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      • 하드웨어 소프트웨어 통합 설계 환경에서 소프트웨어 힘수부를 하드웨어로 구현하는 기법에 대한 연구

        차지은;엄성용 서울여자대학교 컴퓨터과학연구소 2004 정보기술논문지 Vol.2 No.-

        하드웨어는 속도 면에서 우수하나 구현상 공간적 제약이 따른다 소프트웨어는 속도 면에서는 느리나 구현이나 공간적 제약이 비교적 적다. 하드웨어와 소프트웨어를 통합하여 하나의 시스템으로 구현할 경우 각각의 단점을 최소화하고 장점을 최대한 살릴 수 있으나, 각각의 구현 관점이 서로 달라 이들을 통합하는 데에 많은 기술적 어려움이 따른다. 최근 하드웨어 소프트웨어 통합 시스템 관련 기술의 발달로 관련 연구도 활발하게 이루어지고 있다. 소프트웨어로 구현된 시스템의 일부를 통합 설계 환경에 맞도록 하드웨어로 재설계하는 데에는 수작업으로 인한 시간과 비용이 많이 들고 구현된 범위가 최적이 아닐 경우 새로운 구현 범위를 재설계 하는 등 시스템 설계에 부담이 크다. 이러한 부담을 줄이기 위해 하드웨어 소프트웨어 통합 설계 환경에서 소프트웨어 시스템 일부를 하드웨어로 자동 변환하는 기능이 필요하다 본 논문은 이러한 필요성에 의해 C 언어로 구현된 시스템의 일부를 Verilog로 자동 변환하기 위한 규칙과 변환된 하드웨어 시스템이 소프트웨어와 통신하는 데에 필요한 규칙을 찾는 것에 중점을 두었다. 특히, 소프트웨어와 하드웨어 간의 전역변수와 같은 공동 사용 변수의 데이터를 주고받는 규칙을 연구하였다. 이 규칙은 이후 하드웨어 소프트웨어 통합 설계 환경 관련 응용 프로그램 개발 시 참조되어질 수 있다. Hardware is superior in speed aspect but there are implemental or spacial restrictions. Software is slow in speed aspect but there are comparatively less restrictions of implementation and space. An implementation by single system integrating hardware and software, can minimize each shortcoming and maximize an advantage, but because each implementation viewpoint differs, much technological difficulties follow integrating these. Related research is consisting actively(vigorously) by the advance(development) of hardware software integration system connection technology recently. Related research is consisting actively by the advance of the technology which relates hardware software integration system. To redesign by hardware to take part of system that is implemented to software in integration design environment, is taking a lot of time and effort(is taxing the time and cost) by manual implementation, have to redesign new implementation area in case is not most suitable. Need function that change automatically software system part to hardware in hardware software integration design environment to down these overhead. This paper focus into finding rule that rule converted hardware system to change automatically part of system that is implemented in C language by these necessity to Verilog need though communicate with software. Specially, studied rule that exchange data of common using variable like thee(that is) global variable between software and hardware. This rule can be refered when develop after this relating application program with hardware software integration design environment.

      • 실리콘 웨이퍼 폴리싱 패드의 수명과 드레싱 결함의 관계에 관한 연구

        차지완,이은상 한국공작기계학회 2009 한국공작기계학회 춘계학술대회논문집 Vol.2009 No.-

        Polishing process of Si wafer is a momentous stage during the semiconductor process of manufacture. A surface condition of fabricated Si wafer influences in inferiority rate of final semiconductor products. Among the major factors of wafer polishing process, polishing pad surface roughness and a degree of plastic deformation have an effect of polished wafer surface quality. A pad should be maintained its machining ability during the polishing process. However, capability of pad is reduced when polishing time is increased. Dressing and conditioning process on a polishing pad is needed for the preservation of pad surface condition. In this study, an influence of dressing defect was investigated during the Si wafer polishing process. When the dressing process was not supplied, pad surface quality was analyzed by using SEM images, pad surface roughness variation and temperature variation on the polishing pad. And the relationship between Si wafer polishing pad lifetime and dressing defect was evaluated.

      • 저장온도 0,15 및 30℃에서 계육의 핵산관련물질과 관능성의 사후변화

        이지은,정인철,차경숙,김명준,문윤희 慶星大學校 1995 論文集 Vol.16 No.3

        This study was carried out to investigate changes of nucleotide related compounds and sensory property by freshness index of chicken meat during stored at 0, 15 and 30℃. In case of chicken meat stored at 0, 15 and 30℃, ATP+ADP, AMP and IMP was decreased, HxR and Hx was increased gradually. And such situation was higher in high temperature. But the amount of nucleotide related compounds was hard to decide freshness. The result of freshness estimated by sensory score was fresh to 9 days at 0℃, to 3 days at 15℃ and to 18 hours at 30℃ generally.

      • KCI등재

        방과 후 감각통합프로그램(감각통합치료)이 학교에서의 기능적 과제 수행에 미치는 효과

        박지훈,이은정,노종수,이향숙,차정진 대한감각통합치료학회 2010 대한감각통합치료학회지 Vol.8 No.1

        Objective : This study is designed to identify effect of a sensory integration(SI) program provided to elementary school students as an after-school activity. The study is looking at both occupational performance components and school-task performance which is an area of occupational performance. Methods : SI program specially designed as an after-school activity was provided to three boys who are first- or second grade students of Y elementary school in Dae-Jeon city. The SI intervention was organized with 25 sessions and carried out for two months. One group pretest-posttest design was used to evaluate the effectiveness of the SI program. Measurements used are Short Sensory Profile(SSP), K-DTVP-2, and BOTMP for occupational performance components, and School Function Assessment for functional schooltask performance. Results : It is found that posttest scores were enhanced in all assessments SSP; BOTMP; K-DTVP-2; and SFA. Conclusion : Results of this study simply propose that sensory integration program designed as after-school activity may have positive effects on not only occupational performance components but also on school-task performance of elementary school student. Since sample size is too small, however, there is limitation to find statistical significance. Further researches testing large number of subjects are required to boost the finding of this study. 목적 : 본 연구는 학교 방과 후 활동으로 감각통합치료를 제공하였을 때 작업수행요소와 더불어 작업수행영역인 학교에서의 기능적 과제수행에 미치는 영향을 알아보기 위하여 실시하였다. 연구 방법 : 실험은 대전 Y초등학교에 재학 중인 1-2학년 아동 3명을 대상으로 방과 후 활동 시간에 감각통합치료를 제공하였으며, 중재는 2010년 5월과 6월에 걸쳐 총 25회를 제공하였다. 감각통합치료효과를 알아보기 위해 단일집단 사전-사후 설계(one group pretest-posttest design)를 사용하였고, 작업수행요소에서의 변화를 알아보기 위하여 단축감각프로파일(SSP), 한국판 시지각 발달검사(K-DTVP-2), Bruininks-Oseretsky Test of Motor Proficiency 1(BOTMP)를 사용하였으며, 작업수행영역에서의 변화를 알아보기 위하여 학교에서의 기능적과제 수행능력에 대한 평가(School Function Assessment)를 사용하였다. 결과 : 방과 후 감각통합프로그램(감각통합치료)을 적용한 결과 대상아동들은 작업수행요소인 단축감각력(SSP), BOTMP, 한국판 시지각 발달검사(K-DTVP-2)의 수치상 향상을 보였으며, 작업수행영역인 학교에서의 기능적 과제 수행(SFA)의 점수에서도 향상을 보였다. 결론 : 본 연구를 통해 방과 후 감각통합프로그램(감각통합치료)이 작업수행요소와 학교에서의 기능적 과제수행에 긍정적인 영향을 미친다는 것을 보여주었지만, 대상의 수가 적어 통계적 유의성을 찾는 데는 한계가 있었다. 따라서 향후 연구에서는 대상자의 수를 고려한 연구들이 필요할 것으로 사료된다.

      • 가상환경을 위한 효율적인 3차원 협동 저작 기법

        최명아,차지은,유지현,엄성용 서울여자대학교 컴퓨터과학연구소 2003 정보기술논문지 Vol.1 No.-

        In this paper, we propose a new 3-dimensional cooperative authoring tool the environments. In this method, we clearly define the roles of authors Involved In the cooperation and extend the functionality of the each client system, and thus reducing the overload in server systems and/or the network bottleneck than existing client-server models, while minimizing the locking delays of the existing pessimistic locking mechanism. In addition, we use scene-graphs of Java 3D to represent the rapidly changing scenes vividly 본 논문에서는 새로운 3차원 협동 저작 기법에 대해 설명한다. 이 방법에서는 협동 저작에 참여하는 작업자에 대한 명확한 역할 구분과 클라이언트의 기능 확장을 통해, 기존의 클라이언트-서버 구조가 갖는 서버 부담 및 네트워킹 병목 현상을 완화하는 한편, 기존의 '비관적 잠금 기법'에서 발생하는 작업 공유에 따른 불필요한 대기 시간을 줄인다. 또한 자바 3D의 '장면 그래프'를 이용하여 장면을 표현함으로써 실시간 장면 정보의 변화를 빠르고 쉽게 반영하였다.

      • 연속전해드레싱을 적용한 래핑을 이용한 Y₂O₃가공특성에 대한 연구

        황성철,차지완,이은상 한국공작기계학회 2008 한국공작기계학회 추계학술대회논문집 Vol.2008 No.-

        Recently, application of ceramics has increased gradually due to excellent mechanical properties. Y₂O₃ has been more observed as a fine ceramics having great material properties; high light transparency, excellent thermal resistance and chemical inertness. Therefore prospects of Y₂O₃ have been more extended as a great promising material for optical, electronic and mechanical purpose. But for the effective application of Y₂O₃, it is need to overcome the imperfection of hard and brittle nature during machining process. Accordingly, the machining control of Y₂O₃ should be conducted and the evaluation for the stable and continuous machining should be investigated in various industrial fields. In this study, theevaluation of Y₂O₃ machinability was conducted using the ultra-precision lapping process with In-process Electrolytic Dressing.

      • 신경 회로망을 이용한 Wafer final polishing의 가공 결과 예측

        황성철,차지완,이은상 한국공작기계학회 2008 한국공작기계학회 춘계학술대회논문집 Vol.2008 No.-

        Polishing is one of the important processing having influence on the surface roughness in manufacturing of Si-wafers. The surface roughness in wafer polishing is mainly affected by the many process parameters. A feed forward neural network model is developed exploiting experimental measurements from the surface in wafer final polishing. The input variables of Neural Network model are process parameters. The output variables are measured surface roughness. The neural network model is trained and performed by MATLAB. The model can be used for the analysis and prediction of the complex relationship. From this, it is clearly seen that a good agreement is observed between the predicted values and experimental measurement values.

      • 서울 시내 일부 대학생의 성지식과 성태도에 관한 연구

        김보배,노은경,박서영,박영,오승희,전영란,차현진,윤희상,김수지,이자형 이화여자대학교 간호과학대학 2004 이화간호학회지 Vol.- No.38

        This study surveyed and analyzed comparatively college students-knowledge' attitude, was to cultivate the right knowledge and attitude on sex, and serve the foundational data for the suitable sex education. The purpose of the study was to identify and examine: 1) students; sexual knowledge and sexual attitude; 2) the differences between variables of gender, age, and self-perceived sexual knowledge in relation to sexual knowledge and sexual attitude; and 3) the relationship between sexual knowledge and sexual attitude. For this study the questionaires were given to 300 students from five different universities located seoul areas. the questionaires were collected Jenuary 8th to 15th in 2004. Two hundred and nigty one samples were analyzed for the study. The adapted SKAT(saxual knowledge & attitude test; Lief & Reed, 1986) was used to determine sexual knowledge and the students' sexual attitude. Collected data were analyzed statistically by means of percentage, t-test, ANOVA test, and pearson correlation analysis with SPSS 12.0 package program. The main results of this analysis are as follows: Participants consisted of male(48.1%) and female(51.9%) which were mainly between the ages of 21.25(71.8%) with an age range of 19 to 30. Knowledge of sexual disease was scored highest of 92.4%, and konwledge of the knowledge of the male and female's anatomy was the lowest at 60.9%. The respondents' level of sexual attitude was tolerant as on average 3.66(on the basis of 5) Relating to the items, the respondents' score of the sexual curiosity was 4.16, sexual behavior 3.85, self-consolation 3.81, aborthon 3.23, virgine 3.19, extramarital experiences 3.17. There were no significant differences in sexual knowledge between male and females, between younger and older students, residence, sexual experience, and how students mainly obtained their sexual knowledge. But a significant difference was also found religion in their sexual attitude(p<.005). In addition, results showed the relationship between sexual knowledge and sexual attitude(P=0.332).

      • Wafer final polishing에 따른 표면 현상과 마멸도에 관한 연구

        원종구,이정택,황성철,차지완,이은상 한국공작기계학회 2008 한국공작기계학회 춘계학술대회논문집 Vol.2008 No.-

        In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that final polishing is very important. Polishing one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the evaluation on abrasion of wafer according to variety processing condition, which have major influence on the abrasion and surface defect of Si wafer polishing, were adapted to polishing pressure, machining speed, and the slurry mix ratio. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result. By using optimum condition, it achieve a ultra precision mirror like surface.

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