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김호진(Ho-Jin Kim),이선현(Seon-Hyeon Lee),이영훈(Young-Hun Lee),이상석(Sang-Seok Lee) 한국전자파학회 2011 한국전자파학회논문지 Vol.22 No.9
본 논문에서는 Flexible-PCB에 제작된 안테나를 구부렸을 때의 특성 변화를 살펴보았다. Polyimide로 이루어진 Flexible-PCB는 유전율 3.5, 두께 0.125 mm를 가진다. 제안된 안테나는 Bluetooth 대역을 만족하는 기본적인 장방형 루프 안테나와 입력부에 Inverted-L 형태의 스터브를 추가한 안테나이다. 제안된 두 가지 안테나 모델에 대하여 8가지 조건의 bending 변화를 통해 bending 정도에 따른 입력 정합 특성과 방사 형태를 비교하였다. In this paper, we studied characteristics of the bent antenna febricated on Flexible-PCB. Flexible-PCB consisting of a polyimide has dielectric constant 3.5, thickness 0.125 mm. Proposed antennas which operates at Bluetooth band are a rectangular loop antenna and a loop antenna with inverted-L type stub. We compared the input matching and radiation characteristics of the proposed antennas under eight kinds of bending conditions.
연성 광 PCB용 광 배선의 손실특성 및 제작 공차 분석
염준철,박대서,김영석,김대찬,박세근,오범환,이일항,이승걸,전금수,Yeom, Jun-Cheol,Park, Dae-Seo,Kim, Young-Seok,Kim, Dae-Chan,Park, Se-Geun,O, Beom-Hoan,Lee, El-Hang,Lee, Seung-Gol,Jeon, Keum-Soo 한국광학회 2008 한국광학회지 Vol.19 No.4
광 백 플레인이나 광 연결용으로 활용될 수 있는 연성 광 PCB의 핵심 요소인 광 배선(도파로)의 전파 특성을 분석하였으며, 광배선 제작 공정에서 발생할 수 있는 구조적 오차로 인한 전파 손실 발생 문제를 다루었다.제작 공차 분석을 통해 전파 손실을 -1 dB/mm 이하로 유지하기 위해서는 광 배선 측벽 각도가 $1^{\circ}$ 이내로 제어되어야 하며, 결합 손실과 구부러짐 손실을 각각 -1 dB 이하로 유지하기 위해서는 광원과 광 배선 간격은 $160\;{\mu}m$ 이내, 횡방향 정렬 오차는 ${\pm}15\;{\mu}m$ 이내, 광원 각도는 $6^{\circ}$ 이하로 정렬되어야 하며, 광 배선의 구부러짐 반경은 5 mm 이상이 되어야 함을 알 수 있었다. In this study, the propagation characteristics and the fabrication tolerance of an optical wire in a flexible optical PCB were analyzed by using a ray-tracing method. It is found from the analysis that the sidewall angle of a core should be controlled within $1^{\circ}$ in order to maintain the propagation loss to less than -1 dB/mm, and that the bending radius of the optical wire should be larger than 5 mm in order to suppress the bending loss below -1 dB. In addition, it is confirmed that the lateral misalignment of ${\pm}15\;{\mu}m$, and the angular tilting of VCSEL of $6^{\circ}$ are allowable for the coupling loss of -1 dB.
레이저 변위센서를 이용한 얇은 연성 PCB 판의 오프라인 오차 보상을 위한 3 차원 지도 작성
김호상(H. S. Kim),이찬희(C. H. Lee),이기봉(K. B. Lee) Korean Society for Precision Engineering 2021 한국정밀공학회 학술발표대회 논문집 Vol.2021 No.11월
웨어러블 디바이스 및 사물인터넷에 대한 소비자 수요가 증가함에 따라 전자부품 업계는 고밀도, 박막화, 유연화의 추세로 발전되고 있으며 이를 구현하기 위한 핵심부품의 제조방법에 대한 연구가 꾸준히 늘고 있다. 특히, 연성 PCB 의 경우 웨어러블 디바이스의 핵심적인 역할을 수행하고 있으며 그 제조방법으로서 레이저를 이용한 정밀가공기와 형상을 측정할 수 있는 3 차원 형상측정기에 대한 연구가 꾸준히 증가하고 있는 실정이다. 그러나 이러한 얇은 연성 PCB와 같은 부품의 경우 쉽게 휠 수 있으며 고정 지그에 의한 영향이 매우 크게 나타나는 특징이 있어 레이저 가공과 같은 정밀도가 높은 가공법을 적용하기 위해 부가적인 오차보상방법을 통해 정밀도를 확보하는 방법이 꾸준히 연구되고 있다. 본 연구에서는 이러한 연성 PCB 의 제작 시 레이저 가공에 필요한 편평도를 확보하기 위해 레이저 변위센서를 이용하여 오프라인 오차보상법을 제안하고 관련 성능시험을 수행하였다. 관련 성능시험 결과 연성 PCB의 3 차원 높이 지도를 얻을 수 있었으며 이러한 데이터를 이용하여 레이저 가공을 위한 오프라인 보상 방법을 제안하였다. 이러한 연구들 통해 얻어진 데이터들은 향후 연료전지용 분리판과 같은 얇은 두께의 금속판의 레이저 용접 등을 위한 보상 방법에 적용될 수 있으며 PC 기반의 UMAC 과 같은 모션제어기에 적용될 수 있을 것이다.
Periodic Ground Structure for C-PHY Signaling in Mobile Applications
TaeWoong Kim,YoungBong Han,Hung Khac Le,JongWan Shim,KwangMo Yang,BumHee Bae,SoYoung Kim 대한전자공학회 2021 Journal of semiconductor technology and science Vol.21 No.5
In this paper, we propose periodic slit ground structure (PSG) to improve the signal integrity of multilevel signals at high data rate such as MIPI C-PHY. Periodic slits are added in the upper and lower ground planes of the stripline structure, without adding additional layers or increasing area, to reduce crosstalk among neighboring lines. The proposed PSG structure can effectively improve the eye-diagram, especially eye height (EH) in multilevel signaling. The effectiveness of the proposed structure is validated through simulation and measurement of PCB-flexible printed circuit board (FPCB)-PCB structure that emulates the interconnected system of MIPI C-PHY signal transmission in a mobile system. The measurements from the test structures show that at a 2.5 Gsps data rate condition, the PSG structures show improvement in EH and eye width (EW) by 38.6% and 9.7%, respectively, compared to stripline structures. The proposed idea can be generally applied in PCB designs that will be used in high speed multilevel signal transmission to improve EH.
이준하 한국반도체디스플레이기술학회 2018 반도체디스플레이기술학회지 Vol.17 No.1
In the era of the 4th Industrial Revolution, IoT products of various and specialized fields are being developed and produced. Especially, the generation of the artificial intelligence, robotic technology Multilayer substrates and packaging technologies in the notebook, mobile device, display and semiconductor component industries are demanding the need for flexible materials along with miniaturization and thinning. To do this, this work use FCCL (Flexible Copper Clad Laminate), which is a flexible printed circuit board (PCB), to implement FPCB (Flexible PCB), COF (Chip on Film) Use is known to be essential. In this paper, I propose a transfer device which prevents the occurrence of scratches by analyzing the mechanism of wrinkle and scratch mechanism during the transfer process of thin film material in which the thickness increases while continuously moving in air or solution.
Guoping Ding,Jan Sandtner,Hannes Bleuler 대한전기학회 2015 Journal of Electrical Engineering & Technology Vol.10 No.5
This paper proposes the concept of FlexPCB(flexible Printed Circuit Board) conductive structure for electrodynamic bearings. It has three main advantages: easy “printing” of considerably thin conductive wires, resulting in potential reduction in stray eddy currents; realization of specific conductive configurations with high precision to optimize the eddy current flowing; simplicity in being wound to cylinders or hollow cylinders of different diameters. To verify this new concept, the FlexPCB conductive structure was manufactured, an axial electrodynamic bearing test rig was built and the conductive structure’s induced voltage was measured along the axial displacements from 0mm to 56mm at three rotating speeds. The finite element method was used to calcuatlate the flux density of electrodynamic bearing and induced voltage of the FlexPCB conductive structure. The experimental results are compared with the results from the FEM calculation. It is concluded that the measured and calculated induced voltages have consistency in the middle part of the bearing.
Ding, Guoping,Sandtner, Jan,Bleuler, Hannes The Korean Institute of Electrical Engineers 2015 Journal of Electrical Engineering & Technology Vol.10 No.5
This paper proposes the concept of FlexPCB(flexible Printed Circuit Board) conductive structure for electrodynamic bearings. It has three main advantages: easy “printing” of considerably thin conductive wires, resulting in potential reduction in stray eddy currents; realization of specific conductive configurations with high precision to optimize the eddy current flowing; simplicity in being wound to cylinders or hollow cylinders of different diameters. To verify this new concept, the FlexPCB conductive structure was manufactured, an axial electrodynamic bearing test rig was built and the conductive structure's induced voltage was measured along the axial displacements from 0mm to 56mm at three rotating speeds. The finite element method was used to calcuatlate the flux density of electrodynamic bearing and induced voltage of the FlexPCB conductive structure. The experimental results are compared with the results from the FEM calculation. It is concluded that the measured and calculated induced voltages have consistency in the middle part of the bearing.
고출력 Nd:YAG UV레이저를 이용한 polyimide층과 Cu-metal층의 가공상태에 대한 실험적 고찰
최경진,이용현,Choi, Kyung-Jin,Lee, Young-Hyun 한국반도체디스플레이기술학회 2009 반도체디스플레이기술학회지 Vol.8 No.4
In this paper, the laser cutting characteristics of the flexible PCB using high power Nd:YAG UV laser were investigated. A specific FPCB model was selected for the experiment. Test sheets were made, which had equal materials and layer structure to those of the outline (OL) region and the contact pad (CP) region in the FPCB. The experiment is made up of two stages. In the first stage of the experiment, the laser cutting fluence was found, which is the threshold fluence to cut the test sheets completely. The laser cutting fluence of the OL sheet is $1781.26{\sim}1970.16\;J/cm^2$ and that of the CP sheet is $2109.34{\sim}2134.34\;J/cm^2$. In the second stage, cutting performance and its qualities were analyzed by the experiment. The laser cutting performance remained almost unchanged for all laser and process parameter sets. The average cutting width (top side/bottom side) of the OL sheet was $40.45\;{\mu}m/11.52\;{\mu}m$ and that of the CP sheet was $22.14\;{\mu}m/10.93\;{\mu}m$. However, the laser cutting qualities were different according to the parameters. The adjacent region of the cutting line on the OL sheet was carbonized as the beam speed was low and the overlap coefficient was high. The surface quality around the cutting line of the CP sheet was about the same. Carbonization and debris occurred on the surface of the cutting line. As a result of the experiment, the cutting qualities were better as the overlap coefficient was made low and beam speed high. Therefore, the overlap coefficient 2 or 3 is proper for the FPCB laser cutting.