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단보 : 한국산 퉁돔과 어류 1미기록종, Symphorus nematophorus
김맹진 ( Maeng Jin Kim ),문태석 ( Tae Seok Mun ),이정훈 ( Jeong Hoon Lee ),최영민 ( Young Min Choi ),송춘복 ( Choon Bok Song ) 한국어류학회 2015 韓國魚類學會誌 Vol.27 No.2
퉁돔과에 속하는 Symphorus nematophorus 1개체 (표준체장 481 mm)가 거제 연안의 정치망에서 처음으로 채집되었다. 이 종은 등지느러미 연조의 앞부분이 길게 연장되어 있고, 눈과 코구멍 사이에 파인 홈이 있으며, 서골에는 이빨이 없고 체측에는 선명한 9개의 파란 줄이 존재한다. 이 미기록종의 속명과 국명은 각각 “실퉁돔속” 과 “실퉁돔”으로 제안한다. A single specimen of Symphorus nematophorus (481.0 mm in SL), belonging to the family Lutjanidae, was firstly collected by a set net in the coastal waters of Geojae Island, located in south sea of Korea on August 1, 2014. This specimen was characterized by having the anterior dorsal soft rays produced into filaments, a pit between eye and nostril, no tooth on vomer, and nine longitudinal blue strips on both sides of the body. We propose a new Korean name, “Sil-tung-dom-sok” and “Sil-tung-dom” for the genus and species, respectively.
Sangsub Song,Youngmin Kim,Jimin Maeng,Heeseok Lee,Youngwoo Kwon,Kwang-Seok Seo IEEE 2009 IEEE TRANSACTIONS ON ADVANCED PACKAGING Vol.32 No.1
<P>In this paper, a system-on-package (SOP) technology using a thin-film substrate with a flip-chip interconnection has been developed for compact and high-performance millimeter-wave (mm-wave) modules. The thin-film substrate consists of Si-bumps, ground-bumps, and multilayer benzocyclobutene (BCB) films on a lossy silicon substrate. The lossy silicon substrate is not only a base plate of the thin-film substrate, but also suppresses the parasitic substrate mode excited in the thin-film substrate. Suppression of the substrate mode was verified with measurement results. The multilayer BCB films and the ground-bumps provide the thin-film substrate with high-performance integrated passives for the SOP capability. A broadband port terminator and a V-band broad-side coupler based on thin-film microstrip (TFMS) circuits were fabricated and characterized as mm-wave integrated passives. The Si-bumps dissipate the heat generated during the operation of flipped chips as well as provide mechanical support. The power dissipation capability of the Si-bumps was confirmed with an analysis of DC-IV characteristics of GaAs pseudomorphic high electron-mobility transistors (PHEMTs) and radio-frequency performances of a V-band power amplifier (PA). In addition, the flip-chip transition between a TFMS line on the thin-film substrate and a coplanar waveguide (CPW) line on a flipped chip was optimized with a compensation network, which consists of a high-impedance and low-impedance TFMS line and a removed ground technique. As an implementation example of the mm-wave SOP technology, a V-band power combining module (PCM) was developed on the thin-film substrate with the flip-chip interconnection. The V-band PCM incorporating two PAs with broadside couplers showed a combining efficiency higher than 78%.</P>
시스템 패키징을 위한 Thin-Film 기반 수동소자 구현
맹지민(Ji-Min Maeng),유찬세(Chan-Sei Yoo),송생섭(Sang-Sub Song),이희석(Hee-Seok Lee),서광석(Kwang-Seok Seo) 대한전자공학회 2007 대한전자공학회 학술대회 Vol.2007 No.7
Embedded passive devices were developed with thin-film multichip module-deposited (MCM-D) technology. The features of integrated passives are NiCr resistors with 20Ω/square, compact spiral inductors with inductance ranging from 3 to 10 nH, and 900A SiNx MIM capacitors with scalable capacitance as well as high breakdown voltage.
An UltraWideBand BALUN on Thin Film Substrate using MCM-D Technology
Chan-Sei Yoo,Ji-Min Maeng,Sang-Sub Song,Kwang-Hoon Lee,Jae-Hyun Yoon,Dongsu Kim,Hee-Seok Lee,Woo-Sung Lee,Kwang-Seok Seo 대한전자공학회 2007 ITC-CSCC :International Technical Conference on Ci Vol.2007 No.7
This paper presents a integrated balun using MCM-D technology for UWB application(3.1∼4.8 ㎓). Two types of circuit was suggested and compared. The first one using distributed circuit shows good power diving but poor phase shifting. On the other hand, the balun using lumped circuit shows good phase shifting but poor power dividing. To get good performance in both region, that is power dividing and phase shifting, the circuit using lumped and distributed one together was suggested and evaluated on the silicon substrate. Finally, the suggested balun shows good power imbalance(2 ㏈) and phase imbalance(10°). That can be integrated with the chipset using BEOL(back end of line) process.
김정옥(Kim Jung Ok),차맹규(Cha Maeng Q),송우석(Song Woo Seok),유기윤(Yu Kiyun) 대한공간정보학회 2006 한국지형공간정보학회 학술대회 Vol.2006 No.5
온톨로지는 지식공학 및 소프트웨어 공학이나 전자상거래 등 여러 분야에 널리 사용되고 있으며, GIS 분야에서도 상호운용성 확보를 위한 응용기술로 온톨로지에 대한 관심이 증가하고 있다. 본 논문은 GIS의 의미론적 상호운용성을 구현하기 위한 기술로서 온톨로지를 주목하고, 공간데이터 간의 시맨틱을 유추하는데 이를 이용한 연구를 살펴보았다. 그 결과 도시정보시스템, 환경모니터링 시스템, 공간정보 검색시스템 등에서 기존 GIS 정보의 재사용과 지식 및 데이터 공유를 위한 방법으로 온톨로지가 활용되고 있음을 확인하였다. 이를 바탕으로 향후 온톨로지를 GIS 분야에서 활용할 수 있는 방안으로 RFID 및 유비쿼터스 컴퓨팅을 제시하였다.