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용액법으로 제작된 ZnSnO 박막트랜지스터의 전극 물질에 따른 계면 접촉특성 연구
정영민,송근규,우규희,전태환,정양호,문주호,Jeong, Young-Min,Song, Keun-Kyu,Woo, Kyoo-Hee,Jun, Tae-Hwan,Jung, Yang-Ho,Moon, Joo-Ho 한국재료학회 2010 한국재료학회지 Vol.20 No.8
We studied the influence of different types of metal electrodes on the performance of solution-processed zinc tin oxide (ZTO) thin-film transistors. The ZTO thin-film was obtained by spin-coating the sol-gel solution made from zinc acetate and tin acetate dissolved in 2-methoxyethanol. Various metals, Al, Au, Ag and Cu, were used to make contacts with the solution-deposited ZTO layers by selective deposition through a metal shadow mask. Contact resistance between the metal electrode and the semiconductor was obtained by a transmission line method (TLM). The device based on an Al electrode exhibited superior performance as compared to those based on other metals. Kelvin probe force microscopy (KPFM) allowed us to measure the work function of the oxide semiconductor to understand the variation of the device performance as a function of the types metal electrode. The solution-processed ZTO contained nanopores that resulted from the burnout of the organic species during the annealing. This different surface structure associated with the solution-processed ZTO gave a rise to a different work function value as compared to the vacuum-deposited counterpart. More oxygen could be adsorbed on the nanoporous solution-processed ZTO with large accessible surface areas, which increased its work function. This observation explained why the solution-processed ZTO makes an ohmic contact with the Al electrode.
김숙한,이문용,우규희,윤홍석,이택민,이응기,권신 한국정밀공학회 2017 International Journal of Precision Engineering and Vol.18 No.8
A roll-to-roll (R2R) thermal evaporation system was developed to manufacture low-cost flexible OLEDs. A vacuum-compatible bottom-up thermal evaporation method was adopted to ensure the quality and the stability of the thin film. DSMC (Direct Simulation Monte Carlo) simulation was used to predict the CD (Cross Direction) uniformity of the thickness of the deposited thin film. And, a uniformity-compensation method using the Z-map algorithm was developed to realize entire uniformity on a continuous roll-to-roll scan-type substrate. An experimental investigation confirms that these simulations fit the actual test results well. And, a flexible OLED lighting sample could be fabricated using the proposed method and the developed R2R equipment. These results represent a meaningful step towards the production of low-cost flexible OLED applications
Fabrication of Highly Flat, Flexible Mesh Electrode for Use in Photovoltaics
Zhaoyang Zhong,Pyeongsam Ko,Hongseok Youn,김아름,우규희 한국정밀공학회 2021 International Journal of Precision Engineering and Vol.8 No.6
Metal mesh-based flexible transparent conductive electrodes have attracted much interest as one alternative to conventional indium tin oxide electrodes. In addition to ongoing eff orts to develop scalable and cost-effective fabrication processes for high-resolution mesh patterns, the high surface roughness of the mesh which can cause short circuiting and current leakage in optoelectronic devices must be solved. Herein, high-resolution (below ~ 10 μm) mesh patterns with various thicknesses are fabricated by scalable, selective transfer printing and then stably and sufficiently sintered under delicately controlled flash irradiation. A polyethylene terephthalate (PET) fi lm is laminated on the patterns overlaid with a UV-curable resin and then peeled off after UV curing, which produces mesh patterns strongly bonded to the cured resin to be separated in a fully embedded form. The final, highly flat, flexible mesh with a low sheet resistance of 1.7 Ω sq −1 , a high optical transparency of 88.6%, excellent mechanical flexibility, and strong adhesion to the substrate is successfully implemented in a flexible perovskite solar cell with a high power conversion efficiency (PCE) of 14.92%.
Mo-Ti 합금 접착층을 통한 유연 기판 위 구리 배선의 기계적 신뢰성 향상 연구
이영주,신해아슬,남대현,연한울,남보애,우규희,주영창,Lee, Young-Joo,Shin, Hae-A-Seul,Nam, Dae-Hyun,Yeon, Han-Wool,Nam, Boae,Woo, Kyoohee,Joo, Young-Chang 한국마이크로전자및패키징학회 2015 마이크로전자 및 패키징학회지 Vol.22 No.1
유연 기판에 증착된 구리 박막과 구리 배선의 기계적 피로 현상에 대해 조사하고, 몰리브덴-티타늄 합금 접착 층을 이용해 피로 신뢰성을 향상시키는 연구를 진행하였다. 구리 배선의 경우 구리 박막에 비해 인장 굽힘 피로수명이 약 3배, 압축 굽힘 피로수명은 약 6배 가량 감소하는 것으로 측정되었으며, 기계적 균열 생성에 의한 파괴가 더욱 치명적으로 작용할 수 있다. 몰리브덴-티타늄 접착층이 있을 경우, 구리 배선의 피로수명이 인장과 압축 굽힘 조건 모두 향상되는 결과를 나타냈으며, 이는 접착층에 의한 계면 접착력 상승 효과와 더불어 구리층의 미끄럼 현상을 억제했기 때문으로 추측된다. Bending fatigue characteristics of Cu films and $8{\mu}m$ width Cu interconnects on flexible substrates were investigated, and fatigue reliability improvement was achieved through Mo-Ti alloy adhesion layer. Tensile bending fatigue reliability of Cu interconnects is 3 times lower than that of Cu films, and even compressive bending fatigue reliability of Cu interconnects is 6 times lower than that of Cu films. From these results, mechanical crack formation could be fatal in Cu interconnects. With Mo-Ti adhesion layer, fatigue reliability of Cu films and interconnects were enhanced due to the increase of adhesion strength and the suppression of slip induced crack initiation.
이영주,신해아슬,남대현,연한율,남보애,우규희,주영창 대한금속·재료학회 2015 ELECTRONIC MATERIALS LETTERS Vol.11 No.1
The mechanical fatigue of Cu films and lines on flexible substrates was investigated,and an improvement in the structures through the use of a MoTi alloy under-layerwas proposed. Fatigue reliability was decreased by 3-fold in lines compared withfilms in the tensile condition and by 6-fold in the compressive condition. Crackformation was observed to be more detrimental for lines than for films. With a MoTiunder-layer, the fatigue limit was increased by 2 times that of a structure withoutMoTi in the tensile condition and by 15 times in the compressive bending condition. The suppression of delamination through the use of a MoTi under-layer improvedthe fatigue reliability under compressive bending.