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응급실을 방문한 노인 환자의 저나트륨혈증 유병률 및 위험인자 분석
김건년,신상미,서예원,남궁형욱,이정화,김은경,이주연 한국임상약학회 2022 한국임상약학회지 Vol.32 No.2
Objectives: Hyponatremia is prevalent electrolyte disorder and can be fatal in older adults. Evaluative studies on hyponatremiaamong older adults are scarce, especially targeting for those who visited emergency department (ED). We aimed to estimate theprevalence and to identify risk factors of hyponatremia among elderly patients visiting the ED. Methods: A retrospective chartreview was completed including 65 or older patients who visited ED at Seoul National University Bundang Hospital fromSeptember to December 2019. Patients with the serum sodium concentration of less than 130mEq/L was defined as a hyponatremiagroup. Logistic regression analysis was conducted to assess predictive factors for hyponatremia. Results: Of the total 2,445 patients,155 (6.3%) were confirmed to have hyponatremia at the time of ED visits. Risk factors for hyponatremia identified in logisticregression analysis were thiazides (aOR=2.64, 95% CI 1.66-4.21), opioids (exclude tramadol) (aOR=3.45, 95% CI 1.72-6.94), anddesmopressin (aOR=6.98, 95% CI 2.45-19.84). Compared to the use of thiazides alone, it was confirmed that the possibility ofhyponatremia was more than quadrupled when proton pump inhibitor (PPI) was used together (aOR=4.08, 95% CI 1.74-9.55). Conclusions: About 6.3% of older adults visiting the ED had hyponatremia. Age, number of medications taken, previous history ofhyponatremia, heart failure, cirrhosis, pneumonia, sepsis, prescribed drugs including thiazides, opioids (exclude tramadol), ordesmopressin or taking PPI together with thiazides was confirmed to correlate with the risk of hyponatremia.
김건년,이보나,박효덕,신상모,이근혁,권혁채 경북대학교 센서기술연구소 1998 센서技術學術大會論文集 Vol.9 No.1
In this paper, we studied the anodic bonding of 5-inch silicon and #7740 Pyrex glass wafers with a thickness of 3mm by using the EV501 bonder and the Karl Suss SB6 bonder. The test conditions for anodic bonding of the EV501 bonder system with a full field electrode were temperature of 400 ℃ and voltage of 800V in a chamber pressure of 1X10^(3)mbar. The SB6 bonder with a star shaped electrode was tested at the temperature and voltage of 450 ℃ and 1300V in the atmosphere, respectively. As the results of test, we obtained the void free samples regardless of shape of substrates such as etched wafers with cavities and drilled glasses with holes.
Si Bulk Micromachining을 위한 Wafer Rolling Etching 및 그 특성
김건년,이보나,박효덕,신상모,공경준,장동근,김병철,권혁채,이봉희 경북대학교 센서기술연구소 1998 센서技術學術大會論文集 Vol.9 No.1
A wafer rolling etching system for the silicon bulk micromachining has been designed and fabricated. The silicon diaphragms were anisotropically etched in a 24.5 weight percent KOH solution. Compared to the conventional KOH etching systems, pyramidal hillocks, and wave-shaped structures on the etched surfaces were greatly reduced by using this system. After etching for time of 438 minutes, the average etched depth and the etch-rate were measured to be 537μm and 1.22μm/min, respectively. The average etching uniformity of etching depth was 0.87% in 5-inch wafer. Our results showed that the wafer rolling method enhanced etch uniformity and etch rate.
김건년(Kim, Gun-Nyeon),이명식(Lee, Myeong-Sik) 대한건축학회 2021 대한건축학회 학술발표대회 논문집 Vol.41 No.2
Currently, due to the lack of manpower and workers’ construction experience at the construction site, it is difficult to clearly review the drawing specification and construction problems frequently occur during the progress. Not only that, clear management of materials used in the field is also difficult. For this reason, more than 10 years after BIM was introduced, many construction companies are making various attempts to introduce BIM. However, applying the construction BIM to date is a big burden to them in terms of time and cost. So they are loo king for an operation plan to obtain the desired effect at a minimum cost. Therefore, this study analyzed the use and effect of BIM in the field based on practical cases, and through this, it is intended to help construction companies establish BIM application processes.
바이폴라 공정을 이용한 압력센서용 출력전압 보상회로의 설계
이보나,김건년,박효덕 ( Bo Na Lee,Kun Nyun Kim,Hyo Derk Park ) 한국센서학회 1998 센서학회지 Vol.7 No.5
In this paper, integrated pressure sensor with calibration of offset voltage and full scale output and temperature compensation of offset voltage and full scale output were designed. The signal conditioning circuitry are designed that calibrate the offset voltage and full scale output to desired values and minimize the temperature drift of offset voltage and full scale output. Designed circuits are simulated using SPICE in a bipolar technology. The ion implanted resistor of different temperature coefficient were used to trimming the desired values. As a results, offset voltage was calibrated to 0.133V and the temperature drift of offset voltage was reduced to 42 ppm/℃. Also, the full scale output was calibrated to 4.65V and the temperature coefficient of full scale output was reduced to 40ppm℃ after temperature compensation.
이유진,김건년,박효덕,이종홍 호서대학교 반도체제조장비국산화연구센터 2001 반도체장비학술심포지움 Vol.2001 No.-
실리콘 마이크로머시닝 기술과 바이폴라 공정으로 집적화된 압력센서를 제작하고 동작특성 평가를 수행하였다.센서부 보상파라미터를 추출하였고 트리밍 공정을 통하여 출력전압의 보상을 수행하였다.센서 특성은 압저항 위치, 마스크 정렬 오차, 다이어프램 정밀두께제어 정도, 보호막의 과도식각 정도 등에 의하여 민감하게 좌우됨을 알 수 있었다.웨이퍼별 샘플추출을 통하여 센서부 감도는 평균 0.653mV/kPa, 감도의 온도계수는 -2078.8ppm/℃, 옵셋전압은 30.78mV, 옵셋전압의 온도계수는 32.11uV/℃로 측정되었다.추출된 샘플의 다이어프램 두께오차는 27±2.5㎛였다.센서부 특성평가 결과를 통하여 신호처리회로의 옵셋 및 스팬보상, 온도보상을 위한 트리밍 공정을 수행한 결과 개발사양을 만족하는 결과를 얻을 수 있었다.
집적화된 실리콘 압력센서의 출력전압 보상파라미터 추출 및 그 특성
이보나,김건년,박효덕,신상모,이경탁,김찬,권혁채,이상조,박현주 경북대학교 센서기술연구소 1998 센서技術學術大會論文集 Vol.9 No.1
An integrated silicon pressure sensor has been designed, fabricated and tested. The signal conditioning circuits were designed to include calibration and temperature compensation of output voltage through trimming of diffusion and ion-implanted resistors. Before trimming of resistors, the compensation parameters such as pressure sensitivity, temperature coefficient of pressure sensitivity, temperature coefficient of piezoresistors and pressure sensitivity of piezoresistors were measured. Then offset voltage, span, and temperature coefficients of offset voltage and span were calibrated by trimming of resistors. The measured output voltage met our design specification and simulation value above room temperature. But, the measured output voltage at -30°C deviated from our design specification and simulation value because the offset voltages were found to vary randomly as a function of temperature.