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A Study on the Void Free of Via Hole Filling by Vacuum Printing Method in PCB
목지수,김기환,윤종태,Mok, Jee-Soo,Kim, Ki-Hwan,Youn, Jong-Tae The Korean Graphic Arts Communication Society 2006 한국인쇄학회지 Vol.24 No.1
본 연구에서는 PCB에 진공인쇄 방식이 적용된 스크린 인쇄방법을 이용하여 Pattern 및 Hole충전의 신뢰성을 향상시킬 수 있는 기술을 적용하였다. 새로운 dry process 기술인 직접회로 인쇄 기술은 일반적으로 사용되고 있는 wet process 중 도금, 에칭, 박리 등의 공정을 줄일 수 있어 제조원가, 공정 리드타임 감소, 폐기물 감소로 환경 친화적 공정이라고 할 수 있다. 직접회로 인쇄는 진공도 100 Pa, 인쇄압력 0.45 MPa, 인쇄 속도 30 mm/sec, 인쇄각도 85도, 스크린 마스크와 기판 사이의 Gap 2 mm에서 인쇄될 때 가장 좋은 결과를 보였다. 직접회로 인쇄에 사용된 인쇄기는 일반 PCB공정에서 사용되는 동일한 형태에 진공조건을 유지시킬 수 있도록 개선하여 사용하였다.
중년 여성을 위한 롤형 아로마 솔루션 제조 및 특성 평가
목지수,김령,김인경 융복합지식학회 2024 융복합지식학회논문지 Vol.12 No.1
중년기는 삶의 여러 측면에서 중요한 변화와 도전을 겪는 시기로, 생리학적, 심리학적, 사회학적으로 많은 변화가 발생하는 시기이다. 이때, 여성은 생리 기능의 감소와 관련된 폐경을 경험하며, 정신적, 감각적, 생식적인 변화와 성 정체성에 대한 고민, 외모 관련 스트레스, 가족 구성원 간의 변화로 인해 스트레스를 느끼게 된다. 한국의 중년 여성 중 약 38~39%가 갱년기 증상을 경험한다. 이런 문제점을 개선하고자 EEG(Electroencephalogram)를 통하여 아로마 솔루션이 중년 여성 증상을 개선하는지 보고자한다. 실험에 사용한 아로마 오일은 Bergamot oil과 Clary sage oil을 사용하고, Carrier oil로서 무색, 무취인 MCT(Medium chain triglycerides) oil도 함께 사용하였다. 아로마 솔루션 비율을 정하기 위해 실험 대상(50세, 여성)에게 Bergamot:Clary sage:MCT oil 비율을 각각 다르게 하여 최상의 비율을 뇌파 분석을 통해 결정하였다. 제조한 아로마 솔루션을 중년 여성 8명 중, 5명의 평균치를 분석해본 결과, 실험 대상 중 5명 모두에게 우울증이 개선되었다. 대부분의 실험 대상에게 α파 값이 증가하는 추세를 보였다. 또, 대부분의 실험 대상이 δ파 값과 θ파 값이 같이 증가하는 경향을 보아, 수면 장애 증상이 개선되는 것을 확인할 수 있었다. Middle age is a period of significant changes and challenges in many aspects of life, and is a time when many changes occur physiologically, psychologically, and sociologically. At this time, women experience menopause, which is associated with a decline in menstrual function, and feel stress due to mental, sensory, and reproductive changes, concerns about gender identity, stress related to appearance, and changes among family members. Approximately 38-39% of middle-aged women in Korea experience menopausal symptoms. In order to improve these problems, we would like to see whether an aroma solution improves middle-aged women's symptoms through EEG (Electroencephalogram). The aroma oils used in the experiment were Bergamot oil and Clary sage oil, and colorless and odorless MCT (medium chain triglycerides) oil was also used as a carrier oil. To determine the aroma solution ratio, the test subject (50 years old, female) was given different ratios of Bergamot:Clary sage:MCT oil and the best ratio was determined through brain wave analysis. As a result of analyzing the average values of 5 out of 8 middle-aged women using the manufactured aroma solution, depression was improved in 5 of the test subjects. For most test subjects, α wave values showed an increasing trend. In addition, most test subjects showed a tendency for both δ-wave and θ-wave values to increase, confirming that sleep disorder symptoms were improved.
스크린 인쇄에서 인쇄 속도와 잉크 점도에 따른 잉크 전이 시뮬레이션에 관한 연구
최송아,윤종태,목지수,구철회,Choi, Song-Ah,Youn, Jong-Tae,Mok, Jee-Soo,Koo, Chul-Whoi 한국인쇄학회 2011 한국인쇄학회지 Vol.29 No.1
As screen printing is changed by automation recently, could print more exactly. However, must suffer great many trial and error to have still gotten perfect result. By the way, at this step, fair time and money should be invested. Therefore, if search for optimum condition in early time visualizing screen printing process using simulator program before progress printing, is judged that may be correct and gets printing result efficiently. In this paper, searched optimum printing speed and ink viscosity using FLOW-3D program. Also, the result could confirm truth that is agreeing almost with experiment contents. Through this, is thought that may expect extension of screen printing wide application that vivify advantage of screen print if use simulation program.
Ag Paste bump 구조를 갖는 인쇄회로기판의 Ag migration 발생 안전성 평가
송철호,김영훈,이상민,목지수,양용석,Song, Chul-Ho,Kim, Young-Hun,Lee, Sang-Min,Mok, Jee-Soo,Yang, Yong-Suk 한국재료학회 2010 한국재료학회지 Vol.20 No.1
The current study examined Ag migration from the Ag paste bump in the SABiT technology-applied PCB. A series of experiments were performed to measure the existence/non-existence of Ag in the insulating prepreg region. The average grain size of Ag paste was 30 nm according to X-ray diffraction (XRD) measurement. Conventional XRD showed limitations in finding a small amount of Ag in the prepreg region. The surface morphology and cross section view in the Cu line-Ag paste bump-Cu line structure were observed using a field emission scanning electron microscope (FE-SEM). The amount of Ag as a function of distance from the edge of Ag paste bump was obtained by FE-SEM with energy dispersive spectroscopy (EDS). We used an electron probe micro analyzer (EPMA) to improve the detecting resolution of Ag content and achieved the Ag distribution function as a function of the distance from the edge of the Ag paste bump. The same method with EPMA was applied for Cu filled via instead of Ag paste bump. We compared the distribution function of Ag and Cu, obtained from EPMA, and concluded that there was no considerable Ag migration effect for the SABiT technology-applied printed circuit board (PCB).
SABiT 공법적용 인쇄회로기판의 은 페이스트 범프 크기 및 제작 조건에 따른 전기 저항 특성
송철호,김영훈,이상민,목지수,양용석 한국전기전자재료학회 2010 전기전자재료학회논문지 Vol.23 No.4
We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.