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디지털 홀로그래피를 이용한 포토리소그래피 공정 제품 패터닝의 폭과 단차 측정
신주엽(Ju Yeop Shin),강성훈(Sung Hoon Kang),마혜준(Hye Joon Ma),권익환(Ik Hwan Kwon),양승필(Seung Pil Yang),정현철(Hyun Chul Jung),홍정기(Chung Ki Hong),김경석(Kyeong Suk Kim) 한국비파괴검사학회 2016 한국비파괴검사학회지 Vol.36 No.1
반도체 산업은 우리나라 주력산업중 하나로 매년 꾸준한 성장세를 보이며 지속적인 성장을 하고 있다. 이러한 반도체 산업에서의 중요한 기술은 소자의 고 집적화이다. 이는 면적당 메모리 용량을 증가시키는 것으로 핵심역할을 하는 것이 바로 포토리소그래피 기술이다. 포토리소그래피란 마스크의 표면에 빛을 쬐어 생기는 그림자를 웨이퍼 상에 인쇄하는 기술이며 반도체 제조공정에서의 가장 중요한 공정이다. 이러한 공정을 통해 나온 패터닝을 분석 시에 폭과 단차의 균일성을 측정한다. 이에 따라 본 논문은 포토리소그래피 공정이 적용된 시험편 패터닝에 폭과 판 사이와의 단차를 투과형 디지털 홀로그래피를 구성하여 측정하고자 한다. 투과형 디지털 홀로그래피 간섭계를 구성하고 시험편에 임의의 9포인트를 설정하여 각 포인트를 측정하고 상용장비인 SEM (scanning electron microscopy)과 alpha step으로 측정한 결과와 비교하고자 한다. 투과형 디지털 홀로그래피는 측정시간이 타 기법에 비에 짧다는 장점과 배율렌즈를 사용하기 때문에 저 배율에서 고 배율로 변경하여 측정할 수 있는 장점을 가지고 있다. 실험 결과로부터 투과형 디지털 홀로그래피가 포토리소그래피가 적용된 패터닝 측정에 유용한 기술임을 확인할 수 있었다. The semiconductor industry is one of the key industries of Korea, which has continued growing at a steady annual growth rate. Important technology for the semiconductor industry is high integration of devices. This is to increase the memory capacity for unit area, of which key is photolithography. The photolithography refers to a technique for printing the shadow of light lit on the mask surface on to wafer, which is the most important process in a semiconductor manufacturing process. In this study, the width and step-height of wafers patterned through this process were measured to ensure uniformity. The widths and inter-plate heights of the specimens patterned using photolithography were measured using transmissive digital holography. A transmissive digital holographic interferometer was configured, and nine arbitrary points were set on the specimens as measured points. The measurement of each point was compared with the measurements performed using a commercial device called scanning electron microscope (SEM) and Alpha Step. Transmission digital holography requires a short measurement time, which is an advantage compared to other techniques. Furthermore, it uses magnification lenses, allowing the flexibility of changing between high and low magnifications. The test results confirmed that transmissive digital holography is a useful technique for measuring patterns printed using photolithography.
ESPI에 의한 복합재 적층판의 섬유방향에 따른 진동모드해석
김경석(Kyung-Suk Kim),윤철성(Choul-Sung Youn),강기수(Ki-Soo Kang),양승필(Seung-Pil Yang) 대한기계학회 2002 대한기계학회 춘추학술대회 Vol.2002 No.5
This study discusses a non-contact optical technique, electronic speckle pattern interferometry, that is well suited for vibration analysis without the need of any contacting. Composite plates must be considered with vibration characteristics but most of piling sequence of composite plates for mechanical design consider tensile characteristics. Although a paper said that fiber direction effect vibration mode shape variation, this problem is not inspected exactly until now. So this paper searches the cause as compared with 3 types of uni-directional composite plates
레이저 스페클간섭법에 있어서 스페클크기와 측정 한계에 관한 연구
윤성운,김경석,양승필,정현철,김정호,이도윤 한국공작기계학회 1996 한국생산제조학회지 Vol.5 No.1
The high coherence of laser beam has made it possible to observe interference effects even in the light scattered from rough surfaces. That's why, when object with a scattering surface is illuminated with laser light, we do see a speckled appearance due to random interference. This sort of unique property of laser speckle has brought into existence the new noncontacting techniques such as speckle metrology method of measuring deformation, displacement, and vibration etc of objects with high optical sensitivity. The measurable range of speckle metrology especially used to measure in-plane information, however, is limited by some factors, the so-called strain, rotation, tilt of surface and out of displacement perpendicular to the plane of analysis. This restrictions severly limits the measurable range of speckle metrology by causing the decorrelation of speckle patterns. It is the purpose of this paper to give a survey on the measurable limitation of speckle photography method that is one of speckle metrology. Namely we will discuss the mutual relationships and problems of each limitations adding the restriction of the largest and smallest displacement measurable with speckle methods.
광학적 비접촉 측정에 의한 구조물에 해석의 화상처리 계측 시스템 개발에 관한 연구
장순석,김경석,양승필,정현철,강기수,김종수,최지은 한국공작기계학회 1999 한국생산제조학회지 Vol.8 No.6
This study discusses a non-contact optical technique, electronic speckle pattern interferometry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. However, the existing ESPI methods that are based on dual-exposure, real-time and time-average method have difficulties for accurate measurement of structure, due to irregular intensity and shake of phase. Therefore, phase shifting method has been proposed in order to solve this problem. About the method, the pah of reference light in interferometry is shifted and added to least square fitting method to make the improvement in distinction and precision. This proposed method is applied to measure in-plane displacement, that is compared with the previous method. Also, Used as specimen, AS4/PEEK [30/-30/90]s was analyzed by ESPI based on real-time to determine the characteristics of vibration under no-load and tension. These results are quantitatively compared with those of FEM analysis in mode shapes.