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문창렬(Chang Youl Moon),조형석(Hyung Suck Cho) 대한전자공학회 1992 대한전자공학회 학술대회 Vol.1992 No.10
In the field of assembly processes, non-rigid parts such as wires, tubes, gaskets and O-rings cannot be assembled automatically. And although many researchs have been made for rigid part mating, there are not substantial studies in flexible parts assembly field. In this paper, assembly stages of flexible parts are classified and some analysis are made. FEM was used to estimate the relationship between deformation and reactive forces. An assembly algorithm adopting reciprocal twisting motion was proposed and the assembly tool design methodology was discussed.
이은성,김운배,송인상,문창렬,김현철,전국진 한국반도체디스플레이기술학회 2004 반도체디스플레이기술학회지 Vol.3 No.3
A new wafer level packaging scheme is presented as an alternative to MEMS package. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the idea for MEMS wafer level packaging. The scheme of this work is developed using an electroplated tin (Sn) solder. The critical difference over conventional ones is that wafers are laterally bonded by solder reflow after LEGO-like assembly. This lateral bonding scheme has merits basically in morphological insensitivity and its better bonding strength over conventional ones and also enables not only the hermetic sealing but also its electrical interconnection solving an open-circuit problem by notching through via-hole. The bonding strength of the lateral bonding is over 30 Mpa as evaluated under shear and the hermeticity of the encapsulation is 2.0$\times10^{-9}$mbar.$l$/sec as examined by pressurized Helium leak rate. Results show that the new scheme is feasible and could be an alternative method for high yield wafer level packaging.