폐 CPU 칩의 해체장치 제작 및 성능 평가

조아람,박승수,김보람,박재구,Joe, Aram,Park, Seungsoo,Kim, Boram,Park, Jaikoo 한국자원리싸이클링학회 2016 資源 리싸이클링 Vol.25 No.6

본 연구에서는 F-PGA 타입의 CPU 칩과 W-BGA 타입의 CPU 칩을 대상으로 금(Au)의 함량 및 분포 상태를 확인하였다. 그 결과 F-PGA 칩의 경우, 금의 80.8%가 칩 터미널(terminal)부분에, W-BGA 칩의 경우에는 베어다이(bare die)에 금이 89.8% 편재되어 있는 것을 확인하였다. 이와 같이 대부분의 금이 칩의 특정 부분에 존재하는 사실로부터 CPU 칩의 해체장치를 고안하게 되었다. CPU 칩 해체실험의 조작변수는 롤러 회전속도, IR 히터의 가열 온도, 가열 시간으로 하였다. F-PGA 칩의 경우에는 가열 온도 $300^{\circ}C$, 가열 시간 90초 조건, 그리고 W-BGA 칩의 경우에는 롤러속도 90 rpm, 가열온도 $300^{\circ}C$, 가열 시간 180초 조건에서 칩 터미널과 베어다이를 각각 완전하게 분리/회수할 수 있었다. In this study, Au distribution in F-PGA chip and W-BGA chip were examined to recover Au effectively from CPU chips. The result showed that 80.8% and 89.8% of Au exist in terminal of F-PGA chip and bare die of W-BGA chip, respectively. Based on the fact that Au exists in specific parts of the chips, an CPU chip dismantling apparatus was developed. The experimental variables were roller rotating speed, heat temperature of IR heater and heating time. Terminals of F-PGA chips were completely recovered under the temperature of $300^{\circ}C$ and the residence time of 90 s. Bare dies of W-BGA chips were completely recovered as well under the temperature of $300^{\circ}C$, the roller rotating rate of 90 rpm and the residence time of 90 s.

코로나 방전 정전선별기 내 PCB 입자의 이동궤도 시뮬레이션

한성수,박승수,김성민,박재구,Han, Seongsoo,Park, Seungsoo,Kim, Seongmin,Park, Jaikoo 한국자원리싸이클링학회 2014 資源 리싸이클링 Vol.23 No.6

코로나 방전 정전선별기 내에서 인쇄회로기판(Printed Circuit Board, PCB) 분쇄 입자의 이동궤도를 전산 모사하였다. 여기서 PCB입자는 전자부품 분리된 기판을 파쇄한 것으로, 대부분 구리와 FR-4(Flame Retardant Level-4)로 이루어져있다. 우선 입자가 선별기내 회전전극으로부터 탈착 지점을 계산하였으며, 중력, 원심력, 정전기력의 평형으로부터 유도되었다. 한편 탈착 후 이동궤도는 입자의 운동방정식으로부터 구한 가속도를 시간 적분하여 계산하였다. 시뮬레이션 변수는 입자의 크기, 공급전압의 세기, 회전전극속도 및 유도전극 각도로 하였다. 입자 이동궤도에 미치는 영향은 구리 입자의 경우에는 회전속도가 주요 변수였으나, 반면 FR-4 입자의 경우에는 상기 모든 변수에 영향을 받는 것으로 나타났다. The trajectories of PCB(Printed Circuit Board) particles in the corona discharge electrostatic separation was simulated. The PCB particles are prepared by crushing bare board, which disassembled from electronic components, consist mostly of copper and FR-4(Flame Retardant Level-4) Firstly, a model was established for calculating of detachment points of PCB particles from the rotating electrode in separator. The model of detachment points was derived from equilibrium of force such as gravity force, centrifugal force, electrostatic force. The trajectories of particles after detachment was calculated by acceleration derived from time-integrating method of motion equation. In this simulation, particle size, supplied voltage, rotation speed of rotating roll electrode and angle of induction electrode were adopted as variables. While the trajectories of FR-4 particles were affected by all variables, rotation speed of rotating roll electrode was dominant variables affecting trajectories of copper particles.

열처리에 의한 폐 인쇄회로기판의 물성변화

김보람,박승수,김병우,박재구,Kim, Boram,Park, Seungsoo,Kim, Byeongwoo,Park, Jaikoo 한국자원리싸이클링학회 2018 資源 리싸이클링 Vol.27 No.1

Physical property changes of printed circuit board (PCB) according to heat treatment conditions were investigated. The heat treatment was carried out in air and nitrogen atmosphere at temperature range from $200^{\circ}C$ to $325^{\circ}C$. Thermogravimetric analysis showed that the PCB was pyrolyzed in two steps. The thickness of PCB expanded by 11~28% at about $300^{\circ}C$ in both air and nitrogen atmosphere as layer disintegration occurred. Mechanical strength of PCB decreased from 338.4 MPa to 20.3~40.2 MPa due to the delamination caused by the heat treatment. The heated printed circuit boards were crushed and sieved for analysis of density distribution and liberation degree of copper according to particle size. As a result of the density distribution measurement, non metallic particles and copper particles were concentrated into different size range, respectively. The liberation degree of copper was improved from 9.3% to 100% at size range of $1,400{\sim}2,000{\mu}m$ by heat treatment.

Iodide/Iodine용액에서 CPU chip 분쇄물의 금 침출특성

정인상,조아람,최준철,송유진,박풍원,박경호,이수정,박재구,Jung, Insang,Joe, Aram,Choi, Joonchul,Song, Youjin,Park, Poongwon,Park, Kyungho,Lee, Sujeong,Park, Jaikoo 한국자원리싸이클링학회 2016 資源 리싸이클링 Vol.25 No.1

요오드용액을 사용하여 노트북 인쇄회로기판 CPU chip 중에 함유된 금을 침출하는 연구를 진행하였다. 150 mesh 이하로 분쇄된 CPU chip을 Iodide/Iodine용액에서 처리한 결과 금의 침출율은 20%로 매우 낮게 나타났다. 이와 같이 낮은 침출율의 원인은 CPU chip 분쇄과정에서 금 입자 표면에 생성된 구리 피막이 침출액과 금의 접촉을 방해하기 때문인 것으로 판단되었다. 한편, CPU chip 분쇄물을 질산용액을 사용하여 전처리 한 후 Iodide/Iodine 용액으로 침출하였을 때 금의 침출율은 약 90%으로 크게 증가하였다. 이 현상을 설명하기 위하여 침출 잔사를 EDS 및 ICP 분석을 통해 관찰한 결과, 금 입자표면에 피복되어 있는 구리의 약 80%가 질산에 의해 제거되었으며 이로 인해 금의 침출율이 향상된 것을 확인할 수 있었다. The leaching behavior of gold from waste CPU chip using Iodide/Iodine solution was studied. The direct leaching of gold with Iodide/Iodine solution for CPU chip under the size of 150 mesh showed leaching ratio of 20%. It was assumed that the copper film was produced on the gold particle during grinding process and the copper film prevents lodine/Iodide solution from contacting with leachable gold. Meanwhile, the extraction of gold was improved to 90% by pretreatment process with $HNO_3$ solution. In order to explain the result, EDS and ICP analysis for the leaching residue were conducted. It was found that the copper coated on the surface of the gold particle was removed about 80% by $HNO_3$, resulting in the increment of gold leaching rate.

폐 정보통신기기(스마트폰, 노트북 PC)의 자원화 가치 분석

박승수,정민욱,김성민,한성수,정인상,박지환,박재구,Park, Seungsoo,Jung, Minuk,Kim, Seongmin,Han, Seongsoo,Jung, Insang,Park, Jihwan,Park, Jaikoo 한국자원리싸이클링학회 2018 資源 리싸이클링 Vol.27 No.3

In this study, metal and nonmetal contents and their economic values in ICT devices such as smart phones and laptop computers were evaluated. The electronic devices made by LG and Samsung were disassembled into 5 parts, which are printed circuit board assembly, battery, display, case and other electronic components. Metal and nonmetal contents in these parts were analyzed, and their economic values were calculated via multiplying the materials' contents by metal price obtained from KOMIS or nonmetal exchange price acquired from Korean recycling markets. Finally, the materials' contents and values according to each electronic parts and electronic devices were calculated. The results showed that the value of the smartphones and laptop computers of LG are 4,449.6 KRW (28,506 KRW/kg) and 6,830.2 KRW (7,053 KRW/kg), and those of Samsung are 1,849.3 KRW (13,499 KRW/kg) and 6,667.5 KRW (4,831 KRW/kg), respectively. It was also found that most of the value was concentrated in batteries and printed circuit board assemblies. In addition, Co, Au and Cu were found to be the most valuable resources in the devices.

광미(鑛尾)를 활용(活用)한 다공성 세라믹 비드 제조(製造) 및 촉매(觸媒) 변환기(變換機)로의 응용(應用)

서준형,김성민,한요셉,김유득,이준한,박재구,Seo, Junhyung,Kim, Seongmin,Han, Yosep,Kim, Yodeuk,Lee, Junhan,Park, Jaikoo 한국자원리싸이클링학회 2013 資源 리싸이클링 Vol.22 No.4

광미를 이용하여 다공성 세라믹 비드를 제조한 후 NOx/SOx 제거용 촉매 변환기로 응용하였다. 변환기 표면에 코팅처리된 촉매 지지체는 합성한 메조포러스 실리카(SBA-15)를 사용하였다. 다공성 세라믹 변환기의 내부 구조는 기공과 기공이 서로 연결되어 있는 3차원 망상구조이며 기공율은 80%로 나타났다. 또한, 촉매 변환기의 비표면적은 SBA-15 코팅 전 0.8 $m^2/g$에서 코팅처리 후에는 55 $m^2/g$으로 크게 증가하였다. NOx/SOx 제거 실험은 다공성 세라믹 촉매 변환기 표면에 $V_2O_5$와 $V_2O_5$, CuO를 함께 담지한 것으로 실시하였다. NOx 전환율은 $V_2O_5$/CuO 변환기가 $V_2O_5$ 변환기에 비해 약 10% 정도 높게 나타났다. 또한, $V_2O_5$/CuO 변환기는 반응온도 $350^{\circ}C$, 공간속도 10000 $h^{-1}$, 산소농도 5%에서 NOx 95%, SOx 90% 이상의 전환율을 각각 나타냈다. The porous ceramic beads using mine tailing were prepared and applied to catalytic converter for NOx/SOx removal. Catalytic support was used synthesized mesoporous silica (SBA-15) which coated on surface. Internal structure for porous ceramic beads was composed of three-dimensional network structure and porosity was about 80%. In addition, the specific surface area for mesoporous silica(SBA-15) coated on converter was significantly increased 55 $m^2/g$ compared with 0.8 $m^2/g$ before coating. NOx/SOx removal experiment was performed using $V_2O_5$ and $V_2O_5$/CuO converter. NOx conversion ratio for $V_2O_5$/CuO converter was approximately increased 10% compared to $V_2O_5$ converter. In addition, catalytic converter of $V_2O_5$/CuO was shown to remove 95% of NOx and 90% of SOx at reaction temperature of $350^{\circ}C$, space velocity of 10000 $h^{-1}$ and $O_2$ concentrations of 5%, respectively.

노트북 인쇄회로기판 전자부품으로부터 탄탈럼의 분리

권석제,박승수,김성민,조아람,송유진,박풍원,박재구,Kwon, Seokje,Park, Seungsoo,Kim, Seongmin,Joe, Aram,Song, Youjin,Park, Poongwon,Park, Jaikoo 한국자원리싸이클링학회 2016 資源 리싸이클링 Vol.25 No.1

노트북 실장인쇄회로기판(Printed Circuit Board Assembly, PCBA)으로부터 탄탈럼을 회수하기 위한 선별실험을 실시하였다. 우선 노트북 실장인쇄회로기판에 실장된 전자부품(Electronic Components, ECs)을 자체개발한 실험장치를 이용하여 기판으로부터 분리하였다. 분리된 전자부품을 체분리하여 -6.35+2.80 mm구간에서 전체 탄탈럼 캐퍼시터의 약 93.2 wt.%를 회수할 수 있었다. 회수된 탄탈럼 캐퍼시터를 해머밀로 분쇄 후, 자력선별기를 통해 자력세기 300 가우스에서 분쇄물 중의 전극을 제거하였다. 전극이 제거된 자력선별 산물을 대상으로 넬슨 선별기(Knelson concentrator)를 이용한 선별 실험 결과 Bowl의 회전수 200 rpm, 유동층수 유량 7 L/min에서 76.9%의 최대 선별효율을 보였으며, 이때 품위 및 회수율은 각각 약 81.1%, 약 78.8%를 나타내었다. The study to obtain tantalum concentration from electronic components (ECs) on Printed circuit board assembly (PCBA) of laptop was conducted. Electronic components on laptop PCBA were detached from boards by using self-developed experimental apparatus. The detached electronic components were sieved and 93.2 wt.% of tantalum capacitors were concentrated from the size interval from 2.80 mm to 6.35 mm. The tantalum capacitors were pulverized by hammer mill and electrodes (anode and cathode) were removed from the grinding products by using magnetic separators under the magnetic force of 300 Gauss. Finally, tantalum concentrate was concentrated from the magnetic separator products by using Knelson concentrator, and the maximum efficiency of 76.9% was achieved under the operating condition of bowl rotating speed of 200 rpm, and fluidizing water flowrate of 7 L/min. The grade and recovery of Ta concentrate under the condition were 81.1% and 78.8%, respectively.

Urea-SCR 시스템에서의 Cu-ZSM5/알루미나 비드 촉매필터의 De-NOx 특성

장영상(Youngsang Jang),신영섭(Youngseop Shin),이병준(Byoungjun Lee),박재구(Jaikoo Park) 한국자동차공학회 2008 한국 자동차공학회논문집 Vol.16 No.5

석회질 다공성 필터 제조 및 SO_(x) 제거 특성

이광희,박재구,김현중 한국대기환경학회 2004 한국대기환경학회지 Vol.20 No.2

This study was focused on evaluating physical properties and SOx removal capability of porous lime filters prepared by a foaming and a gelcasting method. Porosities of lime filters ranged from 55% to 85%, and their mean pore sizes were about 95㎛. It was observed that porous lime filters had the continuous pore structure that most pores were inter-connected by many windows. Before SOx removal reaction a surface of porous lime filters was made up of calcium oxide, but after reaction calcium sulfate became a main component. The SOx removal efficiency and the conversion ratio of calcium oxide to calcium sulfate increased according to reaction temperature and porosity. At 1000℃, SOx removal efficiency of tilters was always over 98% regardless of the porosity. In case of the filter with the porosity of 85%, the conversion ratios of calcium oxide increased according to the reaction temperature, and they were in the range 30% to 60%.

V₂O_(5)-TiO₂촉매 담지된 세라믹 폼 필터를 이용한 NOx 제거 특성

한요섭,김현중,박재구 한국대기환경학회 2004 한국대기환경학회지 Vol.20 No.6

Ceramic foams prepared from silica -day were coated with T1O₂ and V₂O5 catalysts for selective catalytic reduction of NOx with NH₃, The effects of V₂O5 loading, reaction temperature, space velocity, and oxygen content on NOx reduction with NH₃ were mainly investigated Also, the NOx reduction characteristics of V₂O5 and V₂O5 -T1O₂ filters were compared when sulfur dioxide exists From the results, the optimal NOx reduction with the maximum reduction efficiency of 91 % could be performed under the condition with V₂O5 loading 6 .0 wt %, reaction temperature 35.0℃, space velocity 6,000h^-1 and oxygen content 5% And, the V₂O_(5)-TO₂ filters have shown higher NOx reduction efficiency and acid resistance against sulfur dioxide than the VO_(5) filters