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Wafer to Wafer bonding에 대한 수치해석
윤형석(Hyungseok Yoon),문종태(Jongtae Moon),엄용성(Yongsung Um),전인수(Insu Jeon) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.5
Though a study for wafer to wafer bonding technology holds good lively abroad now, it is the situation that can send a study for it a lot in the country. I tried to carry out dynamic analysis through numerical value interpretation to establish a condition for the most suitable bonding fairness. While I do modeling of wafer pattern which I plate it in different materials each other, and was joined and add displacement at the top, I carried out stress distribution I added heat, and to occur to a makeup through finite element interpretation and transformation interpretation. Grasp a characteristic in bonding fairness through such a study, I tried to analyze which part defectiveness occurred in. I establish a base in the process when I secure a certain reliability bonding technology in a base, and an MEMS package of various structure produces findings of a book.
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