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창원시 학동 전기 소아들의 아토피 피부염 유병률과 그 원인에 관한 연구
이종근,이호성,하진실,박동진,백도현,하권철,Lee, Jong-Keun,Lee, Ho-Sung,Ha, Jin-Sil,Park, Dong-Jin,Paik, Do-Hyun,Ha, Kwon-Chul 한국환경보건학회 2009 한국환경보건학회지 Vol.35 No.3
In the past decade there has been increasing concern about the atopic dermatitis (AD) associated with environmental diseases. AD has been increased in the last decade and known as one of the multifactoral diseases, which has the genetic background and environmental factors at the same time. The purposes of this study were to investigate the prevalence rate and etiologic risk factors of atopic dermatitis in preschool children in Changwon, which is a one of the Korean cities and has a large industrial complex. We reviewed and analyzed the statistical data, obtained from Korea National Health Insurance Corporation, related to prevalence rate by age and administrative district. A cross-sectional questionnaire survey, based on ISAAC (International Study of Allergy and Asthma in Childhood), was conducted on random samples of preschool children (5 to 8 years old) of large sized kindergartens in Changwon. The lifetime and last one years prevalence of AD in preschool children in Changwon was increased from 1998 to 2008. The prevalence rate of AD in the preschool children in Changwon city was 9.6%. The prevalence rate in boys was 9.7% and that in girls was 9.4%. The one year prevalence of AD was ranked as middle among other provincial cities in Korea in 2008. This study showed that the prevalence rate of the atopic disease in Changwon was 9% in 2008, which was increased especially compare to 2000. More active governmental approaches for control and prevention of atopic dermatitis for children are recommended. Further studies are needed for more accurate estimation of the prevalence of AD in Korea including different regional and age population.
이종근,이상용,김인구,Lee J. G.,Lee S. Y.,Kim I. G. 대한설비공학회 1987 설비저널 Vol.16 No.1
Experiments have been carried out to study the atomisation characteristics of superheated liquid(water) jet injected into the atmosphere through a single-hole nozzle. In present experi-mental range, superheated liquid jet has been observed to be atomised in two-phase effluent type; that is, spray formed by the bubble nucleation in the nozzle. In case of liquid injection through a long nozzle (L/D=29.09), the critical superheat for occurrence of two-phase effluent atomisa-tion can be determined from sudden change of spray angle. Sauter mean diameter of the spray droplets decreases as the degree of superheat increases. For the short nozzle (L/D=7.27), mean diameter increases with the injection pressure, while it decreases for the long nozzle; however for the long nozzle the effect of injection pressure is not significant compared with the short nozzle. For the short nozzle the uniformity of drop size distribution increases with increasing the degree of superheat, but for the long nozzle the effect of superheat on the uniformity is not appreciable.
열압착법을 이용한 경.연성 인쇄회로기판 접합부의 접합 강도에 미치는 접합 조건의 영향
이종근,고민관,이종범,노보인,윤정원,정승부,Lee, Jong-Gun,Ko, Min-Kwan,Lee, Jong-Bum,Noh, Bo-In,Yoon, Jeong-Won,Jung, Seung-Boo 한국마이크로전자및패키징학회 2011 마이크로전자 및 패키징학회지 Vol.18 No.2
We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$. 본 연구에서는 interlayer로 Sn을 사용하여 경성 인쇄 회로 기판(Rigid printed circuit board, RPCB)과 연성 인쇄 회로 기판(Flexible printed circuit board, FPCB) 간의 열압착 접합(Thermo-compression bonding) 조건을 최적화하는 연구를 진행하였다. 접합에 앞서 FPCB를 다양한 온도와 시간조건 하에서 Sn이 용융된 솔더 배스 안에서 침지(Dipping) 공정을 수행하였고, 열압착법을 이용하여 FPCB와 RPCB의 접합을 수행하였다. FPCB/RPCB 접합부의 접합 강도를 $90^{\circ}$ 필 테스트(Peel test)를 이용하여 측정하였다. 그 결과 $270^{\circ}C$, 1s의 침지 조건에서 FPCB의 polyimide(PI)와 Cu 전극 계면에서 파단되고, 이때, 최대 박리 강도를 얻었다. FPCB와 RPCB의 열압착 접합시 주요 변수로는 압력, 온도, 시간이 있으며, 특히 온도의 증가에 따라 접합 강도가 크게 증가하였다. 접합부 계면 관찰 결과, 접합 온도와 시간이 증가함에 따라 접합 면적이 증가하였으며, 이로 인해 접합 강도가 증가하는 것으로 사료된다. 필 테스트 과정에서 나타나는 F-x(Forcedisplacement) 곡선을 토대로 산출한 파괴 에너지와 접합 강도는 $280^{\circ}C$, 10s의 접합 조건에서 가장 높게 나타났으며, 이 조건이 최적 접합 조건으로 도출되었다.