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PGA (Pin Grid Array) 패키지의 Lead Pin의 기계적 특성에 따른 Pin Pull 거동 특성 해석
조승현,최진원,박균명,Cho, Seung-Hyun,Choi, Jin-Won,Park, Gyun-Myoung 한국마이크로전자및패키징학회 2010 마이크로전자 및 패키징학회지 Vol.17 No.1
본 논문은 $20^{\circ}$ 각도의 굽힘과 50 ${\mu}m$ 인장조건에서 PGA (Pin Grid Array) 패키지의 lead pin에 발생하는 von Mises 응력과 전 변형률 에너지 밀도를 lead pin 소재의 열처리 온도 조건에 따라 유한요소법을 이용하여 해석하였다. 해석결과에 따르면 lead pin의 코너부와 리드핀의 헤드부와 솔더의 경계면이 국부적으로 응력이 집중되는 가장 취약한 위치이며 lead pin의 열처리 온도가 높을수록 발생하는 최대 응력과 변형률 에너지 밀도가 낮아져서 신뢰성이 우수한 것으로 판단된다. 또한 lead pin의 코너부에 라운드가공을 하면 헤드부와 솔더의 경계면에서 발생하는 von Mises 응력과 전변형률 에너지 밀도가 감소하였다. 이와 같은 해석결과는 전 변형률 에너지 밀도가 증가할수록 솔더의 피로수명이 감소하는 연구결과에 미루어볼 때 열처리를 통해 리드핀의 기계적특성을 변경하면 PGA 패키지의 신뢰성을 향상시킬 수 있음을 의미한다. 따라서, 리드핀의 형상최적화와 열처리를 통한 최적화된 소재특성을 통해 PGA 패키지의 신뢰성 향상이 요구된다. In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.
고현준(Hyun-Jun Ko),박균명(Gyun-Myoung Park),이상용(Sang-Yong Lee),이동현(Dong-Hyun Lee),김남열(Nam-Youl Kim),김영근(Young-Keun Kim) 한국생산제조학회 2011 한국생산제조시스템학회 학술발표대회 논문집 Vol.2011 No.4
recent years, mobile phone keypad human-friendly products are being developed. inter alia, of the number keypad, or even if you deleted a long time or it does not cause damage. Among them, a long time in the case of the keypad numbers defaced or damaged, even if it does not occur. Because Uses by UV Molding. Almost no pollution, human-friendly substances are harmless to humans. However, one may be able to product, it is mass production of several issues. In this paper, minimizing hand and automation systems designed for mass production.
고현준(Hyun-Jun Ko),박균명(Gyun-Myoung Park),이상용(Sang-Yong Lee),이상철(Sang-Chul Lee),김영근(Young-keun Kim) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.11
semiconductor devices are transferred to a transport system, according to the present invention consists of multiple stages of the sub-stage (stage) of a plane parked on the semiconductor device between multiple. semiconductor devices to control the gap between the number of 1 tray (tray) above the transfer device to the stage as part of the Stage 1 and above the device spaced above the stage in a number of minor remind them of the semiconductor device tray and transferred to Stage 2.
고현준(Hyun-Jun Ko),박균명(Gyun-Myoung Park),김옥래(Ok-Rae Kim),송춘삼(Chun-Sam Song),김준현(Joon-Hyun Kim),김종형(Jong-Hyeong Kim) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.4
This paper aimed at the air-pad design of non-contact transfer for wafer. It is focused on precise control for minimization of pneumatic loss, prevention of wafer secession, and reduction of wafer shock during holding the wafer. Analysis are performed at design parameters of path length for hand device injection port, inlet air size, and central out let hole of air pad. The results are analyzed with effective air flow field including lifting force. It is seen that this system adopting the Bernoulli principle can be applied to non-contact transfer line through the capacity results of air pad design and negative pressure distribution by swirl creating flow field.