영·유아 언어, 인지, 사회·정서 발달 평가도구 문항 개발을 위한 예비연구

이종숙,신은수,박은혜,김영태,유영의,최일선,유흥옥 이화여자대학교 교육과학연구소 2009 교육과학연구 Vol.40 No.3

본 연구는 만 2~5세 영·유아의 발달 상태를 객관적으로 평가함과 동시에 발달이 지연된 영·유아를 선별할 수 있는 발달평가도구 문항을 개발하기 위한 예비연구이다. 이를 위해 문헌고찰 및 발달관련 평가도구들을 비교 분석하여 발달지표를 선정하고, 만 2세~5세까지의 영·유아의 언어, 인지, 사회·정서발달영역을 교사관찰에 기초하여 평가할 수 있는 문항을 개발하였다. 연구대상은 대도시, 중소도시, 읍면 소재지 별로 표집 된 만 2세부터 5세까지 총 13개 유아교육기관에 다니는 435명의 영·유아들이며, 본 연구에서 최종 개발된 평가도구의 문항은 총 141문항이다. 평가도구 문항은 언어, 인지, 사회·정서발달영역별로 영·유아의 행동과 언어를 중심으로 교사가 관찰하고, 관찰하기 어려운 문항에 대해서는 단서와 kit를 제시하여 평가할 수 있도록 구성하였다. 개발된 평가도구 문항의 적절성을 알아보기 위하여 내용 타당도와 내적 신뢰도를 살펴본 결과 비교적 양호한 것으로 나타났다. This was a preliminary study to construct a developmental rating scale for understanding children's objective developmental levels and screening developmental disabilities. For this purpose, a developmental indicator was selected by a literature review and comparative analysis of related developmental assessment tests. An assessment scale based on teacher's observations to measure language, recognition, and social-emotional developmental areas was developed. The subjects were 435 young children aged 2 to 5 who lived in both urban and rural areas. A trial test consisted of 141 assessment items in the language, recognition, and social-emotional developmental domains. The developmental scale was evaluated by teachers who observed children's behavior and language, and used clues and kits. Tests on validity and reliability for confirming the appropriateness of the developed assessment scale showed that content was relatively valid and internally consistent.

플립칩 패키지의 신뢰성 향상에 관한 연구

이선병(Sun Byung Lee),김종민(Jong Min Kim),이성혁(Seong Hyuk Lee),신영의(Young Eui Shin) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-

A solder joint fatigue failure of flip chip (FC) package is mainly caused by the thermal stress due to the coefficient of thermal expansion (CTE) mismatch between the silicon die and the substrate. A nonlinear finite element analysis was conducted to investigate solder joint reliability under thermal cycling loading for FC assemblies without and with underfill. The effect of the solder joint height and thermomechanical properties such as CTE and Young's modulus on reliability of FC package. For parametric study, a finite element analysis are performed for seven different CTEs and five different Young's moduli of underfill. The concentrated Von Mises stress of the underfilled FC assembly was approximately 85% comparing that of FC assembly without underfill. Also, the concentrated stresses in the solder joint was decreased with increasing solder joint height. In addition, it is found that the solder joint reliability was improved with increasing Young's Modulus of underfill. Furthermore, the solder joint reliability was improved as the CTE was close to that of solder.

전자재료인 리드 프레임의 구조에 따른 이종재료간의 열응력해석과 접합부의 신뢰성

신영의,윤준호 중앙대학교 기술과학연구소 1994 기술과학연구소 논문집 Vol.24 No.-

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between IC device and lead frame pad due to the differences of thermal expansion coefficients. As results of thermal stress-strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to supress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

주석도금막을 이용한 마이크로 열원에 의한 이종전자재료의 접합성에 관한 연구

신영의,윤준호 중앙대학교 기술과학연구소 1994 기술과학연구소 논문집 Vol.24 No.-

This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to control both the thermal distribution of the bonds and its stability, because electronics components are composed of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, this paper shows fluxless bonding process with filler metal such as plating layers.

플라스틱 IC 패키지 접합부의 수명예측 및 품질향상에 관한 연구

신영의,김종민 중앙대학교 기술과학연구소 1998 기술과학연구소 논문집 Vol.28 No.-

TSOP는 리드의 길이가 극히 짧아 열변형을 완화시킬 수 없기 때문에 솔더접합부의 열피로강도는 가장 중요한 문제가 된다. 또한, TSOP 몸체의 겨우, 내부 균열이 발생된는 Si-칩과 Cu 합금 차이패드 사이의 봉지수지 끝단부위에 응력이 집중됨을 알 수 있었고, 42합금 재질의 클래드를 사용함으로써 TSOP 몸체 내부의 신뢰성 및 열피로 특성이 향상됨을 유한요소해석과 3종류의 dfu 사이클 실험을 통해서 확인할 수 있었다. TSOP 솔더접합부의 경우, 솔더 필렛 heel 상단부위에서, 최대 상당소성변형율과 Von Mises 응력이 걸리고 이 부위에서 초기 균열ㄹ이 발생하여 리드와 솔더와의 접합계면을 따라 균열이 진전됨을 알 수 있었다. 최종적으로 수정된 MAnson-Coffin 열 피로 수명식과 % 파괴 확률수명(??)와의 편차를 고려하여 수명비율(η)와 축적파괴확률(f) 와의 관계를 밝혔다. Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. In this paper, it has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad in the TSOP body by the FEM and 3 different thermal cycling tests. And using 42 alloy clad, the reliability and thermal fatigue property of TSOP body was improved. In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin thermal fatigue life and relationship of the ration of ?? to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life(N??) were achieved.

가토 두정골 절단시 회전기구의 회전속도와 생리 식염수에 의한 냉각이 골 치유에 미치는 영향에 관한 연구

이은영,신영진,이의석 원광대학교 치과대학 학생회 1992 學生學術誌 Vol.1 No.1

The application of recently developed rotary instruments to oral and maxillofacial surgical procedures has interrupted the healing process by affecting the temperature rise during drilling the bones. To evaluated the effects of healing process on the rabbit's calvarial defects, we have drilled the 6 holes on the calvarial bone resulting in three groups respectively according to 38, 300 and 20000 rpm, which divided into another two different groups operated under saline irrigation, and others not. Each specimen was sacrified at 3 days, 1, 2, 4, and 6 weeks post-operatively and routine fixation, Hematoxylin & Eosin stains and examined under light microscopic findings. The obtained results were as follows; 1. In each rpm, the healing processes of the saline irrigation groups were faster than those of no saline irrigation groups. 2. The lower the rpm of rotary instrument was, the faster the healing process. 3. In groups of using rotary instrument below 20000 rpm, there was appeared the good healing process that was operated under the low rpm with saline irrigation.

사무직 근로자에서 직무스트레스 및 VDT작업과 목·어깨 근골격계 증상과의 관련성

이의철,김환철,정달영,김동현,임종한,박신구 대한산업의학회 2007 대한직업환경의학회지 Vol.19 No.3

Carboxymethylcellulose(CMC)를 이용한 수용성 섬유 제조 특성에 관한 연구

최영민,정의현,박진원,신재균,Toshio, Kajiuchi,Hong, Kyung Jin 한국공업화학회 2003 응용화학 Vol.7 No.1

The manufacturing characteristics of water soluble fiber were studied using carboxymethycellulose(CMC) prepared from viscose rayon. Manufactiring process of CMC consists of mercerization and etherification stages. Experimental conditions are NaOH and MCA concentration and stop of reaction process. The former two steps of manufacturing process were reduced to one step. The solubility of CMC in one step process was compared with former process.

CMC계 수용성 섬유의 물리적 강도향상 첨가제에 관한 연구

최영민,정의현,박진원,신재균,Kajiuchi, Toshio,Hong, Kyung jin 한국공업화학회 2003 응용화학 Vol.7 No.2

The aim of this research was to develope the additive for physical strength improvement of water soluble fiber(CMC) using viscose rayon. Experimental parameters were reaction time and concentration of MgSo₄. Firstly, solubility of carboxymethylcellulose(CMC) according to the addition of MgSO₄ was tested at room temperature with water. Secondly, through the examination of the FT-IR spectra, absorption band caused by hydroxyl group and carboxyl group was confirmed.

업무 관련성 견갑상 포착 신경증이 의심되는 3례

정두신,성기범,신현길,안무영,김형수,홍영의 大韓産業醫學會 1999 대한직업환경의학회지 Vol.11 No.4

Objectives : Entrapment of the suprascapular nerve is frequently overlooked in the differential diagnosis of shoulder pain. Methods : Suprascapular entrapment neuropathy is a well-defined clinical entity and EMG and NCV is used to confirm a diagnosis. But the diagnosis typically not considered until patients develop severe weakness secondary to atrophy of the spinous musculature that the nerve supplies. Results : A narrow suprascapular notch has rarely been reported as a work-related factor of this entrapment neuropathy. Diagnosis of suprascapular entrapment neuropathy is based on the patients' clinical course, neurologic, radiologic, and electrophysiologic findings. One of the most helpful evaluations was anteriorposterior projection with the X-ray tube angled 15-30 degree caudally. The suprascapular entrapment neuropathy is relatively uncommon entity of shoulder discomfort(pain, weakness, and atrophy). Conclusions : If the worker who used his shoulder joint repetitiously having the shoulder pain and muscle weakness, we must rule out the suprascapular entrapment neuropathy. And it is needed to evaluate the motions which cause suprascapular entrapment neuropathy as the ergonomic factor.