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Wafer-Level Three-Dimensional Monolithic Integration for Intelligent Wireless Terminals
Gutmann, R.J.,Zeng, A.Y.,Devarajan, S.,Lu, J.Q.,Rose, K. The Institute of Electronics and Information Engin 2004 Journal of semiconductor technology and science Vol.4 No.3
A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.
Wafer-Level Three-Dimensional Monolithic Integration for Intelligent Wireless Terminals
R.J.Gutmann,A.Y.Zeng,S.Devarajan,J.-Q.Lu,K.Rose 대한전자공학회 2004 Journal of semiconductor technology and science Vol.4 No.3
A three-dimensional (3D) IC technology platform is presented for high-performance. low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-safer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-nafer via test structure, and compatibility of the proce.. .teps "ith 130 nm CMOS SOl devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wfireless terminalss as vertical integration of processor, large memors, image sensors and RF/microwawe transceiwers can be achieved with silicon-based ICs (Si CMOS and/or SiCe BiCMOS). Two esamples of such capability are<br/> highlighted memory-intenshe Si CCYIOS digital<br/> processors with large L2 caches and SiGe BiCMS pipelined A/D converters. A comparison of wafer-level 3D integration with system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.<br/> Index Terms-3D Integration, wafer bonding, intelligent wireless terminal, memory-intensive digital processors, pipelined A/D converters<br/>
Inbreeding and Genetic Diversity in Three Imported Swine Breeds in China Using Pedigree Data
Tang, G.Q.,Xue, J.,Lian, M.J.,Yang, R.F.,Liu, T.F.,Zeng, Z.Y.,Jiang, A.A.,Jiang, Y.Z.,Zhu, L.,Bai, L.,Wang, Z.,Li, X.W. Asian Australasian Association of Animal Productio 2013 Animal Bioscience Vol.26 No.6
The accumulation of inbreeding and the loss of genetic diversity is a potential problem in the modern swine breeds in China. Therefore, the purpose of this study was to analyze the pedigrees of Chinese Duroc (CD), Landrace (CL) and Yorkshire (CY) swine to estimate the past and current rates of inbreeding, and to identify the main causes of genetic diversity loss. Pedigree files from CD, CL and CY containing, 4529, 16,776 and 22,600 records, respectively, were analyzed. Pedigree completeness indexes of the three breeds, accounting for one generation back, were 83.72, 93.93 and 93.59%, respectively. The estimated average annual inbreeding rates for CD, CL and CY in recent three years were 0.21, 0.19 and 0.13%, respectively. The estimated average percentage of genetic diversity loss within each breed in recent three years was about 8.92, 2.19, and 3.36%, respectively. The average relative proportion of genetic diversity loss due to unequal contributions of founders in CD, CL and CY was 69.09, 57.95 and 60.57%, and due to random genetic drift was 30.91, 42.05 and 39.43%, respectively. The estimated current effective population size for CD, CL and CY was 76, 117 and 202, respectively. Therefore, CD has been found to have lost considerable genetic diversity, demanding priority for optimizing the selection and mating to control future coancestry and inbreeding. Unequal contribution of founders was a major cause of genetic diversity loss in Chinese swine breeds and random genetic drift also showed substantial impact on the loss of diversity.
X.F. Liao,L.Z. Zhao,J.S. Zhang,G. Ahmed,A.J. Khan,H.X. Zeng,H.Y. Yu,X.C. Zhong,Z.W. Liu,G.Q. Zhang 한국물리학회 2019 Current Applied Physics Vol.19 No.6
To improve the performance/cost ratio of NdFeB based permanent magnets, Ce or/and La substitutions for Nd have been suggested. To better understand the effects of these substitutions, the fundamental behavior of (Ce,La)-Fe-B alloys has to be clearly understood. Here, we reported a systematic investigation on the phase structure, microstructure, and magnetic properties of melt-spun (Ce,La)2Fe14B alloys. The results confirm that partial substitution of Ce by La can effectively enhance the hard magnetism and thermal stability of (Ce1- xLax)2Fe14B alloys, while over 80% La substitution leads to the decomposition of 2:14:1 phase. The lattice parameters a, c and the Curie temperature Tc of 2:14:1 phase increase linearly with the increasing La content. La substitution can effectively refine the grain, resulting in the enhancement of inter-grain exchange coupling. The (Ce0.7La0.3)2Fe14B alloy with a mean grain size of 25 nm exhibits high remanence, maximum energy product and intrinsic coercivity up to 0.69 T, 6.2 MGOe and 217 kA/m, respectively. The present work provides a good understanding on the melt-spun (Ce,La)-Fe-B system for further developing low cost rare earth permanent magnets.
Fluorenyl Based Macrocyclic Polyradicaloids
Lu, Xuefeng,Lee, Sangsu,Hong, Yongseok,Phan, Hoa,Gopalakrishna, Tullimilli Y.,Herng, Tun Seng,Tanaka, Takayuki,Sandoval-Salinas, Marí,a Eugenia,Zeng, Wangdong,Ding, Jun,Casanova, David,Osuka, At American Chemical Society 2017 JOURNAL OF THE AMERICAN CHEMICAL SOCIETY - Vol.139 No.37
<P>Synthesis of stable open-shell polyradicaloids including control of intramolecular spin-spin interactions is a challenging topic in organic chemistry and materials science. Herein, we report the synthesis and physical characterization of two series of fluorenyl based macrocyclic polyradicaloids. In one series (FR-MCn, n = 4-6), the fluorenyl radicals are directly linked at 3,6-positions; whereas in the other series (MC-FnAn, n = 3-5), an additional ethynylene moiety is inserted between the neighboring fluorenyl units. To access stable macrocyclic polyradicaloids, three synthetic methods were developed. All of these stable macrocycles can be purified by normal silica gel column chromatography under ambient conditions. In all cases, moderate polyradical characters were calculated by restricted active space spin-flip method due to the moderate intramolecular antiferromagnetic spin-spin interactions. The excitation energies from the low-spin ground state to the lowest high-spin excited state were evaluated by superconducting quantum interference device measurements. Their physical properties were also compared with the respective linear fluorenyl radical oligomers (FR-n, n = 3-6). It is found that the geometry, i.e., the distortional angle and spacer (w or w/o ethynylene) between the neighboring fluorenyl units, has significant effect on their polyradical character, excitation energy, one-photon absorption, two-photon absorption and electrochemical properties. In addition, the macrocyclic tetramers FR-MC4 and MC-F4A4 showed global antiaromatic character due to cyclic pi-conjugation with 36 and 44 pi-electrons, respectively.</P>