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스마트카의 인포테인먼트 시스템을 위한 감성기반 인공지능 서비스 컨셉 개발 연구
박현섭(Hyunseop Park),최준혁(Junhyuk Choi),백지훈(Jihoon Baek),공도현(Dohyeon Kong),조현보(Hyunbo Cho) 한국HCI학회 2019 한국HCI학회 학술대회 Vol.2019 No.2
최근 스마트카 산업이 발달함에 따라 차량용 인포테인먼트 시스템 개발 경쟁이 치열해지고 있다. 치열한 경쟁 속에서 감성기반 인공지능 서비스 도입을 통한 차별화의 필요성도 커지고 있다. 그러나, 사용자의 니즈를 고려하지 않은 채 섣불리 서비스를 상용화한다면 큰 실패로 이어질 수 있다. 따라서, 사용자의 니즈를 선제적으로 고려하여 체계적으로 인공지능 서비스 컨셉을 개발하는 것이 필요하다. 본 연구는 5-level 인공지능 서비스 모델 기반 인공지능서비스 개발 Framework 를 설계했으며, 이를 스마트카의 인포테인먼트 시스템을 위한 감성기반 인공지능 서비스 개발에 활용했다. 연구 결과로 36 개의 감성기반 인공지능 서비스 대안이 도출되었고 이 중 ‘탑승자 취향 기반 최적의 경로 추천 서비스’, ‘탑승자 취향 기반 주변 맛집 추천 서비스’ 등이 높이 평가되었다. 마지막으로, 선정된 인공지능 서비스 대안들을 종합하여 감성기반 인공지능 서비스 컨셉을 개발했다.
Kim Hyeon Seong,Park Jae Hyeon,Lee Ho Seok,Lee Jae Young,Jung Ji Won,Park Si-Bog,Hyun Dong Jin,Park Sangin,Yoon JuYoung,Lim Hyunseop,Choi Yun Young,Kim Mi Jung 대한의학회 2021 Journal of Korean medical science Vol.36 No.12
Background: Spinal cord injury (SCI) is a serious clinical condition that impacts a patient's physical, psychological, and socio-economic status. The aim of this pilot study was to evaluate the effects of training with a newly developed powered wearable exoskeleton (Hyundai Medical Exoskeleton [H-MEX]) on functional mobility, physiological health, and quality of life in non-ambulatory SCI patients. Methods: Participants received 60 minutes of walking training with a powered exoskeleton 3 times per week for 10 weeks (total 30 sessions). The 6-minute walking test (6MWT) and timed-up-and-go test (TUGT) were performed to assess ambulatory function. The physiological outcomes of interest after exoskeleton-assisted walking training were spasticity, pulmonary function, bone mineral density, colon transit time, and serum inflammatory markers. Effects of walking training on subjective outcomes were estimated by the Korean version of the Falls Efficacy Scale—International and the 36-Item Short-Form Health Survey version 2. Results: Ten participants finished 30 sessions of training and could ambulate independently. No severe adverse events were reported during the study. After training, the mean distance walked in the 6MWT (49.13 m) was significantly enhanced compared with baseline (20.65 m). The results of the TUGT also indicated a statistically significant improvement in the times required to stand up, walk 3 m and sit down. Although not statistically significant, clinically meaningful changes in some secondary physiological outcomes and/or quality of life were reported in some participants. Conclusion: In conclusion, this study demonstrated that the newly developed wearable exoskeleton, H-MEX is safe and feasible for non-ambulatory SCI patients, and may have potential to improve quality of life of patients by assisting bipedal ambulation. These results suggest that the H-MEX can be considered a beneficial device for chronic non-ambulatory SCI patients.
Park, Sunjoon,Im, Seokyeon,Lee, Hyunseop Korean Tribology Society 2017 한국윤활학회지(윤활학회지) Vol.12 No.1
SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.
Span Length Variance Effect on the Fatigue Life of FRP Bridge Deck
Park, Ki-Tae,Yu, Young-Jun,Shin, Hyunseop Hindawi Limited 2013 Advances in materials science and engineering Vol.2013 No.-
<P>Fiber reinforced composite materials have the merits of light weight and durability for bridge deck and are estimated to be superior in economy to conventional deck materials considering the life-cycle cost of bridge. In this study, fatigue tests were conducted for the span lengths of 2.0 m and 2.5 m in order to investigate the change trend of fatigue characteristics of composite material deck according to the change in the span length. The result showed that the fatigue life rapidly reduces to about 25% when the span increases by 25%. However, considering that the fatigue performance safety margin was approximately 1.6 times more than the design axle load of the DB-24 design truck load in Korea, even at the span of 2.5 m, it is judged that the FRP decks being considered can be effectively used at a span length of 2.5 m.</P>
Sunjoon Park,Seokyeon Im,Hyunseop Lee 한국트라이볼로지학회 2017 한국트라이볼로지학회지 (Tribol. Lubr.) Vol.33 No.6
SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) microstructures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.