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Wafer to Wafer bonding에 대한 수치해석
윤형석(Hyungseok Yoon),문종태(Jongtae Moon),엄용성(Yongsung Um),전인수(Insu Jeon) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.5
Though a study for wafer to wafer bonding technology holds good lively abroad now, it is the situation that can send a study for it a lot in the country. I tried to carry out dynamic analysis through numerical value interpretation to establish a condition for the most suitable bonding fairness. While I do modeling of wafer pattern which I plate it in different materials each other, and was joined and add displacement at the top, I carried out stress distribution I added heat, and to occur to a makeup through finite element interpretation and transformation interpretation. Grasp a characteristic in bonding fairness through such a study, I tried to analyze which part defectiveness occurred in. I establish a base in the process when I secure a certain reliability bonding technology in a base, and an MEMS package of various structure produces findings of a book.
황경정(Kyungjung Hwang),박지상(Jisang Park),김태욱(Taewook Kim),윤형석(Hyungseok Yoon) 한국자동차공학회 2003 한국자동차공학회 춘 추계 학술대회 논문집 Vol.- No.-
The goal of this study is to replace the current forward 2-piece propeller shaft of 8 ton large truck made of steel with 1-piece composite propeller shaft. A low cost Glass/Epoxy composite propeller shafts were successfully developed, which satisfy requirements such as the capacity of static torque transfer, fatigue strength and bending natural frequency. Devising secure joining method of a composite tube and metal yoke was the most critical issue in successful development of a high torque composite propeller shaft. In this study, joining method using thermal interference fit was adopted for composite to metal joint. Optimum conditions of heating temperature and interference level of thermal interference fit were determined from thermal stress analysis using 3D finite element method. Static torsion test, fatigue test, RPM and balance test were performed to verify the design.<br/>