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Coating with boron nitride on SiC fiber using atomic substitution
Woo‑Seong Tak,Jin‑Uk Hwang,Young‑Keun Jeong,Woo‑Sik Kim 한국세라믹학회 2020 한국세라믹학회지 Vol.57 No.2
To increase the mechanical properties of ceramic matrix composite, it is important that formation of lubricant layer for crack deflection between matrix and fiber. Therefore, we fabricated uniform boron nitride (BN) lubricant layer using atomic substitution method. Silicon carbide (SiC) fiber surface was modified with amine groups using (3-amonipropyl)triethoxysilane to coat SiC fiber with BN as a solid lubricant. Then, surface was coated with graphene oxide (GO). Boric acid powder was supplied to the GO-coated fibers and the samples were heat-treated at 1200–1400 ℃ under N2 and NH3 atmospheres. An uniform BN layer could be coated on SiC fiber with 10 nm-1.11 μm. Crystallinity and thickness of BN layer could be controlled by reaction temperature. It was also confirmed that crystalline BN formed under process conditions of higher than 1400 ℃.
야뇨증 환아들의 심리사회적 특성에 대한 다기관 연구 : 행동 및 정서 문제를 중심으로
조수철,김재원,신민섭,황준원,한상원,박관현,이상돈,김경도,김건석,서홍진,이유식,정재용,김영균,문두건,남궁미경,한창희,조원열,김영식,배기수,이종국,정우영,신의진 大韓神經精神醫學會 2005 신경정신의학 Vol.44 No.6
Objectives : The aim of this study was to examine the behavioral and emotional problems associated with nocturnal enuresis in Korean children. Methods : Three hundred eighteen children with nocturnal enuresis, together with their parents, completed the Child Behavior Checklist (CBCL), Disruptive Behavior Disorder Scale according to DSM-IV (DBDS), Children's Depression Inventory (CDI), State-Trait Anxiety Inventory for Children (STAIC), and Piers-Harris Children's Self-Concept Scale (PHCSC). Ninety-three normal students were selected as the control group. Results : Compared to the normal control group, the mean scores with regard to the withdrawn, social problems, attention problems, delinquent behavior, aggressive behavior, externalizing problems and total problems profiles were significantly higher in the nocturnal enuresis group according to the CBCL results. The nocturnal enuresis group also scored significantly higher in the ADHD and ODD profiles of the DBDS. The nocturnal enuresis group was more depressed and anxious than the control group according to the results of the CDI and STAI. The mean score of the PHCSC was significantly lower in the nocturnal enuresis group when compared to the normal control group. Conclusion : The results of this study suggest that children with nocturnal enuresis in Korea have clinically relevant behavioral and emotional problems. The findings support the link between nocturnal enuresis and psychopathology in Korean children.
우숙희,정국동,최송표,조근자,양은진,김수일,박경란,이영호,김원식 충남대학교 의과대학 지역사회의학연구소 1998 충남의대잡지 Vol.25 No.1
Fingerprint patterns of 333 schizophreniacs who met with the diagnostic criterias of International Pilot Study of Schizophrenia except items associated with chronicity in exclusion criteria were studied, and the following results were obtained. 1. The frequency distribution of the fingerprint patterns in the 333 schizophreniacs was ulnar loop, whorl, twinned loop, arch, radial loop in order in both control and schizophrenia groups. 2. Finger ridge counts of both sexes were decreased significantly in schizophrenia group. 3. Dissociation of fingerprint pattern in the schizophrenia group was 51.1%, which was far greater than 6.25% of control group. Number of dissociation was greatest in the thumb, followed by index, middle, ring, and little finger in order. According to the above results, it is considered that both the number of finger ridges and degree of dissociation of fingerprint patterns were closely related with schizophrenia. Analysis of fingerprints and palmprints with the aid of chromosomal analysis would contribute the early diagnosis and prevention of schizophrenia.
우성식,김영로,김우진 弘益大學校 科學技術硏究所 1996 科學技術硏究論文集 Vol.7 No.1
Tensile elongation behavior of fine-grained Fe-C alloys has been investigated as a function of cementite volume fraction, degree of microstructural refinement or Zener-Hollomon parameter. Creep strength of Fe-C alloys is compared to be similar when grain size is similar. Room-temperature strength, however, turned out to be quite different, depending on the volume of cementite. Tensile ductility of ingot-processed alloys increases with carbon content (cementite volume fraction of cementite) but starts to decrease after 2.1%. Tensile ductility of Fe-C alloys with carbon content higher than 2.1% can be significantly enhanced when powder-processing routes are utilized instead of ingot-processing routes. Tensile elongation behavior of cementite-based alloys is revealed to be different from that of iron-based alloys when compared as a function of Zener-Hollomon parameter.
폐농양 및 복부농양을 일으킨 Eikenella corrodens 감염 2예 : Two Case Reports and Review
정용희,류미숙,김영식,이우인,이희주,서환조 대한화학요법학회 2000 대한화학요법학회지 Vol.18 No.1
Eikenella corrodens is a slowly growing, facultative anaerobic gram-negative bacillus. It is a normal inhabitant of the human upper respiratory tract, and it is recognized as an infrequent cause of invasive disease. To date, a few cases of E. corrodens infection were noted from all other organ. We report herein two cases of E. corrodens infection. In one case E. corrodens was isolated in the lung abscess and in the other case it was in the appendiceal abscess. The patients were treated empirically with penicillin G. The results of the bacterial culture and sensitivity test were available with it. The patients were discharged 15 days later with marked improvement after treatment. Our report clearly demonstrates that E. corrodens can be the pathogen of lung abscess and intraabdominal abscess. We reviewed descriptions from the literature of infections caused by E. corrodens.
이우선,이영식,손동민 조선대학교 에너지.자원신기술연구소 2002 에너지·자원신기술연구소 논문지 Vol.24 No.2
A Study on wafer non uniformity characteristic improvement using Cu CMP were studied. Chemical mechanical polishing of copper has been studied on a platen polisher by using an experimental copper slurry containing alumina oxide as the abrasive component. In order to understand the process, a design of experiment was conducted. From the experiment, the effects of polishing parameters such as polishing pressure, platen speed, and speed of wafer carrier on the removal rate of copper and the uniformity in copper removal were calculated and discussed. From the relative velocity modeling, all points on the wafer would have the same relative velocity if the platen rotation speed equals that of the wafer carrier. During polishing, pad temperature and copper removal rate were both lineally dependent on the product of rotation speed and polishing pressure. Some incremental polishing experiments were carried out to study the mechanism of copper CMP as a function of polishing time. I t has been demonstrated that copper CMP starts with surface smoothing instead of significant material removal. In this study, WIWNU of silicon wafer and parameter of Cu CMP were presented.