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노명훈,이준형,김원중,정재필,김형태,Roh, Myong-Hoon,Lee, Jun-Hyeong,Kim, Wonjoong,Jung, Jae Pil,Kim, Hyeong-Tea 대한용접접합학회 2013 대한용접·접합학회지 Vol.31 No.3
Through-silicon-via (TSV) is a major technology in microelectronics for three dimensional high density packaging. The 3-dimensional TSV technology is applied to CMOS sensors, MEMS, HB-LED modules, stacked memories, power and analog, SIP and so on which can be employed to car electronics. The copper electroplating is widely used in the TSV filling process. In this paper, the various Cu filling methods using the control of the plating process were described in detail including recent studies. Via filling behavior by each method was also introduced.
노명훈,김영욱,김원중,Toshiyuki Nishimura,서원선,고신일,이상진 대한금속·재료학회 2009 METALS AND MATERIALS International Vol.15 No.6
Two different SiC ceramics, one with 10 vol.% AlN-Sc2O3 in a 2:3 molar ratio, and the other with 20 vol.% of the same additives with the same ratio, were fabricated by hot-pressing at 1900 °C for 1 h and subsequent annealing at 2000 °C for 6 h in nitrogen. The grain boundary structures of both materials were observed by using high-resolution transmission electron microscopy. The results showed that both materials had clean boundaries without any amorphous films. Although both samples exhibited the same boundary structure, the sample with the higher AlN-Sc2O3 content contained more junction phases. The SiC ceramic with 10 vol.% AlN-Sc2O3 maintained its room-temperature strength up to 1400 °C, whereas the SiC ceramic with 20 vol.% AlN-Sc2O3 showed a gradual decrease in strength at above 900 °C. The present results suggest that the hightemperature strength is dependent on the amount of junction phase, as well as the characteristics of the intergranular phase. Two different SiC ceramics, one with 10 vol.% AlN-Sc2O3 in a 2:3 molar ratio, and the other with 20 vol.% of the same additives with the same ratio, were fabricated by hot-pressing at 1900 °C for 1 h and subsequent annealing at 2000 °C for 6 h in nitrogen. The grain boundary structures of both materials were observed by using high-resolution transmission electron microscopy. The results showed that both materials had clean boundaries without any amorphous films. Although both samples exhibited the same boundary structure, the sample with the higher AlN-Sc2O3 content contained more junction phases. The SiC ceramic with 10 vol.% AlN-Sc2O3 maintained its room-temperature strength up to 1400 °C, whereas the SiC ceramic with 20 vol.% AlN-Sc2O3 showed a gradual decrease in strength at above 900 °C. The present results suggest that the hightemperature strength is dependent on the amount of junction phase, as well as the characteristics of the intergranular phase.
전력반도체 패키징을 위한 Transient liquid phase 접합 기술
노명훈,정재필,김원중,Roh, Myong-Hoon,Nishikawa, Hiroshi,Jung, Jae Pil,Kim, Wonjoong 한국마이크로전자및패키징학회 2017 마이크로전자 및 패키징학회지 Vol.24 No.1
Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.
자동차용 파워 모듈 패키징의 은 소재를 이용한 접합 기술
노명훈,정재필,Roh, Myong-Hoon,Nishikawa, Hiroshi,Jung, Jae-Pil 한국마이크로전자및패키징학회 2015 마이크로전자 및 패키징학회지 Vol.22 No.4
Lead-free bonding has attracted significant attention for automotive power device packaging due to the upcoming environmental regulations. Silver (Ag) is one of the prime candidates for alternative of high Pb soldering owing to its superior electrical and thermal conductivity, low temperature sinterability, and high melting temperature after bonding. In this paper, the bonding technology by Ag paste was introduced. We classified into two Ag paste bonding according to applied pressure, and each bonding described in detail including recent studies.
Effect of Hot-Forging on Mechanical Properties of Silicon Carbide Sintered with Al2O3-Y2O3-MgO
노명훈,김원중,김영욱,최민형 대한금속·재료학회 2010 METALS AND MATERIALS International Vol.16 No.6
The mechanical properties of hot-pressed and hot-forged SiC were investigated. The hot -forging of the hotpressed SiC was carried out at 1700 °C for 66 h under an applied pressure of 25 MPa in an argon atmosphere. The microstructures on the surfaces parallel and perpendicular to the pressing direction of the hot-pressed and hot-forged SiC were similar, and no texture development was observed because of the lack of massive β→α transformation of SiC. An increase in hardness of about 13 % and fracture toughness of about 33% was achieved in the hot-forged specimens compared to the hot-pressed specimens.
우유에서 분리한 호냉성세균의 Heat-Stable Protease 생산조건
박우열,박법규,류병호,김희숙,노명훈 慶星大學校 1990 論文集 Vol.11 No.2
Pseudomonas fluorescens BH-22, which produced a heat stable protease, was isolated from the city milk. The optimum medium for heat stable protease production from the microorganism was as follows ; glucose 3, casein 5, KH₂PO₄ 0.1, MgSO₄ . 7H₂O 0.1 and CaCO₃ 0.1g100ml. The optimum pH of medium for heat stable protease production was pH 8.0, temperature was 20˚C. Proteolytic culture of Pseudomonas fluorescens BH-22 lost the protease activity ranged from 15% to 18% on heating for 30 min at 55˚C and for 20 min at 60˚C. This study was identified to excrete the protease by psychrotropic bacteria in city milk, and also investigated to the optical conditions of protease production and heat stability of the enzyme. The morphological and physiological characteristics of the strain BH-22 were studied according to the methods of Bergey's mannual, Gradwohl's clinical laboratory method and API 20NE Kit. From these results, strain BH-22 was identified as Pseudomonas fluorescens.