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좌성훈,고병호,이행수 한국마이크로전자및패키징학회 2017 마이크로전자 및 패키징학회지 Vol.24 No.4
In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.
Investigation of Durability of TSV Interconnect by Numerical Thermal Fatigue Analysis
좌성훈,송차규,이행수 한국정밀공학회 2011 International Journal of Precision Engineering and Vol. No.
3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. However,increased number of interconnects and extreme miniaturization suggest that thermo-mechanical reliability and fatigue will aggravate. In traditional package, thermo-mechanical fatigue failure mostly occurs as a result of damage in the solder joint. In TSV technology, however, the driving failure may be the TSV via or TSV interconnects. In this study, the durability of TSV technology is investigated using finite element method. Thermal fatigue phenomenon due to the plastic strain caused by repetitive temperature cycling is analyzed, and possible failure locations are discussed. In particular, the effects of via size,underfill material, and via filling material on the thermal fatigue reliability are investigated. The expected fatigue life indicates that the presence of underfill material is essential in improving the durability of the TSV structure. The plastic strain increases with the via size increases, therefore the thermal fatigue life increases as the via size decreases. For different via filling materials such as copper, nickel and tungsten, amount of plastic strain is very similar, suggesting that nickel could be used for via filling material. However, the locations of the maximum strain are different for each filling material.
좌성훈,송차규,Choa, Sung-Hoon,Song, Cha-Gyu 대한용접접합학회 2011 대한용접·접합학회지 Vol.29 No.1
TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.
좌성훈,한태수,김원종,Choa, Sung-Hoon,Han, Tae-Su,Kim, Wonjong 한국마이크로전자및패키징학회 2016 마이크로전자 및 패키징학회지 Vol.23 No.1
Nowadays, the importance of role of the international standardization keeps increasing substantially. We have already known that international standards have a huge impact on many companies, industries and nations. So far, it has been thought that standardizations are needed after the new products come into the market and are mass-produced in order to encourage the use of the products, systems and services. Standardization will make the products more safe, efficient, and environmentally friendly for the users. However, in these days, a paradigm of the standardization has been changed. International standard becomes a tool for dominating global market and is the most important ingredients of the competitiveness and economic progress of the nation and enterprises. Many countries like Japan, Germany and U.S. use the standardization as an effective method to dominate the market and monopolized the new technologies. Therefore, worldwide competition for the standardization of the new technology become fierce. Korea is leading the technology in semiconductor field. However, activities of international standardization are not sufficient. In order to boost the standardization activities in Korea from industry, academia, and research institute, this paper briefly introduce the international standard organization and some critical issues for next-generation semiconductor memory such as flexible semiconductor, automobile semiconductor and wearable devices.
디스크 표면 토포그래피가 자기저항 헤드의 베이스라인 안정성에 미치는 영향
좌성훈,Jwa, Seong-Hun 대한기계학회 2000 大韓機械學會論文集A Vol.24 No.2
Several factors which influence baseline instability (BLI) phenomenon in MR drive were investigated experimentally. In particular, the role of surface topography on BLI was studied in detail. The r esults show that BLI is linearly proportional to the surface waviness with a spatial wavelength of 0.4 to 5.0 min. BLI becomes worse as the surface waviness increases. On the other hand, surface roughness which has a spatial wavelength below 25 $\mu$ m has no effect on BLI. The results further show that the effect of bias current on the BLI is amplified on the disk with worse surface waviness. The disk surface waviness is dependent on the manufacturing process and becomes an inherent surface property of media. The disk surface waviness. therefore, can not be overlooked when evaluating the media for a high-performance hard disk drive. In general, waviness is reduced mainly during grinding and polishing process during manufacturing.
좌성훈,조은형,손진승,박준민,정진태,Jwa, Seong-Hun,Jo, Eun-Hyeong,Son, Jin-Seung,Park, Jun-Min,Jeong, Jin-Tae 대한기계학회 2002 大韓機械學會論文集A Vol.26 No.4
Dynamic behaviors are analyzed for an automatic ball balancer (ABB) with triple races, which is a device to reduce the unbalanced mass of optical disk drives (ODD) such as CD-ROM or DVD drives. The nonlinear equations of motion are derived by using Lagrange's equations with the polar coordinate system. It is shown that the polar coordinate system provides the complete stability analysis while the rectangular coordinate system used in other previous studies has limitations on the stability analysis. For the stability analysis, the equilibrium positions and the linearized perturbation equations are obtained by the perturbation method. Based on the linearized equations, the stability of the system is analyzed around the equilibrium positions; furthermore, to confirm the stability, the time responses for the nonlinear equations of motion are computed by using a time integration method and experimental analyses are performed. Theoretical and experimental results show a superiority of the ABB with triple races.