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WC-Co/Cu/SM45C강접합에 미세조직 및 접합강도에 미치는 냉각속도의 영향
정승부,양훈모 대한용접접합학회 1999 대한용접·접합학회지 Vol.17 No.2
The interfacial microstructure and bond strength were examined for WC-Co/Cu/SM45C steel join using a nickel-plated copper in vacuum at 1323K for 0.6ks∼3.6ks. After bonding, microstructure in bonding interface was observed by OM(Optical Microscopy), SEM(Scanning Electron Microscopy) and EPMA(Eelectron Probe Micro Analyzer). The oil cooling was carried out at 353K, the cooling rate in air and furnace was 22K/s and 4.4K/s. respectively. It was found that dendritic widths increased with the content of cobalt and bonding times at 1323K. As a whole, bond strength values at the same bonding condition decreased in this order: WC-13wt.%Co/SM45Csteel. WC-8wt.%Co/SM45Csteel and WC-4wt.%Co/SM45Csteel. The bond strength of WC-13wt.%Co/S45C steel joint in oil cooling was 273MPa. This value was greatly higher than those of 125MPa in furnace cooling and 93MPa in air cooling at 1323K for 0.6ks. The bond strength values were found to be closely associated with the content of cobalt in WC-Co and cooling rate.
정승부 成均館大學校 科學技術硏究所 1996 論文集 Vol.47 No.2
Reaction diffusion and formation of Ni_3AL phase with L1_2 structure has been studied at temperature from 1423 to 1573K using the diffusion couple of (Ni-40.5at%Al)/(Ni-15at%Al) and (Ni-49.2at%Al)/(Nickel). The layer growth of Ni_3-Al phase in the annealed diffusion couple was measured by optical microscope and electron probe microanalyzer(EPMA). The layer growth of Ni_3Al phase in this experimental temperature range was controlled by the volume diffusion mechanism. The rate of layer growth of Ni_3-Al phase was found to be closely related to the composition of NiAl phase. The activation energy for layer growth of Ni_3Al phase was calculated to be 127kJ/mol.
Ni-NiAl 확산대에서 $Ni_3Al$ 상의 형성과 반응확산
정승부 대한용접접합학회 1997 대한용접·접합학회지 Vol.15 No.3
Reaction diffusion and formation of $Ni_3Al$phase with $L1_2$ structure have been studied in temperature range of 1432K to 1573K using the diffusion couple of (Ni-40, 5at%Al)/(Ni-14, 1at%Al) and (Ni-49, 2at%Al)/ (Nickel). The layer growth of Ni$_{3}$Al pyhase in the annealed diffusion couple was measured by optical microscope and electron probe microanalyzer (EPMA). The layer growth of $Ni_3Al$phase in diffusion zone obeyed the parabolic law without any indication of grain boundary effects. The layer growth of $Ni_3Al$phase in temperature range of 1423K to 1573K was mainly controlled by the volume diffusion mechanism. The rate of layer growth of $Ni_3Al$phase was found to be colsely related to the composition of intermetallic compound NiAl phase. The activation energy for layer growth of $Ni_3Al$phase was calculated to be 127kJ/mol.
전자현미경 In-Situ 관찰방법을 이용한 황동의 절삭성평가
정승부,임옥동,안성욱,Jung, Seung-Boo,Lim, Ok-Dong,An, Seong-Uk 한국현미경학회 1994 Applied microscopy Vol.24 No.3
In order to elucidate the machinability of lead brass, orthogonal machining experiment was conducted in SEM(Scanning Electron Microscope) equipped with a micro-machining device at a cutting speed of $7{\mu}m/s$ for brass containing 0.2 to 3wt% Pb. The microfactors (i.e., shear angle, contact length between chip and tool) were determined by in-situ observations. Machinability of brass containing lead is discussed in terms of the microfactors and the cutting resistant force tested by lathe cutting. The dynamic behavior of the chip formation of lead brass during the machining process was examined: The chips of lead brass form as a shear angle type. The shear angle increases with the content of lead in (6:4) brass. The pronounced effect of lead on the contact length between chip and tool was observed above 1% Pb. The cutting resistant force tested by lathe decreases remarkably with the lead content in brass. The observed microfactors are in close relation to the tested resistant force in macromachining.
신영의,정승부 대한용접접합학회 1996 대한용접·접합학회지 Vol.14 No.3
This paper presents the investigations on the initial strength and its variation of Sn-Pb solder joint using different lead frames, such as are 42 alloy lead and Cu alloy lead. As the result of the lack of initial strength at solder joints, whose pitch is from 0.3 to 0.4mm, short circuit often occured at the solder joint by thermal shock or external impact. Therefore, in this paper investigations were performed on the initial strength and its variation of Sn-Pb solder joint as well as fractured mode with using different lead frames.
김경섭,정승부,신영의 대한용접접합학회 1999 대한용접·접합학회지 Vol.17 No.2
Because of the need for packages which accommodate high pin count, high density and high speed device, PBGA(plastic ball grid array) package gets more spotlight. But the substrate material which is used for PBGA package is in nature susceptible to moisture penetration. The objective of the study is to find out the path of delamination in the stacked structure of substrate. To increase the adhesion between the cooper laminate and PSR(photo solder resist) which is the weakest part, experiments were performed by changing parameters of printing pre-treatment and post-treatment process. As a result of experiments, the factor effects on the adhesion between the cooper laminate and PSR is caused by all of the pre-treatment and post-treatment condition. A considerable change was observed depending on the amount of UV irradiation after thermal cure which is typical of printing post-treatment condition rather than pre-treatment condition.