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진상훈 한국민사집행법학회 2008 民事執行法硏究 : 韓國民事執行法學會誌 Vol.4 No.-
신탁이란 신탁을 설정하는 자(위탁자)와 신탁을 인수하는 자(수탁자) 사이 의 특별한 신임관계에 기하여 위탁자가 특정한 재산권을 수탁자에게 이전하 거나 기타의 처분을 하고 그로 하여금 수익자의 이익 또는 특정한 목적을 위 하여 그 재산권을 관리, 처분하게 하는 법률관계를 말한다. 그런데, 부동산에 관하여 신탁이 이루어진 경우 신탁부동산의 소유권은 수탁자에게 이전되어 위탁자의 채권자들은 신탁부동산에 대하여 강제집행을 할 수 없게 되므로 위 탁자는 강제집행을 면탈할 의도로 그 소유 부동산을 신탁할 위험성이 크고, 실제 로 채무초과 상태에 있는 위탁자가 그의 유일한 재산인 부동산을 신탁한 경우, 위탁자의 채권자들은 위 신탁이 사해행위에 해당한다고 주장하면서 수 탁자를 상대로 위 부동산에 대한 처분금지가처분 등의 법적 조치를 취하는 경우가 많다. 이 경우 신탁계약의 각 유형별 특성과 신탁 전후의 사정을 고려하여 그 신 탁이 위탁자에게 실질적인 책임재산의 증가를 가져오는지 여부에 따라 부동 산신탁의 사해행위 해당 여부를 판단해야 할 것이다. A trust is a fiduciary relationship with respect to the property created by a settlor, who entrusts some or all of his or her property to people of his choice (the trustees). The trustees are the legal owners of the trust property, but they are obliged to hold the property for the benefit of one or more individuals or organizations (the beneficiary), usually specified by the settlor. Because the creditor of the settlor can’t perform compulsory proceedings against the trust property, in many cases the settlors have used trust for avoiding compulsory execution against their property. Therefore, such disputes between the settlor and the creditor of them as cases of fraudulent transfer have rapidly increased. In these cases, a characteristic according to type of each trust and a situation of the trust contract are taken into consideration for decisions, and whether the trust increases settlor's assets substantially or not determines the validity of the trust.
진상훈,김일환 제주대학교 산업기술연구소 2000 尖端技術硏究所論文集 Vol.11 No.2
This paper presents the concept and implementation of fuzzy logic control system for variable speed drive of wound rotor induction machine. Comparison of performance obtained with a conventional PI controller and fuzzy logic PI controller in speed control loop are presented. To verify the theoretical analysis, PWM inverter system with a DSP controller is built. Computer simulation and experimental results are shown in excellent agreement.
진상훈,김일환 濟州大學校 産業技術硏究所 2000 산업기술연구소논문집 Vol.11 No.2
This paper presents the concept and implementation of fuzzy logic control system for variable speed drive of wound rotor induction machine. Comparison of performance obtained with a conventional PI controller and fuzzy logic PI controller in speed control loop are presented. To verify the theoretical analysis. PWM inverter system with a DSP controller is built. Computer simulation and experimental results are shown in excellent agreement.
Sn-Ag-Cu-X 무연솔더로 솔더링 된 접합부의 진동파괴 거동
진상훈,강남현,조경목,이창우,홍원식,Jin, Sang-Hun,Kang, Nam-Hyun,Cho, Kyung-Mox,Lee, Chang-Woo,Hong, Won-Sik 대한용접접합학회 2012 대한용접·접합학회지 Vol.30 No.2
Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.
진상훈,윤영,조유근,이상율,HyungSoo Moon,Seongho Seok,김명준,김재정,이민형 한국공업화학회 2021 Journal of Industrial and Engineering Chemistry Vol.96 No.-
Through-glass vias (TGVs) have been extensively researched due to the unique properties of glass,including low dielectric constant, high transparency, high mechanical, thermal and chemical resistance,and low cost. The TGVs are typicallyfilled with Cu by electrodeposition to make electrical connections inhigh-performance electronics with 3D integration. The Cu electrodeposition process employed tofill thethrough-holes is similar to the one used for printed circuit boards (PCBs), and defect-free Cu can beachieved with a butterflyfilling mechanism. This study introduces the defect-free Cufilling of TGVs usingpolyvinylpyrrolidone (PVP) as a leveler. The effects of PVP molecular weight on the formation ofsuppression layers on the Cu surface was examined by electrochemical analyses. It was found that thesmaller PVP (10,000 g/mol) was beneficial, forming a more compact suppression layer. In contrast, thelayer of larger PVPs (360,000 g/mol) contained a large number of defects where the accelerator couldadsorb, resulting in conformal electrodeposition. As a result, the PVP with a molecular weight of 10,000 g/mol led to defect-free butterflyfilling at TGVs with increasing thefilling performance by 20% compared tothe larger PVP.