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신영의(Young-Eui Shin),김종민(Jong-Min Kim),김영탁(Young-Tark Kim),김주석(Joo-Seok Kim),한성원(Sung-Won Han) 대한기계학회 2006 대한기계학회 춘추학술대회 Vol.2006 No.6
The 3-dimensional (3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package (SIP). It could be found that the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under 100㎛ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using various laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.
원저 : 추나요법을 시행한 특발성 척추측만증 환자 30 례에 관한 임상적 고찰
신영일(Young Il Shin),이병렬(Byung Ryul Lee),홍권의(Kwon Eui Hong),양기영(Ki Young Yang),이현(Hyun Lee) 대한침구학회 2001 대한침구의학회지 Vol.18 No.6
Objective : The purpose of this study was to inspect the effect of Massotherapy on idiopathic scoliosis patients, utilizing Cobb`s angle to determine the degree of curvature progression in the thoracic and lumbar regions. Methods : To obtain this result, we examinated 30 case of parents who visit Dept. of Acupuncture and Moxibustion Oriental Medical Hospital. Taejon University. with idiopathic scoliosis. We observe their age, sex, symptoms and Cobb`s angle. Results : As a result of this examination, we detected the fact that it`s difficult to treat isiopathic scoliosis fundamentally. But, Their symptoms are improved. So it is necessary to treat scoliosis actively with massotherapy . Conclusion : We want to be put this knowledge to practical use on treating Scoliosis and think the study like this must be go on continuously.
이선병(Sun Byung Lee),김종민(Jong Min Kim),이성혁(Seong Hyuk Lee),신영의(Young Eui Shin) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
A solder joint fatigue failure of flip chip (FC) package is mainly caused by the thermal stress due to the coefficient of thermal expansion (CTE) mismatch between the silicon die and the substrate. A nonlinear finite element analysis was conducted to investigate solder joint reliability under thermal cycling loading for FC assemblies without and with underfill. The effect of the solder joint height and thermomechanical properties such as CTE and Young's modulus on reliability of FC package. For parametric study, a finite element analysis are performed for seven different CTEs and five different Young's moduli of underfill. The concentrated Von Mises stress of the underfilled FC assembly was approximately 85% comparing that of FC assembly without underfill. Also, the concentrated stresses in the solder joint was decreased with increasing solder joint height. In addition, it is found that the solder joint reliability was improved with increasing Young's Modulus of underfill. Furthermore, the solder joint reliability was improved as the CTE was close to that of solder.
신영의,양협,김경섭,Shin, Young-Eui,Yang, Hyub,Kim, Kyung-Sub 대한용접접합학회 1994 대한용접·접합학회지 Vol.12 No.4
This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.
48 $\mu$BGA에 적용한 무연솔더의 시효처리에 대한 금속간화합물의 특성
신영의,이석,코조 후지모토,김종민,Shin, Young-Eui,Lee, Suk,Fujimoto, Kozo,Kim, Jong-Min 한국마이크로전자및패키징학회 2001 마이크로전자 및 패키징학회지 Vol.8 No.3
지금 까지 전자패키지 접합에 사용되어온 Sn/37Pb 솔더는 낮은 용융온도와 우수한 물리적 특성, 그리고 저렴한 가격 등으로 널리 사용되었다. 그러나 납의 독성으로 인한 환경문제와 인체 유해성이 문제화되면서 이를 대체할 무연솔더의 요구가 시급한 실정이다. 또한 제품의 소형화에 따른 접합부의 미세화로 인한 접합부신뢰성이 요구되고 있다. 본 연구에서는 현재 Sn/37Pb 솔더를 사용하여 제품에 사용되고 있는 48 $\mu$BGA 패키지를 사용하여 Sn/Ag 계열 의 두 무연솔더인 Sn/3.5Ag/0.75Cu와 Sn/2.0Ag/0.5Cu/2.0Bi를 접합하여 장기신뢰성을 시효처리를 통하여 제시하였다. 시효처리는 $130^{\circ}C$, $150^{\circ}C$, $170^{\circ}C$ 온도에서 각각 300, 600, 900 시간동안 하였으며, 시효처리에 따른 전단강도와 각 솔더의 활성화에너지를 구하여 Sn/37Pb 솔더와 비교하였다. 두 무연솔더의 시효강도는 Sn/37Pb 솔더 보다 우수하였으며, 시효처리에 따라 형성된 솔더내부의 금속간화합물의 형상으로부터 균열의 성장과 형성에 대하여 논하였다. 이런 실험결과들로부터 두 무연솔더의 장기신뢰성 측면에서 대체가능성을 제시하였다. The concerns of the toxicity and health hazard of lead in solders have demanded the research to find suitable lead-free solder alloys. It was discussed that effect of the intermetallic formation and structure on the reliability of solder joints. In this study, lead-free solder alloys with compositions of Sn/3.5Ag/0.75Cu, Sn/2.0Ag/0.5Cu/2.0Bi were applied to the 48 $\mu$BGA packages. Also, the lead-free solder alloys compared with eutectic Sn/37Pb solder using shear test under various aging temperature. Common $\mu$BGA with solder components was aged at $130^{\circ}C$, $150^{\circ}C$ and $170^{\circ}C$. And the each temperature applied to 300, 600 and 900 hours. The thickness of the intermetallics was measured for each condition and the activation energy for their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS (Energy Dispersive Spectroscopy). These results for reliability of lead-free interconnections are discussed.
신영의,김종민,김영탁,김주석,Shin, Young-Eui,Kim, Jong-Min,Kim, Young-Tark,Kim, Joo-Seok 대한용접접합학회 2006 대한용접·접합학회지 Vol.24 No.2
본 논문에서는 전자 패키징의 고밀도 실장 프로세스와 관련하여 많은 연구와 개발이 이루어지고 있는 무연 솔더의 양산적용시의 문제점 침 도전성 접착제 및 3차원 패키징 기술과 신뢰성 평가방법 등을 개략적으로 소개하였다. 현재 국제적 규약에 의한 무연 솔더의 사용이 의무화되어 가고, 이에 따라 기존 솔더의 전기적 접속성, 열 도전성, 접합성 등의 특성을 확보하기 위한 새로운 재료 및 공정에 대한 연구 및 개발이 필요한 시점이다. 또한 기존의 접합 방법에서의 고집적화 및 미세 피치의 한계를 넘기 위한 3차원 패키징 기술 등이 시도되고 있다. 따라서 신소재 개발 및 공정 변화에 맞는 새로운 신뢰성 평가 방법의 도출도 필요하다. 아울러 국내 대학 및 관련 연구소에서도 국제 경쟁력을 향상시키고 차세대 첨단 산업 분야의 신기술을 확보하고 이를 선도하기 위한 체계적인 연구 활동이 요구된다.
Darveaux 모델에 의한 플립칩 패키지 솔더 접합부의 열피로 해석 및 수명 평가
신영의,김연성,김종민,최명기,Shin Young-Eui,Kim Yeon-Sung,Kim Jong-Min,Choi Myun-Gi 대한용접접합학회 2004 대한용접·접합학회지 Vol.22 No.6
Experimental and numerical approaches on the thermal fatigue for the solder joint of flip chip package are discussed. However, it is one of the most difficult problems to choose the proper fatigue model. It was found that viscoplstic FE model with Darveaux method was very desirable and useful to predict the thermal fatigue life of solder joint for flip chip package under $208{\~}423K$ thermal cycling condition such as steep slope of temperature(JEDEC standard condition C). Thermal fatigue life was 1075 cycles as a result of viscoplatic model. It was a good agreement compared to the experimental. And also, it was found from the experimental that probability of the thermal fatigue life was $60{\%}$ at 1500 cycles.
열초음파 접합 공정과 접합부의 신뢰성 평가에 관한 연구
신영의,박진석,손선익,Shin, Young-Eui,Pak, Jin-Suk,Son, Sun-Eik 한국전기전자재료학회 2009 전기전자재료학회논문지 Vol.22 No.8
In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199\;^{\circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.