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강신일,문수동,이영주,부종욱,Gang, Sin-Il,Mun, Su-Dong,Lee, Yeong-Ju,Bu, Jong-Uk 대한기계학회 2001 大韓機械學會論文集A Vol.25 No.8
Plastic microlenses play an important role in reducing the size, weight, and the cost of the systems in the fields of optical data storage and optical communication. In the present study, plastic microlens arrays were fabricated using micro-compression molding process. The design and fabrication procedures for mold insert were simplified by using silicon instead of metal. A simple but effective micro compression molding process, which uses polymer powder, were developed for microlens fabrication. The governing process parameters were temperature and pressure histories and the micromolding process was controlled such that the various defects developing during molding process were minimized. The radius and magnification ratio of the fabricated microlens were 125$\mu\textrm{m}$ and over 3.0, respectively.
김영식,장성수,이선영,진원혁,조일주,남효진,부종욱,Kim Young-Sik,Jang Seong-Soo,Lee Caroline Sun-Young,Jin Won-Hyeog,Cho Il-Joo,Nam Hyo-Jin,Bu Jong-Uk 정보저장시스템학회 2006 정보저장시스템학회논문집 Vol.2 No.2
In this research, a wafer-level transfer method of cantilever away on a conventional CMOS circuit has been developed for high density probe-based data storage. The transferred cantilevers were silicon nitride ($Si_3N_4$) cantilevers integrated with poly silicon heaters and piezoelectric sensors, called thermo-piezoelectric $Si_3N_4$ cantilevers. In this process, we did not use a SOI wafer but a conventional p-type wafer for the fabrication of the thermo-piezoelectric $Si_3N_4$ cantilever arrays. Furthermore, we have developed a very simple transfer process, requiring only one step of cantilever transfer process for the integration of the CMOS wafer and cantilevers. Using this process, we have fabricated a single thermo-piezoelectric $Si_3N_4$ cantilever, and recorded 65nm data bits on a PMMA film and confirmed a charge signal at 5nm of cantilever deflection. And we have successfully applied this method to transfer 34 by 34 thermo-piezoelectric $Si_3N_4$ cantilever arrays on a CMOS wafer. We obtained reading signals from one of the cantilevers.
웨이퍼 본딩을 이용한 탐침형 정보 저장장치용 열-압전 켄틸레버어레이
김영식 ( Young Sik Kim ),장성수 ( Seong Soo Jang ),이선영 ( Sun Young Lee ),진원혁 ( Won Hyeong Jin ),조일주 ( Il Joo Cho ),남효진 ( Hyo Jin Nam ),부종욱 ( Jong Uk Bu ) 정보저장시스템학회 2005 추계학술대회논문집 Vol.2005 No.-
In this research, a wafer-level transfer method of cantilever array on a conventional CMOS circuit has been developed for high density probe-based data storage. The transferred cantilevers were silicon nitride (Si3N4) cantilevers integrated with poly silicon heaters and piezoelectric sensors, called thermo-piezoelectric Si3N4 cantilevers. In this process, we did not use a SOl wafer but a conventional p-type wafer for the fabrication of the thermo-piezoelectric ShN4 cantilever arrays. Furthermore, we have developed a very simple transfer process, requiring only one step of cantilever transfer process for the integration of the CMOS wafer and cantilevers. Using this process, we have fabricated a single thermo-piezoelectric Si3N4 cantilever, and recorded 65nm data bits on a PMMA film and confirmed a charge signal at 5nm of cantilever deflection. And we have successfully applied this method to transfer 34 by 34 thermo-piezoelectric ShN4 cantilever arrays on a CMOS wafer. We obtained reading signals from one of the cantilevers.
저전압 대회전을 위한 분리된 압전 구동기에 의한 미소거울
金成眞(Sung-Jin Kim),陳令鉉(Young-Hyun Jin),李源哲(Won Chul Lee),曺永昊(Young-Ho Cho),南孝鎭(Hyo-Jin Nam),夫鍾郁(Jong Uk Bu) 대한전기학회 2006 전기학회논문지C Vol.55 No.3
This paper presents a torsional micromirror detached from PZT actuators (TMD), whose rotational motion is achieved by push bars in the PZT actuators detached from the micromirror. The push bar mechanism is intended to reduce the bending, tensile and torsional constraints generated by the conventional bending bar mechanism, where the torsional micromirror is attached to the PZT actuators (TMA). We have designed, fabricated and tested prototypes of TMDs for single-axis and dual-axis rotation, respectively. The single-axis TMD generates the static rotational angle of 6.1˚ at 16 VDC, which is 6 times larger than that of single-axis TMA, 0.9˚. However, the rotational response curve of TMD shows hysteresis due to the static friction between the cover and the push bar in the PZT actuator. We have shown that 63.2% of the hysteresis is due to the static friction caused by the initial contact force of the PZT actuator. Without the initial contact force, the rotational response curve of TMD shows linear voltage-angle characteristics. The dual-axis TMD generates the static rotational angles of 5.5˚ and 4.7˚ in x-axis and y-axis, respectively at 16 VDC. The measured resonant frequencies of dual-axis TMD are 2.1±0.1 ㎑ in x-axis and 1.7±0.1 ㎑ in y-axis. The dual-axis TMD shows stable operation without severe wear for 21.6 million cycles driven by 16 Vp-p sinusoidal wave signal at room temperature.