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A Study on Heat Dissipation Materials based on Crosslinked Polyimide/h-BN Composite
김담비,정찬문,이승현,최윤제 한국고분자학회 2021 한국고분자학회 학술대회 연구논문 초록집 Vol.46 No.2
Polyimide (PI) is an engineering plastic that is widely used in various devices owing to its good mechanical properties, excellent thermal stability, flexibility, chemical resistance and low dielectric permittivity. Recently, owing to the demands in denser and faster circuits in electronic devices, the dissipation of heat generated in electronic components has attracted more attention and is considered as a critical issue to be resolved. In this study, crosslinked PI was synthesized through PI containing DABA (3,5-diaminobenzoic acid) group. And a boron nitride-based crosslinked polyimide (PI-BN) nanocomposite was prepared as heat dissipation materials. Chemical crosslinking of PI may provide feasible routes for the improvement of the mechanical and thermal properties. The thermal conductivity and tensile strength according to the crosslinking density of PI and the content of BN were evaluated.
Preparation of Polyimide Powder via Hydrothermal Polymerization for Compression Molding Application
진승원,최윤제,김담비,윤강훈,정찬문 한국고분자학회 2021 한국고분자학회 학술대회 연구논문 초록집 Vol.46 No.2
Polyimides (PIs) have been receiving attention as high-performance materials because of their outstanding thermal and mechanical performance, and chemical resistance based on rigid imide structure. In addition, PI powder can be used in manufacturing lightweight molding parts where precision, thermal, and dimensional stability are critical such as bearing and sealing parts. However, general synthesis methods of PIs are employing high-boiling and toxic solvents such as dimethylformamide (DMF), N,N-dimethylacetamide (DMAc), and N-methyl-2-pyrrolidone (NMP), which are hazardous to the environment. Moreover, these organic solvents lead to high production costs. In this study, we developed a green synthesis method to synthesize PI powder via hydrothermal polymerization. In addition, thermal and mechanical properties of compression-molded specimens prepared with PI powder were investigated for their application to compression molding.
강동옥,김보성,김담비,서정현,안재형,이병용,이주영 한국감성과학회 2017 춘계학술대회 Vol.2017 No.-
본 연구는 대학생들의 내현적자기애와 스마트폰 중독과의 관계를 살펴보고자 수행되었다. 이를 위해 내현적자기애 질문지와 스마트폰 중독 질문지를 활용하여 이들의 내현적자기애와 스마트폰 중독을 측정하였다, 그 결과, 내현적자기애는 스마트폰 중독과 유의미한 정적 상관관계를 보이는것으로 나타났다. 세부적으로는 내현적자기애의 전체 요인 중 과민/취약성, 착취/자기중심성이 스마트폰 중독과 상관도가 높다는 것으로 나타났다. 이는 스마트폰 중독의 변화가 내현적자기애와도 연관되어 있음을 의미하는 것이다. 또한 스마트폰 중독 전체 요인 중 갈등, 기분전환, 재발이 내현적 자기애와 가장 유의미한 정적 상관관계를 보였다. 이러한 결과는 자신의 중독 상태를 확인하고 조절하는 과정에 있어 내현적자기애가 중요시되기에 내현적자기애의 수준이 높을수록 스마트폰 중독 경향성도 높아지는 것으로 해석할 수 있다. 따라서 내현적자기애 수준이 높은 사람들은 중독에 대한 사전 개입이 필요함을 시사한다고 볼 수 있다.
최윤제,정찬문,고주희,진승원,김담비,윤강훈 한국고분자학회 2021 한국고분자학회 학술대회 연구논문 초록집 Vol.46 No.2
As solar power generation increases in recent years, self-cleaning has become important because dust and dirt reduce the efficiency of solar power generation. The self-cleaning action of superhydrophobic coatings results from high contact angles of water; these surface forms spherical water droplets that can easily roll and carry dirt and dust. Colorless polyimides (CP) have been widely utilized as packaging material for the electronic industry because of their mechanical strength, as well as weather resistance. In this study, the colorless polyimide has made self-cleaning property by modifying superhydrophobic surface via the silica sol-gel method. Self-cleaning CP films were prepared by superhydrophobic surfaces using roughness of the silica. The characteristics of self-cleaning CP films, including their morphology, optical, and self-cleaning properties, were investigated.