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공정관리 활용을 위한 BIM모델의 공정별 수순 및 위치정보 추출방안
윤형석,이재희,황재영,강효정,박상미,강인석,Yoon, Hyeongseok,Lee, Jaehee,Hwang, Jaeyeong,Kang, Hyojeong,Park, sangmi,Kang, Leenseok 한국건설관리학회 2022 한국건설관리학회 논문집 Vol.23 No.2
The simulation function by the 4D system is a representative BIM function in the construction stage. For the 4D simulation, schedule information for each activity must be created and then linked with the 3D model. Since the 3D model created in the design stage does not consider schedule information, there are practical difficulties in the process of creating schedule information for application to the construction stage and linking the 3D model. In this study, after extracting the schedule information of the construction stage using the HDBSCAN algorithm from the 3D model in the design stage, authors propose a methodology for automatically generating schedule information by identifying precedence and sequencing relationships by applying the topological alignment algorithm. Since the generated schedule information is created based on the 3D model, it can be used as information that is automatically linked by the common parameters between the schedule and the 3D model in the 4D system, and the practical utility of the 4D system can be increased. The proposed methodology was applied to the four bridge projects to confirm the schedule information generation, and applied to the 4D system to confirm the simplification of the link process between schedule and 3D model.
프로젝트 계획의 변동이 고객만족도에 미치는 영향: IT 프로젝트 결과 중심으로
윤형석,이석주,김승철,박소현,Yoon, Hyeong-Seok,Lee, Seouk-Joo,Kim, Seung-Chul,Park, So-Hyun 한국IT서비스학회 2022 한국IT서비스학회지 Vol.21 No.5
Companies are planning and executing IT projects using information technology as a means to secure external competitiveness. However, IT projects have high risks and uncertainties due to the invisibility of outputs (systems, services, products), and changes in plans frequently occur during project execution. As a result, most IT projects are closed without achieving the target performance. This can lead to a waste of resources and money for the company, which in turn leads to the loss of opportunities to enter new markets. This study intends to analyze the effect of changes in the project plan on customer satisfaction, which is the project performance. Also, we want to find the importance of project planning so that the target performance of the IT project can be achieved. For the empirical analysis of this study, about 500 actual project data were collected. As for the analysis method, statistical analysis such as simple and multiple regression analysis and control effect was performed. Looking at the results of the analysis, it was found that the scope change affects the cost change and the schedule change. Also, changes in scope and cost were found to affect project performance. The theoretical performance of this study proved the theoretical fact that good project performance comes out if the IT project is executed as planned. The practical performance suggested the need for a change in project management by proving that thorough execution of the project planning stage can improve the project performance in the Korean project management culture, where the project planning stage is poorly performed for the rapid implementation of the IT project.
3D stack package의 구조해석과 모아레 측정법을 이용한 결과 비교
윤형석(Hyung Seok Yoon),최광성(Kwang Seong Choi),배현철(Hyun Cheol Bae),임병옥(Byeong Ok Lim),엄용성(Yong Sung Um),문종태(Jong Tae Moon),전인수(In Su Jeon) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.11
Semiconductor devices become smaller, higher density and performance required is increased interest in this issue is a 3D package technology; Thermo-mechanical reliability was interested in. Coefficient of thermal expansion mismatch between dissimilar materials of the package takes the biggest factors in life are most interested in TSV (through silicon via) and the solder joints were treated with the finite element method. Bump chip thickness, interposer thickness, underfill's material property package of several factors that affect the reliability of CTE of underfill for the study was conducted by the largest change in stress was found to appear. We were aiming to optimize the design, production and real samples by comparing the results of the Moire measuring the reliability of numerical results have been verified.
Drum구조 제동장치의 온도 변화에 따른 Clearance(Airgap) 보상 구현
윤형석(Hyungsuk Yoon),최진우(Jinwoo Choi),유용범(Yongbeom You) 한국자동차공학회 2022 한국자동차공학회 학술대회 및 전시회 Vol.2022 No.11
전자식 주차 제동 장치(이하 EPB)는 크게 캘리퍼 타입과 드럼 타입으로 나뉘며 제품 타입에 따라 동작 방식에 있어 차이가 있다. 드럼 타입의 경우 드럼 디스크의 형상이 온도가 상승함에 따라 외방향으로 팽창하고, 온도가 다시 상온으로 하강 시 내방향으로 수축된다. 전류를 통해 제어하는 체결(이하 Apply) 동작에서는 온도 특성에 영향이 크게 없으나, 시간 기반으로 제어하는 해제(이하 Release) 동작에서는 드럼 디스크의 팽창과 수축에 따라 드럼 내벽면과 슈 앗세이 사이의 간극(이하 clearance)이 충분히 확보되지 않을 수 있다. 가령 고온 상태에서의 Apply, Release 후 상온 상태에서 차량을 운용한다면 주행 중 의도치 않은 제동 마찰(이하 드래그) 현상이 발생할 수 있으며 이 드래그 현상은 차량 화재 발생 등 안전사고를 야기할 수도 있는 문제이기에 해결해야하는 중요한 사안이다. 본 논문에서는 이러한 드래그 현상을 방지하기 위해 clearance를 확보하는 보상 알고리즘을 구현한다. 드럼타입 브레이크의 온도 상승분(△T)에 따른 열팽창 정도를 계측하여 이를 기반으로 Release 보상 인자(고온 보상 MAP)를 정의한다. 고온 상태에서의 Apply 시 고온 보상 flag를 set 하고 온도 하강 전 Release시 해당 시점 온도에 상응하는 MAP의 factor만큼 Clearance를 추가 확보한다.
윤형석(Hyeong-Seok Yoon),이근웅(Keun-Woong Lee),정명희(Myung-Hee Jung),박양수(Yang-Su Park),이명준(Myung-Joon Lee) 한국정보과학회 2001 한국정보과학회 학술발표논문집 Vol.28 No.1A
최근 기업이나 조직에서 인터넷의 사용이 보편화되면서 웹을 사용한 기밀유출, 불필요한 웹 사용, 비 업무관련 사이트접속 등의 문제점이 증가하게 되었다. 따라서, 이런 사항들을 감시하여 적절한 조치를 취할 수 있도록 도와주는 웹 사용 현황 모니터링 시스템이 요구된다. 본 논문에서는 패킷 모니터링 기술을 기반으로 웹 사용 네트워크 모니터링 서버와 웹 브라우저로 간편하게 모니터링 할 수 있는 클라이언트 애플릿을 설계하고 구현하였다.
Wafer to Wafer bonding에 대한 수치해석
윤형석(Hyungseok Yoon),문종태(Jongtae Moon),엄용성(Yongsung Um),전인수(Insu Jeon) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.5
Though a study for wafer to wafer bonding technology holds good lively abroad now, it is the situation that can send a study for it a lot in the country. I tried to carry out dynamic analysis through numerical value interpretation to establish a condition for the most suitable bonding fairness. While I do modeling of wafer pattern which I plate it in different materials each other, and was joined and add displacement at the top, I carried out stress distribution I added heat, and to occur to a makeup through finite element interpretation and transformation interpretation. Grasp a characteristic in bonding fairness through such a study, I tried to analyze which part defectiveness occurred in. I establish a base in the process when I secure a certain reliability bonding technology in a base, and an MEMS package of various structure produces findings of a book.