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롤투롤 인쇄공정 적용을 위한 차세대 나노입자 소결 기술
이은경,은경태,안영석,김용택,천민우,좌성훈,Lee, Eun Kyung,Eun, Kyoungtae,Ahn, Young Seok,Kim, Yong Taek,Chon, Min-Woo,Choa, Sung-Hoon 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.21 No.4
Recently, a variety of printing technologies, including ink jet, gravure, and roll-to-roll (R2R) printing, has generated intensive interest in the application of flexible and wearable electronic devices. However, the actual use of printing technique is much limited because the sintering process of the printed nanoparticle inks remains as a huge practical drawback. In the fabrication of the conductive metal film, a post-sintering process is required to achieve high conductivity of the printed film. The conventional thermal sintering takes considerable sintering times, and requires high temperatures. For application to flexible devices, the sintering temperature should be as low as possible to minimize the damage of polymer substrate. Several alternative sintering methods were suggested, such as laser, halogen lamp, infrared, plasma, ohmic, microwave, and etc. Eventually, the new sintering technique should be applicable to large area, R2R, and polymer substrate as well as low cost. This article reviews progress in recent technologies for several sintering methods. The advantages and disadvantages of each technology will be reviewed. Several issues for the application in R2R process are discussed.
정훈선,은경태,이은경,정기영,최성훈,좌성훈,Jung, Hoon-Sun,Eun, Kyoungtae,Lee, Eun-Kyung,Jung, Ki-Young,Choi, Sung-Hoon,Choa, Sung-Hoon 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.21 No.4
본 연구에서는 스퍼터링 공정으로 제작된 FCCL(flexible copper clad laminate)을 이용하여 초박형 FPCB를 개발하였다. 또한 구리 박막과 폴리이미드 기판의 접착력을 향상시키기 위한 NiMoNb 접착층을 적용하였다. 개발된 초박형 FPCB의 기계적 내구성과 유연성은 인장, 비틀림 및 굽힘 피로 수명시험을 이용하여 검증하였다. 인장 시험 결과 초박형 FPCB는 약 7% 까지 인장이 가능하였으며, 비틀림 각도 $120^{\circ}$ 까지의 내구성과 유연성을 갖고 있음을 알 수 있었다. 또한 초박형 FPCB는 10,000회의 굽힘 피로시험에도 파괴가 발생하지 않았다. 수치해석에 의한 응력 및 변형율의 계산 결과, 인장 시에 초박형 FPCB에 걸리는 최대 응력 및 변형률은 기존 FPCB에 비하여 크게 차이가 나지 않음을 알 수 있었다. 결론적으로 초박형 FPCB의 강건성은 기존 FPCB에 비하여 약간 열세이나, 제품에 적용하기에는 충분한 강건성과 신뢰성을 갖고 있다고 판단된다. In this study, we developed an ultra-thin flexible printed circuit board(FPCB) using the sputtered flexible copper clad laminate. In order to enhance the adhesion between copper and polyimide substrate, a NiMoNb addition layer was applied. The mechanical durability and flexibility of the ultra-thin FPCB were characterized by stretching, twisting, bending fatigue test, and peel test. The stretching test reveals that the ultra-thin FPCB can be stretched up to 7% without failure. The twisting test shows that the ultra-thin FPCB can withstand an angle of up to $120^{\circ}$. In addition, the bending fatigue test shows that the FPCB can withstand 10,000 bending cycles. Numerical analysis of the stress and strain during stretching indicates the strain and the maximum von Mises stress of the ultra-thin FPCB are comparable to those of the conventional FPCB. Even though the ultra-thin FPCB shows slightly lower durability than the conventional FPCB, the ultra-thin FPCB has enough durability and robustness to apply in industry.
오세인(Se-in Oh),은경태(Kyoungtae Eun),오해관(Hae-kwan Oh),양상식(Sang-sik Yang),좌성훈(Sung-hoon Choa) 한국생산제조학회 2011 한국생산제조시스템학회 학술발표대회 논문집 Vol.2011 No.4
One of the key technologies of intelligent tire monitering system is measuring the deformation of the tire during driving. Tire deformation of the sensor should be operated at extreme conditions and needs wireless communication capability. In this paper, we investigated the feasibility of MEMS SAW sensor as a tire deformation sensor using 3 point bending machine.
유연 ITO 박막의 신뢰성 향상을 위한 주요 인자의 실험적 연구
좌성훈(Sung-Hoon Choa),은경태(Kyoungtae Eun),오세인(Se in Oh),이미경(Mikyoung Lee),강재욱(Jae-Wook Kang),김도근(Do-Geun Kim),정성훈(Sung-Hoon Jeong) 대한기계학회 2011 대한기계학회 춘추학술대회 Vol.2011 No.10
Transparent conducting oxide (TCO) films have recently attracted a great deal of attention due to the rapid advances being made in flexible electronic devices. However, research regarding the mechanical reliability of flexible electronics is still limited, and there is a lack of data concerning the reliability of TCO films. In this study, we investigated the bending reliability of TCO film using indium tin oxide (ITO) film on PET substrate. In order to study the effects of PET substrate thickness and ITO film thickness on bending reliability, various samples with different thickness of ITO films and substrates were fabricated and tested. The electrical and optical properties of the films were also evaluated. In order to improve the mechanical reliability of ITO film, we used the neutral mechanical plane concept, which is free from any stresses during bending. Neutral plane was made by the addition of PET substrate of the same thickness on top of the ITO/PET substrate. Finally, reliability of ITO/poly (3, 4 - ethylenedioxythiophene):poly(styrenesulfonate)(PEDOT:PSS) films was evaluated with universal reliability tests including bending, stretching, twisting, and fatigue tests.
이기정(Ki Jung Lee),조민욱(Minuk Jo),Fu Chen(付琛),은경태(Kyoungtae Eun),오해관(Haekwan Oh),좌성훈(Sung-Hoon Choa),양상식(Sang Sik Yang) 대한전기학회 2014 전기학회논문지 Vol.63 No.4
Piezoresistive-type, capacitive-type, and optical-type sensors have mainly been used for measuring a strain. However, in building a sensor network for remote monitoring using these conventional sensors there are disadvantages such as the complexity of a measuring system including wireless communication circuitry and high cost. In this paper, we demonstrates a highly-sensitive surface acoustic wave (SAW) strain sensor which is advantageous to harsh environments and wireless network. We designed and fabricated the SAW strain sensor. The SAW strain sensor attached on a specimen was tested with a tensile tester. The strain on the sensor surface was measured with a commercial strain gauge and compared with that obtained from strain analysis. The central frequency shift of the SAW sensor was measured with a network analyzer. The sensitivity of the SAW strain sensor is 134 Hz/με which is high compared to previous results.