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      • KCI등재

        Subject positions embodied in military uniform and its influences on modern fashion design

        Huiqin Zhang,Junmin Wu 복식문화학회 2016 服飾文化硏究 Vol.24 No.3

        As a solemn and serious uniform, military uniform can be differentiated easily from any other clothing in the aspects of color, material and style. Inspired by military uniform, fashion designers have been applying military uniform elements into modern fashion design in recent years, which helps to bring military uniform from the trench onto international fashion runway. The primary method of this research is theory analysis method and exampling study method. Based on the collected materials of modern military uniform, this paper takes the fashion and cultural study theory of the famous American scholar Susan B. Kaiser as the leading theory to analyze four subject positions embodied in military uniform, including nation, rank, gender and time and space. By analyzing the subject positions embodied in military uniform, it shows the rich cultural connotation of military uniform and the function of various small details. Meanwhile, by giving specific examples, this paper explores the influences of military uniform on modern fashion design in respect to color, style, material, pattern and accessory. Through the conduct of this research, it comes to the conclusion that military uniform also has the characteristics and properties described in the fashion and cultural theory of Susan B. Kaiser, in addition, designers can be inspired by every specific object around them, which shows the talents of designers.

      • KCI등재

        Fabrication of Ag/In2O3/TiO2/HNTs hybrid-structured and plasma effect photocatalysts for enhanced charges transfer and photocatalytic activity

        Huiqin Wang,Dongyao Wu,Chongyang Liu,Jingru Guan,Jinze Li,Pengwei Huo,XINLIN LIU,Qian Wang,Yongsheng Yan 한국공업화학회 2018 Journal of Industrial and Engineering Chemistry Vol.67 No.-

        The purpose of this work designed hybrid-structured and plasma effect photocatalyst of Ag/In2O3/TiO2/HNTs via sol–gel and photo-reduction methods. The structures, morphologies, optical and photoelectric performances of as-prepared photocatalysts were characterized via XRD, TEM, XPS, BET, UV–vis DRS, PL and photocurrents. The photocatalytic activity was evaluated by degradation of TC. The results showed that the hybrid-structure and plasma effect can effectively cause the multi-transfer of electrons and increase the separation rate of electron and hole pairs which obtained high photocatalytic activity. The photocatalytic degradation processes reveal that O2− and h+ are major active species.

      • KCI등재

        Subject positions embodied in military uniform and its influences on modern fashion design

        Zhang, Huiqin,Wu, Junmin The Costume Culture Association 2016 服飾文化硏究 Vol.24 No.3

        As a solemn and serious uniform, military uniform can be differentiated easily from any other clothing in the aspects of color, material and style. Inspired by military uniform, fashion designers have been applying military uniform elements into modern fashion design in recent years, which helps to bring military uniform from the trench onto international fashion runway. The primary method of this research is theory analysis method and exampling study method. Based on the collected materials of modern military uniform, this paper takes the fashion and cultural study theory of the famous American scholar Susan B. Kaiser as the leading theory to analyze four subject positions embodied in military uniform, including nation, rank, gender and time and space. By analyzing the subject positions embodied in military uniform, it shows the rich cultural connotation of military uniform and the function of various small details. Meanwhile, by giving specific examples, this paper explores the influences of military uniform on modern fashion design in respect to color, style, material, pattern and accessory. Through the conduct of this research, it comes to the conclusion that military uniform also has the characteristics and properties described in the fashion and cultural theory of Susan B. Kaiser, in addition, designers can be inspired by every specific object around them, which shows the talents of designers.

      • KCI등재

        Redeposition mechanism on silicon oxide layers during selective etching process in 3D NAND manufacture

        Zihan Zhou,Yunwen Wu,Huiqin Ling,Jie Guo,Su Wang,Ming Li 한국공업화학회 2023 Journal of Industrial and Engineering Chemistry Vol.119 No.-

        3D NAND flash memory with vertically stacked cells has been developed to break through the limits oftechnology nodes. However, during the selective etching process, it is difficult to ensure the byproductsdiffuse away from the trenches in the multistacked layers. Once saturated, the byproduct causes abnormalredeposition on the SiO2 layers. This problem has restricted the development of high-density 3DNAND memory. To solve this problem, the composition and formation mechanism of the redepositedlayer must be clarified. In this study, a ternary-wafer system comprising a Si3N4/SiO2/Si3N4 stack was fabricatedto study the redeposition mechanism, and the morphology, elastic properties, and chemical compositionof the redeposited layer were clarified. The redeposited layer consists of spherical particles withelastic surfaces (average Young’s modulus of 24.17 GPa). The particles were confirmed to comprise colloidalsilica gel covered by silanols. By considering the chemistry of silica, the redeposition mechanismwas proposed as follows: colloidal silica gel is formed by the aggregation of silicic acids from Si3N4 etching,which adsorb onto the SiO2 layer through oxide bridges and hydrogen bonding. Our work will contributeto the development of high-density 3D NAND memory.

      • KCI등재

        Experimental Research of Axial Compression Bearing Capacity on RC Columns Strengthened with Angle Steel and Self-Compacting Concrete

        Qiang Hu,Songlin Jia,Huiqin Wu,Tongkuai Wang 한국강구조학회 2022 International Journal of Steel Structures Vol.22 No.1

        An improved reinforced method used for concrete columns strengthened with angle steel and self-compacting concrete is proposed. Static loading experiments for sixteen specimens were carried out to study the infl uences of angle steels and batten plates spacing on axial compression bearing capacity of the concrete columns reinforced by the proposed method. The results show that axial compression bearing capacity increases signifi cantly; angle steels and concrete column can be eff ectively united to resist the loads from superstructure because of self-compacting concrete; the increase of area of angle steel and the decrease of batten plates spacing can eff ectively increase axial compression bearing capacity of the reinforced columns.

      • KCI등재

        Liner sweep voltammetry electroplating method to synthesize large monocrystalline Cu cones for interconnection

        Hua Hu,Ruoxun Zhang,Yunwen Wu,Huiqin Ling,Tao Hang,Ming Li 대한금속·재료학회 2022 ELECTRONIC MATERIALS LETTERS Vol.18 No.1

        As the size of interconnect technology in integrated circuits keeps minimizing, the electrical resistivity and signal transmission delay become increasingly serious. The monocrystalline materials can meet the requirements of miniaturization and high-speed interconnection, which is a proper solution of these problems. Hence, we fabricated large monocrystalline Cu cones with (111) orientation using a linear sweep voltammetry electroplating method for the first time. It was found that phosphorus could induce texturization of polycrystals at a certain potential. The grains with uniform orientation grown into single crystals through the oriented attachment growth mechanism. The screw dislocations produced during oriented attachment led to crystal spiral growth, developing into large monocrystalline cones. This work is expected for application in copper interconnect technology in the future.

      • KCI등재

        Study on Preparation of Core-Spun Yarn Surgical Sutures by Compositing Drug-Loaded Nanofiber Membrane with PLA and Its Controllable Drug Release Performance

        Zhichao Yang,Shuqiang Liu,Jingjing Li,Gaihong Wu,Man Zhang,Fu Li,Lu Jia,Yujing Zhang,Huimin Li,Xia Liu,Jingjing Zhao,Huiqin Zhang,Shiyu Li 한국섬유공학회 2023 Fibers and polymers Vol.24 No.12

        Polylactic acid (PLA) surgical suture is considered to be one of the most ideal materials for tissue closure due to its rich raw materials and excellent biological properties. However, surgical sutures face great challenges due to problems such as wound infection and tissue reaction in practical applications. In order to improve the clinical applicability of surgical sutures, we constructed a new drug-loading system for core-spun surgical sutures. The shell was composed of nanofibrous membranes composed of polyglycolic acid (PGA) and polycaprolactone (PCL) and ciprofloxacin (CIP) antibacterial drugs, and the core layer adopts PLA filament. By adjusting the composition ratio of PGA and PCL in the shell, a new mode of regulating the release rate and release cycle of the suture was constructed. According to different wound healing time, different drug release cycles of surgical suture were selected. In the study, the structure of the core-spun yarn can be clearly observed by scanning electron microscope, the higher the shell PGA content and drug loading, the faster the drug release rate. When the carrier ratio PGA/PCL was 80/20 and the drug loading was 3%, the drug release rate was the fastest and the drug release was high; finally, antibacterial experiments showed that the suture had excellent antibacterial effect and could effectively kill Staphylococcus aureus and Escherichia coli. The successful preparation of core-spun yarn surgical suture provides a new idea for the study of new antibacterial surgical suture.

      • KCI등재

        Fabricated Ag/Ag2S/reduced graphene oxide composite photocatalysts for enhancing visible light photocatalytic and antibacterial activity

        Pengwei Huo,Chongyang Liu,Dongyao Wu,Jingru Guan,Jinze Li,Huiqin Wang,Qi Tang,Xiuying Li,Yongsheng Yan,Shouqi Yuan 한국공업화학회 2018 Journal of Industrial and Engineering Chemistry Vol.57 No.-

        In this work, we reported one kind of photocatalytic and antibacterial materials, Ag/Ag2S/reducedgraphene oxide (rGO), which prepared by the hydrothermal and UV-light-assisted reduction methods. The Ag2S nanoparticals were well dispersed on the surface of rGO as revealed by series ofcharacterization. The obtained Ag/Ag2S/rGO photocatalyst showed excellent photocatalytic degradationefficiency of 87.6% for ciprofloxacin (CIP) under visible light irradiation and outstanding antibacterialactivity for Escherichia coli (E. coli) which reached to 97.76% in 24 h. The trapping of active species showedthat the hydroxyl radicals, holes and superoxide radicals played important roles in the photocatalyticdegradation of CIP processes.

      • KCI등재

        The evolution of microstructure and resistance in electroplated copper films by linear integrated laser scanning annealing

        Lingyue Tan,Silin Han,Shuhui Chen,Tao Hang,Huiqin Ling,Yunwen Wu,Ming Li 대한금속·재료학회 2021 ELECTRONIC MATERIALS LETTERS Vol.17 No.2

        Thermal treatment is an effective way to decrease the resistivity and internal stress by inducing grain growth accompaniedwith redistribution of embedded impurities. With the narrowing of Cu interconnects in IC packaging, the increased resistanceis becoming the main issue that hindering the electrical performance of IC. Herein, a laser annealing method by linerscanning (LALS) to anneal the Cu interconnects were reported which provide a gradient thermal field for the crystallographic/microstructure transition. The impacts of laser annealing on the sheet resistance of the electroplating Cu films wereinvestigated in aspects of microstructure and phase field simulation. Cu films treated by LALS owned larger average grainsize, better recrystallization fraction, and significantly higher average grain aspect ratio than conventional annealing, whichindicated the increased driving force for grain boundaries evolution by LALS method. This study exhibited the direct evidenceon the impacts of laser annealing process on the resistance of electroplated Cu films. The laser annealing process witha local temperature gradient caused a significant decline in Cu electrical resistance compared to the conventional annealingprocess, indicating its extraordinary potential in improving Cu wire conductivity. This work will provide a scientific basis forselecting the post-treatment process for electrodeposited Cu films to achieve ideal electrical properties and microstructurein electronics industry applications.

      • KCI등재

        Low-temperature insertion bonding using electroless Cu-Co-P micro-cones array with controllable morphology

        Yaqian Sun,Jing Wang,Xundi Zhang,Chenlin Yang,Anmin Hu,Tao Hang,Yunwen Wu,Huiqin Ling,Ming Li 대한금속·재료학회 2021 ELECTRONIC MATERIALS LETTERS Vol.17 No.6

        At present, thermal compression bonding based on Cu and lead-free Sn based solder is often limited by high bonding temperature,which is higher than the melting point of solder (218 ℃). In this paper, we reported a low-temperature solid stateinsertion bonding method based on electroless Cu-Co-P micro-cones array. By adjusting the mass ratio of CuSO 4 ·5H 2 O andCoSO 4 ·7H 2 O, a series of Cu-Co-P micro-cones with diff erent morphologies were prepared. The Cu-Co-P micro-cones withhigher proportion of copper were sharper and denser and (111) orientation was also more. It was found that reducing theheight and density of micro-cones was conducive to achieve seamless bonding at lower temperature and force such as 170℃ and 750 gf. By optimizing the morphology of micro-cones, such as height, bottom diameter, vertex angle and density, theseamless and reliable bonding with high shear strength (39.9 MPa) could be achieved at 170 ℃ bonding temperature and1000 gf bonding force. The transmission electron microscopy results showed that intermetallic compounds including Cu 6 Sn 5and Cu 3 Sn existed at bonding interface, which indicated that signifi cant atomic diff usion had occurred between Cu-Co-Pmicro-cones and Sn based solder. Probable mechanisms for low-temperature insertion bonding were discussed.

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