2P-541 Electromagnetic Interference Shielding Characteristics of Electroless Nickel Plated Carbon Nano fibers

공은영,김도영,이경민,이영석 한국공업화학회 2017 한국공업화학회 연구논문 초록집 Vol.2017 No.1

To improve electromagnetic interference shielding effectiveness (EMI-SE) of carbon nano fibers (CNF), CNF was deposited with nickel by electroless plating method. Plating time was given as a variable. The samples were named Raw, N1, N3, N5, N7. The surfaces of nickel plated carbon nano fibers were characterized by using ultra-high resolution scanning electron microscope (UHR-SEM). Also the thermal properties were analyzed by thermogravimetry (TGA), the electric properties were tested by sheet resistance analyzer and EMI shielding analyzer. As the result, nickel plated CNF has more high EMI-SE than the Raw-CNF. It is attributed to the Ni plating time and plating morphology. The electromagnetic shielding effectiveness (EMI-SE) of the carbon nano fibers enhanced with increased Ni plating time. But the N5 has high EMI-SE than the N7. Therefore, the uniformity of plating morphology on the surface has more effect on EMI shielding efficiency than the amount of nickel plating.

The effect of bath conditions on the electroless nickel plating on the porous carbon substrate

So-Young Cheon,So-Yeon Park,Young-Mok Rhym,Doo-Hyun Kim,Jae-Ho Lee 한국물리학회 2011 Current Applied Physics Vol.11 No.3

Electroless nickel plating is widely used technique in industries. In most cases, electroless nickel plating was applied on the open surfaces and the rate of deposition was controlled with temperature and time. However, when the electroless plating is applied on the porous carbon, the rate of deposition is also dependent on the activation process. In this research, electroless nickel plating on the porous carbon was investigated. The porous carbon was selected as the substrate. The pore sizes of carbon substrates were 16―20 mm and over 20 mm. Since hydrophobic surface prevented the penetration of solution into porous carbon, the carbon surface changed from hydrophobic to hydrophilic after immersing the substrate in an ammonia solution at 60 ℃. The alkaline bath and acidic bath were used in electroless nickel plating. The pHs were 9―11 in alkaline bath and 4―5 in acidic bath. The content of phosphorous in nickel deposit was higher in acidic bath than that in alkaline bath. As increasing pH in each bath conditions, the content of phosphorous in nickel deposit was decreased. The rate of electroless plating in alkaline bath was faster than that in acidic bath. The minimum concentration of PdCl_2 for the electroless nickel plating was 10 ppm in acidic bath and 5 ppm in alkaline bath. The thickness of nickel was not significantly affected by the concentration PdCl_2.

Application of electroless plating process for multiscale Ni-La_0.8Sr_0.2Ga_0.8Mg_0.2O_3-σ SOFC anode fabrication

Kang, Juhyun,Lee, Kunho,Yoo, Jae Young,Bae, Joongmyeon Elsevier 2018 International journal of hydrogen energy Vol.43 No.12

<P><B>Abstract</B></P> <P>An electroless plating process of nickel is introduced to solve the drawbacks of impregnation for developing the multiscale anode of a solid oxide fuel cell (SOFC). Impregnation is the conventional fabrication method of the electrode. The process is not favorable for depositing nanoscale metal catalysts due to severe problems including agglomeration of the catalysts while reducing metal oxides. Thus, as an alternative, we propose electroless plating of nickel to fabricate a multiscale nickel-based SOFC anode. A Ni-LSGM (La<SUB>0.8</SUB>Sr<SUB>0.2</SUB>Ga<SUB>0.8</SUB>Mg<SUB>0.2</SUB>O<SUB>3-σ</SUB>) anode is selected. The low chemical compatibility of LSGM with nickel emphasizes the advantage of the electroless plating process. First, nanoscale nickel particles are successfully applied as the main catalyst of the SOFC anode by plating nickel to the surface of the LSGM scaffold substrate near the triple phase boundary region. Thin film X-ray diffraction and image analysis confirm that pure nanoscale nickel particles form on the entire substrate, even at a low temperature (60 °C) without secondary phase formation. Electrochemical impedance spectroscopy analysis is then performed to verify the possibility of implementing an efficient Ni-LSGM anode through nickel electroless plating. As a result, the new Ni-LSGM anode shows ∼50 times higher electrochemical performance than that of an impregnated Ni-LSGM anode.</P> <P><B>Highlights</B></P> <P> <UL> <LI> A novel electroless plating process was introduced to replace impregnation. </LI> <LI> Pure crystalline nickel was plated on a microporous LSGM scaffold structure. </LI> <LI> Electroless plated anode shows ∼50 times higher performance than an impregnated anode. </LI> </UL> </P>

무전해 니켈 도금된 탄소나노튜브의 전자파 차폐 특성

김도영 ( Do Young Kim ),윤국진 ( Kug Jin Yun ),이영석 ( Young Seak Lee ) 한국공업화학회 2014 공업화학 Vol.25 No.3

In this study, multi-walled carbon nanotubes (MWCNT) were treated with nickel by electroless plating method for improvingelectromagnetic interference (EMI) shielding performance of MWCNT. The physical properties of electroless plated MWCNTwere analyzed by using ultra-high resolution scanning electron microscope (UHR-SEM), thermogravimetry (TGA), sheet resistanceanalyzer and EMI shielding analyzer. EMI shielding efficiencies of nickel electroless plated MWCNT were measured to be16 dB from 800 MHz band, which was 1.6 times increased compared to that of the activated MWCNT. Also, the averagesheet resistance of nickel electroless plated MWCNT was measured to be 70 Ω/sq, which was 56% decreased compared tothat of the activated MWCNT. This result could be attributed to the plating morphology on the surface of MWCNT. Thisresult could be attributed to uniformity of plating morphology on the surface, which has more effect on EMI shielding efficiencythan the amount of nickel plating.

결정질 실리콘 태양전지에 적용될 Light-induced plating을 이용한 Ni/Cu 전극에 관한 연구

김민정(Kim Min-Jeong),이수홍(Lee Soo-Hong) 한국태양에너지학회 2009 한국태양에너지학회 학술대회논문집 Vol.2009 No.11월

The crysralline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more high efficiency and low cost endeavors many crystalline solar cells. The fabricaion process of high efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/AG contact, This metal contacts have only been used in limited areas in spite of their good srability and low contact resistance because of expensive materials and process. Commercial solar cells with screen-printed solar cells formed by using Ag paste suffer from loe fill factor and high contact resistance and low aspect ratio. Ni and Cu metal contacts have been formed by using electroless plating and light-induced electro plating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on 0.2~0.6 Ωㆍ㎝, 20 × 20 ㎟, CZ(Czochralski) wafer.

Nickel Silicide for Ni/Cu Contact Mono-Silicon Solar Cells

민선규,김동호,이수홍 대한금속·재료학회 2013 ELECTRONIC MATERIALS LETTERS Vol.9 No.4

A solar cell contact needs to be as thin as possible and have high conductivity since a thick contact causes shading loss and reduced current. Plating is a very suitable method for making a metal contact, and nickel is a high conductivity metal which is easy to form into a contact using electroless plating. After the nickel is plated on the silicon substrate, the nickel contact should be fired in order to form nickel silicide. Nickel silicide is used for the seed layer of the Cu contact for silicon solar cells. In this study, we replaced the screen-printed contact of the Passivated Emitter Solar Cell (PESC) with a Ni/Cu contact that has a selective emitter. The nickel layer was used as the seed layer, adhesion layer, and Cu diffusion barrier. The main contact was formed by plating the copper. The firing conditions of a conventional furnace were varied in order to form nickel silicide. Consequently, we achieved the best solar cell efficiency of 18.15%.

Analysis of Ni/Cu Metallization to Investigate an Adhesive Front Contact for Crystalline-Silicon Solar Cells

이상희,이수홍,Atteq ur Rehman,신은구,이동원 한국광학회 2015 Current Optics and Photonics Vol.19 No.3

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries,to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the costof solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electrolessplating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel depositionprocess, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In thesubsequent step, a nickel sintering process was carried out in N2 gas atmosphere; however, copper wasplated by light-induced plating (LIP). Plated nickel has different properties under different bath conditionsbecause nickel electroless plating is a completely chemical process. In this paper, plating bath conditionssuch as pH and temperature were varied, and the metal layer's structure was analyzed to investigate theadhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achievedfor samples with no nickel sintering process

Synthesis of monodisperse nickel-coated polymer particles by electroless plating method utilizing functional polymeric ligands

Jun, Jung-Bae,Seo, Min-Su,Cho, Seong-Heun,Park, Jin-Gyu,Ryu, Jee-Hyun,Suh, Kyung-Do Wiley Subscription Services, Inc., A Wiley Company 2006 Journal of applied polymer science Vol.100 No.5

<P>In the electroless plating process, to omit a sensitizing process with SnCl<SUB>2</SUB>, we utilized amino-functional groups on polymer particles. At first, highly monodisperse functional polymer particles could be prepared by a two-step seeded polymerization of styrene, divinylbenzene, and glycidyl methacrylate. Then, surface epoxy-functional groups were converted to amino-functional groups by treating the particles with a diamine. By using these surface amino functionalities, we tried to prepare uniformly metal-coated monodisperse polymer particles by electroless plating method. The constituents of an electroless nickel solution bath are nickel salt, a reducing agent, suitable complexing agents, and stabilizers. And the metal thickness was simply controlled by changing the loading amount of substrate polymer particles. Morphological observation of nickel-plated polymer particles was conducted by using optical microscopy, scanning electron microscopy, and transmission electron microscopy. The structural composition of plated nickel was also investigated. Most of all, the function and the efficiency of the amino-functional group of polymer particles as a polymeric ligand for metal binding was elucidated. From all observations, it was evident that in the electroless metal plating process without any sensitization step, the deposition of metal clusters on substrate particles is largely dependent upon the particle surface functionality. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 3801–3808, 2006</P>

Preparation and characterization of nickel plated basalt fiber/epoxy composites

김익규,박수진 한국공업화학회 2018 한국공업화학회 연구논문 초록집 Vol.2018 No.0

In this works, nickel plated basalt fiber/epoxy composites were fabricated. Basalt fibers were treated by acid and electroless nickel plating was applied on the treated basalt fiber. Mechanical properties, thermal properties and surface free energy of the prepared composites were investigated according to plating time. The plating time controlled thickness of nickel on threated basalt fiber. FT-IR and XPS were used to invest effects of acid treatment and electroless nickel plating. The fracture toughness was calculated by the critical stress intensity factor (KIC). The morphology was observed by scanning electron microscope (SEM). A thermal weight analyzer (TGA) was used to invest thermal stability. Surface free energy was measured using contact angle measurement of three liquid droplets. The results show that nickel plating on basalt fibers affects mechanical properties of basalt fiber/epoxy composites.

Effect of nickel-plated on thermal and mechanical properties of basalt fiber-reinforced composites

김성황,박수진 한국공업화학회 2019 한국공업화학회 연구논문 초록집 Vol.2019 No.0

This study, nickel plated basalt fiber-reinforced epoxy composites were fabricated. Basalt fibers were treated by acid and electroless nickel plating was applied on the treated basalt fibers. Thermal and mechanical properties of the prepared basalt fiber-reinforced epoxy composites were investigated according to plating time. The plating time controlled thickness of nickel on treating basalt fibers. FT-IR and XPS were used to invest effects of acid treatment and electroless nickel plating. The fracture toughness was calculated by the critical stress intensity factor (KIC). The morphology was observed by scanning electron microscope (SEM). A thermal weight analyzer (TGA) was used to invest thermal stability. The results show that nickel plating on basalt fibers affects thermal and mechanical properties of basalt fiber-reinforced epoxy composites.