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김종원,홍광진,조현찬,김광선,김두용,조중근,Kim Jong Won,Hong Kwagn Jin,Cho Hyun Chan,Kim Kwang Sun,Kim Doo Yong,Cho Jung Keun 한국반도체디스플레이기술학회 2005 반도체디스플레이기술학회지 Vol.4 No.3
As the integrated devices become more and more sophistcated, the diameter of wafers increased up to 300 mm and strict level of cleaning is necessary to remove the particulates on the surface of wafer. Therefore we need a new type of wet-station which can reduce DI water and chemical in the cleaning process. Moreover, it is important to control the temperature and the concentration of chemical in the wet-station. In the conventional chemical supply system, it is difficult not only to fit the mixing rate of chemicals in cleaning process, but also to fit the quantity and temperature. Thus, we propose a new chemicals supply system, which overcomes above problems by the analysis of fluid and thermal transfer on chemical supply system.