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조수제,안다훈,정안목,이학준 한국생산제조학회 2022 한국생산제조학회지 Vol.31 No.6
Recent, manufacturing industry has demand that a robot milling system with higher DOF than CNC milling due to an increase in demand for processing complex and flexible shapes. However, a disadvantage of low surface quality exists owing to vibrations caused by the low rigidity of the robot. The main reason for the low surface quality of a target workpiece is the resonant frequency of the robot occurring below 200 Hz . To overcome this problem, we developed a 2-DOF position compensation stage that has high dynamics. In this study, the stage of parallel kinematics using an L-shaped flexible hinge was presented and optimized for rigidity higher than that of the serial kinematics structure. The optimally designed stage through the crab-leg structure was designed with high stiffness with a moving range of 26.1 μm and natural frequency of 513.54 Hz.
박성수,조수제 釜山大學校生産技術硏究所 1999 生産技術硏究所論文集 Vol.56 No.-
본 연구에서는 복철근보의 부착할렬파괴에 대해 실험적으로 조사하였다. 실험에 사용된 시험체의 단면 형상과 치수는 서로 동일하며, 전단보강근비가 0.0%, 0.86%, 1.30%인 시험체와 동일한 전단보강근비(0.86%, 1.30%)에서 보조 전단보강근을 배근한 시험체로 계획하였다. 실험결과를 기존의 부착할렬강도에 대한 실험식 및 일본건축학회규준(AIJ)식과 비교분석하였으며, 그 결과는 다음과 같다. 1)본 실험에 사용된 1단과 2단의 주근개수가 동일한 복철근보에서 부착할렬파괴는 2단근 위치에서 발생하였다. 2)1단근의 부착할렬강도는 기존의 실험식과 근접하였으마, 2단근의 부착할렬강도는 콘크리트가 부담하는 부착할렬강도보다 낮게 나타났다. 3)전단보강근비가 동일한 경우, 보조 저단보강근이 배근된 시험체는 내근의 부착할렬강도가 상승하였으나, 보조 전단보강근을 배근하지 않은 시험체보다 부착파괴내력이 저하하였다. In this research, investigate experimentally the bond splitting failure of doubly reinforced concrete beams. The types of reinforced concrete beams for testing were designed differently on the transverse reinforcement ratio(0.0%, 0.86%, 1.30%) and existence of the subsidiary transverse reinforcement in same ratio(0.86%, 1.30%) and all sections of these are the same. The results of testing are analyzed and compared with the results from the experimental formula by the previous researchers and AIJ code for bond splitting strength. The results of testing are as follows: 1)From testing results, bond splitting failure in doubly reinforced concrete beams with the same number of main bars in first and second layer occurred in second-layer bars. 2)Bond splitting strength of first-layer bars were alike with the experimental formula by the previous researchers, but bond splitting strength of second-layer bars were lower then bond splitting strength of concrete. 3) In the same transverse reinforcement ratio, specimens with subsidiary transverse reinforcement were effective on the rise of bond splitting strength of inner bars, but appeared lower ultimate bond failure capacity then beams don't have subsidiary transverse reinforcement.
2단 주근의 본 수에 따른 철근 콘크리트 보의 부착할렬 거동
조수제,박성수 釜山大學校 都市問題硏究所 1999 都市硏究報 Vol.8 No.-
Many experimental research have shown that the bond splitting failure is affected by many factors such as concrete strength, transverse reinforcement, arrangement of main bar, loading style. The aims of this paper is to clarify the bond splitting failure layer and bond splitting strength of first layer and second layer bar in double reinforced concrete beams. The variables applied to experiment are bar arrangement(the number of second layer bars) and load condition(cycle loading and monotonic loading). This paper show that the bond splitting failure mode, relationships of shear force to displacement of member, bond splitting strength of bars, and comparison with previous researcher's experimental formula and AIJ code.
조수제(Sooje Cho) 한국레이저가공학회 2011 한국레이저가공학회지 Vol.14 No.1
Micromachining of photosensitive glass by UV exposure, heat treatment, and etching processes is reported. Like photoresist, the photosensitive glass is also classified into positive and negative types by development characteristics. For the positive type, the exposed area is crystallized and etched away during the etching process in HF solution, whereas the unexposed area is crystallized and etched away for the negative type. The crystallized area of the photosensitive glass has an etch rate approximately 30~100 times faster than that of the amorphous area so that it becomes possible to fabricate microstructures in the glass. Based on the unique properties of glass such as high optical transparency, electrical insulation, and chemical/thermal stability, the glass micromachining technique introduced in this work could be widely applied to various devices in the fields of electronics, bio engineering, nanoelectonics and so on.