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Off-grid electrocatalytic CO<sub>2</sub> conversion system combined with As(III) oxidation
최원정,박현웅 한국공업화학회 2019 한국공업화학회 연구논문 초록집 Vol.2019 No.1
Electrocatalytic CO<sub>2</sub> conversion system combined with As(III) oxidation in single device is demonstrated. Prior to combination, each half-reaction was optimized under the same electrolyte, and it was demonstrated that the addition of chloride ion in the electrolyte enhances reaction rate both reactions. Especially in the case of As(III) oxidation, faradaic efficiency is greatly reduced because of competing with water oxidation reaction at high potential, and It is mitigated by reactive chlorine species which mediated to As(III) oxidation in bulk. Finally, this simultaneously electrocatalytic system was connected to a low-cost photovoltaic cell to drive off-grid system. <sup>**</sup> This research was supported by the Basic Science Research Program (2019R1A2C2002602 and 2018R1A6A1A03024962) and the Next-Generation Carbon Upcycling Project (2017M1A2A2043123) through the National Research Foundation, Korea.
플립칩용 에폭시 접착제의 저온 속경화 거동에 미치는 경화제의 영향
최원정,유세훈,이효수,김목순,김준기,Choi, Won-Jung,Yoo, Se-Hoon,Lee, Hyo-Soo,Kim, Mok-Soon,Kim, Jun-Ki 한국재료학회 2012 한국재료학회지 Vol.22 No.9
Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.
최원정,조성진,Choi, Wonjung,Jo, Sungjin 한국전기전자재료학회 2017 전기전자재료학회논문지 Vol.30 No.8
Transparent film heaters employing silver nanowires (Ag NWs) have attracted increasing attention because of their widespread applications. However, the low thermal resistance of Ag NWs limits the maximum operating temperature of the Ag NW film heater. In this study, Ag NW film heaters with high mechanical and thermal stability were successfully developed. The thermal power-out characteristics of the Ag NW heaters were investigated as a function of the Ag NW density. The results revealed that the prepared flexible Ag NW heater possessed high thermal stability over $190^{\circ}C$ owing to ZnO encapsulation. This indicates that the Ag NW film with excellent thermal stability have remarkably high potential for use as electrodes in film heaters operating at high temperatures.
거대세포 바이러스 특이항원 자극 인터페론-감마효소결합면역흡착점적법/ 효소결합면역흡착측정법의안전성과 유효성에 대한 체계적 문헌 고찰
최원정,한주희,이월숙,신채민 대한임상미생물학회 2021 Annals of clinical microbiology Vol.24 No.2
Background: This study evaluated the safety and effectiveness of the cytomegalovirus(CMV) Specific Antigen Induced Interferon-Gamma ELISPOT (enzyme-linked immunosorbentspot)/ELISA (enzyme-linked immunosorbent assay) procedure in predicting the risk of CMVinfection/disease in immunocompromised patients through a systematic literature review. Methods: The searched electronic databases included MEDLINE, EMBASE and the CochraneLibrary. A total of 884 non-duplicate citations were retrieved and a total of 25 studies (15cohort studies, 10 cross-sectional studies) were included in this review. Study subjects wereselected among patients with solid organ, hematopoietic stem cell transplantation, or thosewho were on hemodialysis. Data extraction and literature quality assessment were carried outindependently by two researchers. Results: Most of the studies were conducted on patients with solid organ transplants. As it isconducted outside the body, CMV Specific Antigen Induced Interferon-Gamma ELISPOT/ELISAassay was safe. Regarding its effectiveness, most studies on risk analysis based on prognosis related outcomes reported that the inactive group showed a significantly higher hazard ratioor odds ratio than the active group. Results of Kaplan-Meier survival analysis also showedthat the inactive group had a significantly higher incidence of CMV event (CMV infection,CMV disease, other events) than the active group. However, various thresholds for CMV cellimmune response were reported, as was a broad range of predictive diagnostic accuracies. Conclusion: CMV Specific Antigen Induced Interferon-Gamma ELISPOT/ELISA assay haspotential to stratify the risk of CMV infection/disease among solid organ transplant patients andto determine a policy for a prophylaxis/preemptive. However, additional literature evidence isneeded to establish thresholds for CMV cell immune response and standardized tests.