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채널 유동장 내에 배열된 전자부품의 강제대류 냉각특성에 관한 연구(II) -레이놀즈 수의 영향(히트싱크가 부착되지 않은 경우)-
김광수,양장식,Kim, Kwang-Soo,Yang, Jang-Sik 대한설비공학회 2006 설비공학 논문집 Vol.18 No.6
Present study is concerned with an experimental study on the cooling characteristics of heat-generating components arranged in channels which are made by printed circuit boards. To estimate the thermal performance of the heat-generating components arranged by $5\times11$ in channel flow, three variables are used: the inlet velocity, the height of channel, and row number of the component. The cooling characteristics of the heat-generating components such as the surface temperature rise, the adiabatic temperature rise, the adiabatic heat transfer coefficient, and the effect of thermal wake are compared with the result of the experiment and the numerical analysis. The experimental result is in a good agreement with the numerical analysis. The heat transfer coefficient increases as the Reynolds number increases, while the thermal wake function calculated for each row decreases as the Reynolds number increases. In addition, it is found that Nu-Re correlation equation is Identical to the previous studies, and the empirical correlation equation between the thermal wake function and Re is presented.
Short Channel n-MOSFET의 Breakdown 전압
김광수,이진효,Kim, Gwang-Su,Lee, Jin-Hyo 한국전자통신연구원 1987 전자통신 Vol.9 No.1
Short channel n-MOSFET의 드레인-소오스 사이의 breakdown은 단순한 접합 breakdown이 아닌 avalanche-induced breakdown으로 p-MOSFET, long channel n-MOSFET의 breakdown 전압보다 훨씬 작은 값을 갖는다. Short channel n-MOSFET의 breakdown의 특징은 current-controlled 부저항 특성(snapback)이 나타나고, 게이트 전압에 따라 breakdown 전압보다 작은 sustainning 전압이 존재한다. 이와 같은 sustainning 전압은 short channel n-MOSFET의 안정한 동작에 또 하나의 제한 요소가 될 수 있다. 따라서 공정 및 회로 시뮬레이션을 위해, short channel n-MOSFET의 avalanche breakdown 현상에 대한 정확한 분석이 요구된다. Short channel n -MOSFET의 avalanche breakdown 현상을 분석하기 위해서Parasitic bipolar transistor를 도입한 분석적 모델을 이용하였다.
프로젝션 용접 전극을 위한 시효경화성 Cu-2.0wt%Be 합금의 미세조직과 기계적성질
김광수,김진용,Kim, Gwangsoo,Kim, Jinyong 한국재료학회 2015 한국재료학회지 Vol.25 No.9
Evaluations of the microstructure and mechanical properties of age hardenable Cu-2.0wt%Be alloy are performed in order to determine whether it can be used as a welding electrode for projection welding. The microstructure examinations, hardness measurements, and tensile tests of selective aging conditions are conducted. The results indicate that the aging treatment with the fine-grained microstructure exhibits better hardness and high tensile properties than those of the coarse-grained microstructure. The highest hardness value and high tensile strength are obtained from the aged condition of $300^{\circ}C$ for 360 min due to the presence of the metastable ${\dot{\gamma}}$ precipitates on the grain boundaries. The values of the highest hardness and tensile strength are measured as 374 Hv and 1236.2 MPa, respectively. The metastable ${\dot{\gamma}}$ precipitates are transferred to the equilibrium ${\gamma}$ precipitates due to the over-aged treatment. The presence of the ${\gamma}$ precipitates appears as nodule-like precipitates decorated around the grain boundaries. The welding electrode with the best aging treated condition exhibits better welding performance for electrodes than those of electrodes used previously.
TFT-LCD 백라이트 유닛(BLU) 램프용 전극 미세 접합부의 강도 및 미세조직
김광수,김상덕,Kim, Gwang-Soo,Kim, Sang-Duck 한국재료학회 2009 한국재료학회지 Vol.19 No.1
TFT-LCD is the most popular type of flat display panel in the information technology field. The back light unit is a main part of the structure of a TFT-LCD panel. Occasionally, studies have shown that failures of the CCFL of the BLU occur due to the poor weld characteristics of these materials. The aim of this study was to prepare some technical data and to characterize a microjoined electrode for the CCFL. Microstructure examinations, microhardness measurements, resistance measurements and microtensile tests of the microjoined electrode were carried out. The result indicates that a large amount of grain coarsening exists in the heat-affected zone (HAZ) of the weld between the cup and the pin. This grain coarsening of the HAZ between the cup and pin is caused by the welding cycle, which may have an influence on the lowest microhardness values. Fracturing of the microjoined electrode also occurred at the HAZ close to the cup between the weld holding the cup and the pin. Additionally, no specific changes of the electrical resistance among the cup, pin, and lead wire themselves or in the microjoined electrode were observed.