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핀-휜 형상에 따른 전자기기의 공기냉각 열전달성능의 영향
허견(Kyeon Heo),박준범(Joon-Beom Park),신석원(Seok Won Shin),김수연(SooYoun Kim) 대한설비공학회 2006 대한설비공학회 학술발표대회논문집 Vol.2006 No.11
In present study, the effect of shapes of pin-fins of an air cooling module on the heat transfer performance for electronic packaging applications was numerically investigated. The types of pin-fin cross-sectional shapes considered in this study were ellipse and wing, and the circle shape was used as a reference. They have the same cross-sectional areas and the same heights, but they have the different surface areas. As the results, the surface area, the heat transfer coefficient, and the heat transfer performance of pin-fins greatly depend on their shapes. Of the three types(i. e, ellipse, wing, and circle) of pin-fins, the wing type fin with suitable shape produced the best heat transfer performance which was expressed as -hA<SUB>s</SUB>. This result implies that the cooling capacity of the pin-fin heat sink can be enhanced by the only shape changing without increasing air flow-rate or fin density.