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천연고무 컴파운딩의 초탄성 재료 모델링 및 차량용 부싱 성능의 유한요소해석 연구
조중근(Jung Keun Cho),김라성(Ra Sung Kim),박인경(In-Kyung Park),김예찬(Ye Chan Kim),황민주(Min Ju Hwang),서종환(Jonghwan Suhr),정헌섭(Heon Seob Jung),강재욱(Jae Wook Kang),남재도(Jae-Do Nam) 한국고분자학회 2018 폴리머 Vol.42 No.6
본 연구에서는 차량용 고무 부싱의 설계기준이 되는 강성(stiffness)을 정확히 예측하기 위해 천연고무 컴파운드의 응력-인장 특성을 반영한 Ogden 3차 초탄성 모델이 고무 재료의 거동을 가장 정확하게 예측한다는 것을 규명하였다. 스웨이징 공정에 의한 4.6%의 변형 결과를 재료의 응력-변형률에 보정(calibration)하여 초탄성 모델에 적용한 결과, 스웨이징 효과를 고려하지 않은 예측 대비 약 45% 정확도가 향상되었으며, 실제 시험 결과와 99.6%의 정확도를 보였다. 본 연구는 정확한 고무소재 물성의 모델링을 통하여 부싱의 특성을 성공적으로 예측할 수 있다는 것을 확인하였고, 이를 통해 차량용 부싱의 설계, 공정 및 성능 평가 단계를 획기적으로 단축할 수 있는 방법을 제안하였다. The design process in automobile industry requires to predict the stiffness of rubber busing materials. The behavior of rubber compound can be simulated using the strain energy density function. It is needed to consider the change of the material properties because the compression deformation caused by the swaging process of the busing. In this study, numerical simulations of the stress-strain curve including the swaging process were carried out using the finite element method and compared with experimental data. The Ogden 3rd model of strain energy density functions predicted the behavior of the busing with natural rubber compound. The stress-strain curves of the rubber busing was calibrated using that the initial compression of the swaging process was the 4.6% strain. Compared to the stiffness of the bushing without swaging effect, the stiffness was improved by 45% and had 99.6% accuracy with the actual test results.
안영기,최중봉,구교욱,조중근,김태성,Ahn, Young-Ki,Choi, Jung-Bong,Koo, Kyo-Woog,Cho, Jung-Keun,Kim, Tae-Sung 한국반도체디스플레이기술학회 2009 반도체디스플레이기술학회지 Vol.8 No.1
Typically, single-wafer wet etching is done by dispensing chemical onto the front and back side of spin wafer. The wafer is fixed by a number of chuck pins, which obstruct the chemical flow and would result in the incomplete removal of the remaining film, which can become a source of contamination in the next process. In this paper, we introduce a novel design of wafer chuck, in which chuck pins are groupped into two and each group of pins fixes the substrate alternatively. Two groups of chuck pins fix the high-speed spin substrate with non contact method using a magnetic material. The actual process has been executed to observe the effectiveness of this new wafer chuck. It was found that the new wafer chuck performed better than the conventional wafer chuck for removing the remaining film from the bevel and edge side of substrate.
안영기,김현종,구교욱,조중근,Ahn, Young-Ki,Kim, Hyun-Jong,Koo, Kyo-Woog,Cho, Jung-Keun 한국반도체디스플레이기술학회 2006 반도체디스플레이기술학회지 Vol.5 No.2
Various methods of making thin film is being used in semiconductor manufacturing process. The most common method in this field includes CVD(Chemical Vapor Deposition) and PVD(Physical Vapor Deposition). Thin film is deposited on both the backside and the frontside of wafers. The thin film deposited on the backside has poor thickness profile, and can contaminate wafers in the following processes. If wafers with the thin film remaining on the backside are immersed in batch type process tank, the thin film fall apart from the backside and contaminate the nearest wafer. Thus, it is necessary to etch the backside of the wafer selectively without etching the frontside, and chemical injection nozzle positioned under the wafer can perform the backside etching. In this study, the backside chemical injection nozzle with optimized chemical injection profile is built for single wafer tool. The evaluation of this nozzle, performed on $Si_3N_4$ layer deposited on the backside of the wafer, shows the etching rate uniformity of less than 5% at the etching rate of more than $1000{\AA}$.
안영기,김현종,성보람찬,구교욱,조중근,Ahn, Young-Ki,Kim, Hyun-Jong,Sung, Bo-Ram-Chan,Koo, Kyo-Woog,Cho, Jung-Keun 한국반도체디스플레이기술학회 2006 반도체디스플레이기술학회지 Vol.5 No.2
Wet etching process in recent semiconductor manufacturing is devided into batch and single wafer type. Batch type wet etching process provides more throughput with poor etching uniformity compared to single wafer type process. Single wafer process achieves better etching uniformity by boom-swing injected chemical on rotating wafer. In this study, etching characteristics of $SiO_2$ layer at room and elevated temperature is evaluated and compared. The difference in etching rate and uniformity of each condition is identified, and the temperature profile of injected chemical is theoretically calculated and compared to that of experimental result. Better etching uniformity is observed with single wafer tool with boom-swing injection compared to single wafer process without boom-swing or batch type tool.
김종원,홍광진,조현찬,김광선,김두용,조중근,Kim Jong Won,Hong Kwagn Jin,Cho Hyun Chan,Kim Kwang Sun,Kim Doo Yong,Cho Jung Keun 한국반도체디스플레이기술학회 2005 반도체디스플레이기술학회지 Vol.4 No.3
As the integrated devices become more and more sophistcated, the diameter of wafers increased up to 300 mm and strict level of cleaning is necessary to remove the particulates on the surface of wafer. Therefore we need a new type of wet-station which can reduce DI water and chemical in the cleaning process. Moreover, it is important to control the temperature and the concentration of chemical in the wet-station. In the conventional chemical supply system, it is difficult not only to fit the mixing rate of chemicals in cleaning process, but also to fit the quantity and temperature. Thus, we propose a new chemicals supply system, which overcomes above problems by the analysis of fluid and thermal transfer on chemical supply system.
지능형 알고리즘을 이용한 Wet Station용 스마트 제어기 설계
홍광진(Kwang-Jin Hong),김종원(Jong-Won Kim),조현찬(Hyun-Chan Cho),김광선(Kwang-Sun Kim),김두용(Doo-Yong Kim),조중근(Jung-Keun Cho) 한국지능시스템학회 2004 한국지능시스템학회 학술발표 논문집 Vol.14 No.2
Semiconductor Wet Station has a very important place in semiconductor process. It is important that to discharge chemical with fit concentration and temperature using chemical supply system for clean process. The chemical supply system which is used currently is not only difficult to make a fit mixing rate of chemical which is need in clean process, but also difficult to make fit concentration and temperature. Moreover, it has high stability but it is inefficient spatially because its volume is great. We propose In-line System to improve system with implement analysis of fluid and thermal transfer on chemical supply system and understand problem of system.