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유기산염 열분해법에 의한 Cu - Ni - Zn 페라이트의 전자파 흡수 특성
정재우(Jae-Woo Joung),이완재(Wan-Jae Lee) 한국자기학회 1995 韓國磁氣學會誌 Vol.5 No.6
The electromagnetic interference is prevented by the high magnetic loss of the ferrite. The absorbing property of electromagnetic wave could be improved by the ferrite that has a finer and more uniform microstructure. The thermal decomposition of organic acid salt provided the uniform composition and fine powder. The absorbing properties of electromagnetic wave were evaluated by the relative complex permeability, permittivity, and the attenuation which is calculated from the results of network analyzer. The permeability and permittivity were increased with increase of the density and with decrease of the grain size. The matching thickness could be reduced with increasing sintered temperature. The attenuation of the Cu-Ni-Zn ferrite showed over 20㏈ when the matching thickness and the matching frequency range were 6.75㎜ and from 160㎒z to 640㎒, respectively.
잉크젯 프린팅 방식으로 형성된 구리 배선의 전기적 특성 평가
김광석,구자명,정재우,김병성,정승부,Kim, Kwang-Seok,Koo, Ja-Myeong,Joung, Jae-Woo,Kim, Byung-Sung,Jung, Seung-Boo 한국마이크로전자및패키징학회 2010 마이크로전자 및 패키징학회지 Vol.17 No.3
직접인쇄기술 방식은 기존의 포토리소그래피 방법을 이용한 패터닝 기술에 비해 저비용, 간단한 공정 과정, 친환경성 등 여러 장점들로 인해 미세 회로 형성 분야의 그린 테크놀로지로 최근 각광받고 있다. 이러한 프린팅 기반의 전자기술을 상용화하기 위해서는 프린팅 방식으로 형성된 회로의 전기적 특성 평가가 필수적인데, 이에 본 연구에서는 구리 잉크를 이용하여 잉크젯 프린팅 방식으로 2 가지 타입, parallel transmission line(PTL)과 coplanar waveguide(CPW) 구조의 회로를 형성하고 $250^{\circ}C$에서 30분 동안 소결하여 완성하였다. 전류-전압 그래프로 직류 저항을 측정하여 벌크 구리의 비저항 값의 약 3.3배되는 평균 0.558 ${\mu}{\Omega}{\cdot}cm$의 비저항 값을 도출하였고 회로의 고주파 특성 평가를 위해 주파수 범위 0~30 GHz에서 probe station chuck과 샘플 간의 갭 유무에 따른 scattering parameter를 측정하였다. 모든 시편에서 5 dB 이하의 반사 특성을 보였으며, PTL 회로가 CPW 구조보다 전반적으로 더 좋은 통과 특성을 나타내었다. Direct printing technology is an attractive metallization method, which has become immerging as "Green technology" to the conventional photolithography, on account of low cost, simple process and environment-friendliness. In order to commercialize the printed electronics in industry, it is essential to evaluate the electrical properties of conductive circuits using direct printing technology. In this contribution, we focused on the electrical characteristics of inkjet-printed circuits. A Cu nanoink was inkjet-printed onto a Bisaleimide triazine(BT) substrate with parallel transmission line(PTL) and coplanar waveguide(CPW) type, then was sintered at $250^{\circ}C$ for 30 min. We calculated the resistivity of printed circuits through direct current resistance by the measurement of I-V curve: the resistivity was approximately 0.558 ${\mu}{\Omega}{\cdot}cm$ which is about 3.3 times that of bulk Cu. Cascade's probe system in the frequency range from 0 to 30 GHz were employed to measure the Scattering parameter(S-parameter) with or without a gap between the substrate and the probe station chuck. The result of measured S-parameter showed that all printed circuits had over 5 dB of return loss in the entire frequency range. In the curve of insertion loss, $S_{21}$, showed that the PTL type circuits had better transmission of radio frequency (RF) than CPW type.
잉크젯 프린팅된 은(Ag) 박막의 등온 열처리에 따른 미세조직과 전기 비저항 특성 평가
최수홍,정정규,김인영,정현철,정재우,주영창,Choi, Soo-Hong,Jung, Jung-Kyu,Kim, In-Young,Jung, Hyun-Chul,Joung, Jae-Woo,Joo, Young-Chang 한국재료학회 2007 한국재료학회지 Vol.17 No.9
Interest in use of ink-jet printing for pattern-on-demand fabrication of metal interconnects without complicated and wasteful etching process has been on rapid increase. However, ink-jet printing is a wet process and needs an additional thermal treatment such as an annealing process. Since a metal ink is a suspension containing metal nanoparticles and organic capping molecules to prevent aggregation of them, the microstructure of an ink-jet printed metal interconnect 'as dried' can be characterized as a stack of loosely packed nanoparticles. Therefore, during being treated thermally, an inkjet-printed interconnect is likely to evolve a characteristic microstructure, different from that of the conventionally vacuum-deposited metal films. Microstructure characteristics can significantly affect the corresponding electrical and mechanical properties. The characteristics of change in microstructure and electrical resistivity of inkjet-printed silver (Ag) films when annealed isothermally at a temperature between 170 and $240^{\circ}C$ were analyzed. The change in electrical resistivity was described using the first-order exponential decay kinetics. The corresponding activation energy of 0.44 eV was explained in terms of a thermally-activated mechanism, i.e., migration of point defects such as vacancy-oxygen pairs, rather than microstructure evolution such as grain growth or change in porosity.
CF<sub>4</sub>플라즈마 처리에 의한 잉크젯 프린팅 Ag박막과 폴리이미드 사이의 계면파괴에너지 향상에 관한 연구
박성철,조수환,정현철,정재우,박영배,Park, Sung-Cheol,Cho, Su-Hwan,Jung, Hyun-Cheol,Joung, Jae-Woo,Park, Young-Bae 한국재료학회 2007 한국재료학회지 Vol.17 No.4
The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.
1차원 Lumped 모델을 이용한 산업용 잉크젯 프린팅 헤드 토출 특성 해석
심원철(Won Chul Sim),박성준(Sung-Jun Park),김영재(Young Jae Kim),박창성(Chang Sung Park),유영석(Young Seuck Yoo),정재우(Jae Woo Joung),오용수(Yong Soo Oh) Korean Society for Precision Engineering 2007 한국정밀공학회지 Vol.24 No.11
Jettability analysis using one-dimensional(1D) lumped parameter model has been investigated to design the industrial inkjet head with proper drop velocity and drop volume. By simplifying the inkjet head system into an equivalent electrical circuit, lumped model has been developed. Performance of the lumped model is verified by the comparison between measured results of droplet velocity and ejection volume and predicted value. Also, the jetting performance of an inkjet head is characterized by varying the design parameter and driving condition. As a result, simulation results shows good agreement with the experimentally measured value. The developed lumped model enables to easily understand the effect of dimension change and predict the jetting performance.
논문 : 전자 재료 ; 고온고습조건이 잉크젯 프린팅 기법으로 형성된 Ag박막과 폴리이미드 사이의 계면접착력에 미치는 영향
박성철 ( Sung Cheol Park ),조수환 ( Su Hwan Cho ),정현철 ( Hyun Cheol Jung ),정재우 ( Jae Woo Joung ),박영배 ( Young Bae Park ) 대한금속재료학회 ( 구 대한금속학회 ) 2007 대한금속·재료학회지 Vol.45 No.9
Effects of 85℃/85%RH(T/H) treatment conditions on the interfacial fracture energy of inkjet printed Ag/Polyimide system are investigated from 180° peel test by calculating the peeling deformation energy of peeled metal and polyimide films. Interfacial fracture energy between inkjet printed Ag and polyimide was initially around 28.0 g/mm, while the increase in T/H treatment times as 76, 196, and 388 hrs lead to initial increase up to 78.9 g/mm and then decrease to 56.4 and 44.3 g/mm, respectively. Ag-O-C bonding formation seems to be responsible for interfacial adhesion improvement in the initial T/H treatment while moisture penetration inside polyimide itself seems to be related to the decrease in interfacial adhesion for longer T/H conditions.
모델 리파지토리를 이용한 기업지식경영 : P사 적용 사례를 중심으로 P Company Case
정재우,이희석 한국경영과학회 1999 經營 科學 Vol.16 No.2
The management of enterprise knowledge has been increasingly important because knowledge emerges as the new basis of competition in postcapitalist society One of the key issues in knowledge management is to put knowledge into a repository where it can be easily stored, reused, and recreated This paper proposes a model repository and the corresponding knowledge management framework The emphasis of model repository is on abstracting knowledge in the form of schematic models Two major benefits are model independence and model integration A metascherma is constructed according to six conceptual components separate unit, external link, internal link, separate unite descriptor, link descriptor, and composite descriptor, which can be applied for a variety of models A prototype system with a case illustrates the practical usefulness of model repository for knowledge management