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여진욱,편영식 한국공작기계학회 1999 한국공작기계학회 추계학술대회논문집 Vol.1999 No.-
The purpose of the present. paper are not to develope machine tools of new concepts and advanced mechanisms but to introduce and apply new methods and concepts in the design procedure by using and changing the previously existing technologies. In this paper 3D modeller was proposed for designing machine tools and the design automation software(DesignMecha 2000) was used. 3D modeller enabled more fast design and the better manufacturability checking than 2D one so that design error was dramatically reduced. As designer may easily understand the real shape of a part and assembly object, it's easy to draw the drawings not only in a conceptual design but also in a detailed design. Also, design automation software enabled designer to consider the real important design parameters by reducing time to spend in estimating and calculating the strength of the model by the computer aided automatic calculation instead of a tedious and complex: calculation by manual method and help him to easily make the decision for selecting the stocks and design the structure of part or unit of machine tools.
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손성우,김일수,정재원,김지선,나현호 한국공작기계학회 2009 한국공작기계학회 춘계학술대회논문집 Vol.2009 No.-
The weld-bead geometry in stainless steel produced by GTAW(Gas Tungsten Arc Welding) plays an important role in determining the mechanical properties of the weld and its quality. However, due to various welding parameter of GTAW(Gas Tungsten Arc Welding) process, it was difficult that optimum welding condition conclusion satisfied welding quality. In this paper we describe an experimental method for optimum welding properties using Genetic algorithm. Genetic algorithm was applied to decide optimum welding parameters. Genetic algorithm was created random welding condition and selected probability concept for optimization of welding condition.
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박재용,황승민,임민규,오영규,박재용,한석영 한국공작기계학회 2009 한국공작기계학회 춘계학술대회논문집 Vol.2009 No.-
This paper presents a reliability-based topology optimization (RBTO) using bi-directional evolutionary structural optimization (BESO). An actual design involves uncertain conditions such as material property, operational load and dimensional variation. Deterministic topology optimization (DTO) is obtained without considering of uncertainties related to the uncertainty parameters. However, the RBTO can consider the uncertainty variables because it has the probabilistic constraints. In this paper, the reliability index approach (RIA) is adopted to evaluate the probabilistic constraint. RBTO based on BESO starting from various design domains produces a similar optimal topology each other. Numerical examples are presented to compare the DTO with the RBTO.
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서정석 한국공작기계학회 2009 한국공작기계학회 춘계학술대회논문집 Vol.2009 No.-
The low temperature bonding have been developed for production techniques of the next generation industries such as Flexible display, OLED(Organic Light-Emitting Diode), Biochip, Flip chip etc. Ultrasonic metal welding using ultrasonic vibrations and pressure is one of the low temperature bonding. It is simple, economical and environmental rather than other welding. Finite element analysis (FEA) using ANSYS was used to study for optimal design in the manufacturing of ultrasonic metal tool : Horn. Design of the Horn is performed by the FEM analysis. These analysis results can be used for optimal design of Horn.
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서정석 한국공작기계학회 2009 한국공작기계학회 춘계학술대회논문집 Vol.2009 No.-
This paper describes an experimental study on ultrasonic metal welding of Ni and Cu. There are severl welding techniques which are expected to replace other welding processes. In this study the relation welding pressure and energy density in welding certain types of Ni and Cu. The ultrasonic welding of Ni and Cu can be accomplished when the conditions of amplitude : 60%, welding pressure : 0.2MPa, time : 0.12s. These optimal conditions can be used for ultrasonic metal welding.
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몰드물성 및 Chip의 크기차이에 따른 웨이퍼 레벨 SiP에 대한 열 피로 해석 모사
김성걸,김주영,정호동,김재호 한국공작기계학회 2009 한국공작기계학회 춘계학술대회논문집 Vol.2009 No.-
This paper describes in detail the life prediction models, and simulation of thermal fatigue under different mold compounds and chip sizes for wafer level embedded SiP. A 3D Finite element model was built to simulate the viscoplastic behaviors for mold compounds and chip sizes. Especially, bonding parts between mold and Silicon Nitride(Si₃N₄) were carefully modelled and distribution of strains was studied. Three different chip sizes were used and the effects of mold compounds were observed. Consequently, this numerical study shows that type-A has better fatigue life than other mold compounds. Also, 4×4 size chip has a shorter life than 6×6 and 8×8 size.
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