to prevent the rapid degradation of the polishing quality caused by polishing pad glazing through repeated material removal processes. However, during the conditioning process, uneven wear on the polishing pad is inevitable because the disk on which diamond particles are electrodeposited is used. Therefore, the abrasion of the polishing pad should be considered not only for the variables during the conditioning process but also when designing the CMP conditioning system. In this study, three design variables of the conditioning system were analyzed, and the effect on the pad wear profile during conditioning was investigated. The three design variables considered in this study were the length of the conditioner arm, diameter of the conditioner disk, and distance between centers. The Taguchi method was used for the experimental design. The effect of the three design variables on pad wear and uniformity was assessed, and new variables used in conditioning system design were proposed.