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Ru(EtCp)<sub>2</sub> 전구체를 이용한 PEALD Ru 공정 최적화에 관한 연구
권세훈,정영근,Kwon, Se-Hun,Jeong, Young-Keun 한국분말야금학회 2013 한국분말재료학회지 (KPMI) Vol.20 No.1
Ru films were successfully prepared by plasma-enhanced atomic layer deposition (PEALD) using $Ru(EtCp)_2$ and $NH_3$ plasma. To optimize Ru PEALD process, the effect of growth temperature, $NH_3$ plasma power and $NH_3$ plasma time on the growth rate and preferred orientation of the deposited film was systemically investigated. At a growth temperature of $270^{\circ}C$ and $NH_3$ plasma power of 100W, the saturated growth rate of 0.038 nm/cycle was obtained on the flat $SiO_2$/Si substrate when the $Ru(EtCp)_2$ and $NH_3$ plasma time was 7 and 10 sec, respectively. When the growth temperature was decreased, however, an increased $NH_3$ plasma time was required to obtain a saturated growth rate of 0.038 nm/cycle. Also, $NH_3$ plasma power higher than 40 W was required to obtain a saturated growth rate of 0.038 nm/cycle even at a growth temperature of $270^{\circ}C$. However, (002) preferred orientation of Ru film was only observed at higher plasma power than 100W. Moreover, the saturation condition obtained on the flat $SiO_2$/Si substrate resulted in poor step coverage of Ru on the trench pattern with an aspect ratio of 8:1, and longer $NH_3$ plasma time improved the step coverage.
전기장 특성과 전극 형상이 다중벽 탄소나노튜브 정렬에 미치는 영향
권세훈,정영근,정창식,강명창,이형우,Kwon, Se-Hun,Jeong, Young-Keun,Jung, Chang-Sik,Kang, Myung-Chang,Lee, Hyung-Woo 한국분말야금학회 2010 한국분말재료학회지 (KPMI) Vol.17 No.4
In this paper, the effect of electrical characteristics and electrode shape on the alignment and attachment of multi-walled carbon nanotubes (MWNTs) has been studied. The attraction and alignment of MWNTs between the gaps has been investigated by applying electric field which is called electrophoresis and dielectrophoresis. According to the frequency of electric field, positive or negative dielectrophoretic force can be determined. The concentration of MWNTs solution was $5\;{\mu}g/ml$, and a droplet of $1.0{\sim}1.5\;{\mu}l$ was dropped between two electrodes. Through the repeated experiments, the optimal electrical conditions for aligning and attaching MWNTs in the desired places were obtained. Since the frequency range of 100 kHz~10 MHz generated positive dielectrophoretic force, MWNTs were attracted and aligned between the gaps with this frequency range. For generating enough force to attract MWNTs, the appropriate voltage range was $0.3{\sim}1.3\;V_{rms}/{\mu}m$. Furthermore, the effect of electrode shape on the alignment of MWNTs was investigated. A single MWNT attachment was accomplished on the round shaped with 70% yield.
권세훈 ( Se-hoon Kwon ),권재영 ( Jae-yeong Kown ),이승훈 ( Seung-hun Lee ),이현우 ( Hyun-woo Lee ),이종락 ( Jong-rak Lee ),원일용 ( Il-yong Won ) 한국정보처리학회 2017 한국정보처리학회 학술대회논문집 Vol.24 No.2
본 연구는 기존의 변종 악성코드와는 달리 진화알고리즘을 기반으로 한 악성코드 자동 생성 프레임워크에 대한 것이다. 우리가 제안하는 시스템은 소스가 알려지지 않는 바이너리 상태의 악성코드를 역공학적 기법을 이용하여 소스 상태로 복원하고 복원된 소스를 이용하여 다양한 변종 악성코드를 생성하는 것이다. 진화 연산을 적용하기 위해 평가함수의 설계가 중요한데, 우리는 행동 기반 분석 기반의 평가 함수를 포함하는 프레임워크를 제안하였다.
X-ray tomography 분석과 기계 학습을 활용한 금속 3D 프린팅 소재 내의 기공 형태 분류
김은아,권세훈,양동열,유지훈,김권일,이학성,Kim, Eun-Ah,Kwon, Se-Hun,Yang, Dong-Yeol,Yu, Ji-Hun,Kim, Kwon-Ill,Lee, Hak-Sung 한국분말재료학회 (*구 분말야금학회) 2021 한국분말재료학회지 (KPMI) Vol.28 No.3
Metal three-dimensional (3D) printing is an important emerging processing method in powder metallurgy. There are many successful applications of additive manufacturing. However, processing parameters such as laser power and scan speed must be manually optimized despite the development of artificial intelligence. Automatic calibration using information in an additive manufacturing database is desirable. In this study, 15 commercial pure titanium samples are processed under different conditions, and the 3D pore structures are characterized by X-ray tomography. These samples are easily classified into three categories, unmelted, well melted, or overmelted, depending on the laser energy density. Using more than 10,000 projected images for each category, convolutional neural networks are applied, and almost perfect classification of these samples is obtained. This result demonstrates that machine learning methods based on X-ray tomography can be helpful to automatically identify more suitable processing parameters.
전기방사법으로 제작한 In<sub>2</sub>O<sub>3</sub> 나노섬유 기반 고감도 실내독성 CO 및 HCHO 가스센서
임동하,황성환,권세훈,정현성,Im, Dong-Ha,Hwang, Sung-Hwan,Kwon, Se-Hun,Jung, Hyunsung 한국전기전자재료학회 2016 전기전자재료학회논문지 Vol.29 No.12
In this work, one dimension $In_2O_3$ nanostructures as detecting materials for indoor toxic gases were synthesized by an electrospinning process. The morphology of electrospun $In_2O_3$ nanofibers was controlled by electrolyte composition, applied voltage and working distance between a nozzle and a substrate. The synthesized $In_2O_3$ nanofibers-based paste with/without carbon black additives was prepared for the integration on a sensor device. The integration of $In_2O_3$ sensing materials was conducted by a hand-printing of the paste into the interdigit Au electrodes patterned on Si wafer. Gas sensing properties on CO and HCHO gases were characterized at $300^{\circ}C$. The evaluated sensing properties such as sensitivity, response time and recovery time were improved in $In_2O_3$ nanofiber pastes with carbon black, compared to the paste without carbon black.
실리콘 관통형 Via(TSV)의 Seed Layer 증착 및 Via Filling 특성
이현주,최만호,권세훈,이재호,김양도,Lee, Hyunju,Choi, Manho,Kwon, Se-Hun,Lee, Jae-Ho,Kim, Yangdo 한국재료학회 2013 한국재료학회지 Vol.23 No.10
As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidths and good power efficiency. 3D integration can be defined as a technology involving the stacking of multiple processed wafers containing integrated circuits on top of each other with vertical interconnects between the wafers. This type of 3D structure can improve performance levels, enable the integration of devices with incompatible process flows, and reduce form factors. Through silicon vias (TSVs), which directly connect stacked structures die-to-die, are an enabling technology for future 3D integrated systems. TSVs filled with copper using an electro-plating method are investigated in this study. DC and pulses are used as a current source for the electro-plating process as a means of via filling. A TiN barrier and Ru seed layers are deposited by plasma-enhanced atomic layer deposition (PEALD) with thicknesses of 10 and 30 nm, respectively. All samples electroplated by the DC current showed defects, even with additives. However, the samples electroplated by the pulse current showed defect-free super-filled via structures. The optimized condition for defect-free bottom-up super-filling was established by adjusting the additive concentrations in the basic plating solution of copper sulfate. The optimized concentrations of JGB and SPS were found to be 10 and 20 ppm, respectively.
Si 함량에 따른 Ti-Al-Si-C-N 코팅막의 미세구조와 기계적 특성의 변화에 관한 연구
홍영수(Young Su Hong),권세훈(Se Hun Kwon),김광호(Kwang Ho Kim) 한국표면공학회 2009 한국표면공학회지 Vol.42 No.2
Quinary Ti-Al-Si-C-N films were successfully synthesized on SUS 304 substrates and Si wafers by a hybrid coating system combining an arc ion plating technique and a DC reactive magnetron sputtering technique. In this work, the effect of Si content on the microstructure and mechanical properties of Ti-Al-C-N films were systematically investigated. It was revealed that the microstructure of Ti-Al-Si-C-N coatings changed from a columnar to a nano-composite by the Si addition. Due to the nanocomposite microstructure of Ti-Al-Si-C-N coatings, the microhardness of The Ti-Al-Si-C-N coatings significantly increased up to 56 GPa. In addition the average friction coefficients of Ti-Al-Si-C-N coatings were remarkably decreased with Si addition. Therefore, Ti-Al-Si-C-N coatings can be applicable as next-generation hard-coating materials due to their improved hybrid mechanical properties.