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RISS 인기검색어
- 검색키워드
- 저자 : Zhang Anmin (검색결과 6 건)
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Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing
Xundi Zhang,Chenlin Yang,Yumei Zhang,Anmin Hu,Ming Li,Liming Gao,Huiqin Ling,Tao Hang 대한금속·재료학회 2020 ELECTRONIC MATERIALS LETTERS Vol.16 No.4
Ultra-thin wafer fabrication has become a hot spot in recent years with the growing demand for small size and high performance electronic devices. However, far less research focused on the damage behavior in ultra-thin wafer. In this work, 300 mm diameter silicon wafer was thinned to 6 µm thick by grinding plus ultra-precision dry polishing. The damage behavior before and after the dry polishing was discussed. Mechanical and surface analysis showed that the dry polishing process can help improve the strength and surface uniformity of ultra-thin wafer by removing high pressure phase and micro cracks. Series of nano beam diffraction patterns revealed the stress induced by the thinning process only existed in surface. High resolution transmission electron microscopy images analyzed by geometric phase approach indicated that surface dislocations can move across the wafer and reached bottom device layers during the dry polishing, increasing the risk of electrical deterioration. The findings are of great significance to the study on process optimization of ultra-thin wafer and provide insights into the reliability of advanced electronic packaging.
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A Privacy Preserving Vertical Handover Authentication Scheme for WiMAX-WiFi Networks
( Anmin Fu ),( Gongxuan Zhang ),( Yan Yu ),( Zhenchao Zhu ) 한국인터넷정보학회 2014 KSII Transactions on Internet and Information Syst Vol.8 No.9
Integrated WiMAX and WiFi networks is of great potential for the future due to the wider coverage of WiMAX and the high data transport capacity of WiFi. However, seamless and secure handover (HO) is one of the most challenging issues in this field. In this paper, we present a novel vertical HO authentication scheme with privacy preserving for WiMAX-WiFi heterogeneous networks. Our scheme uses ticket-based and pseudonym-based cryptographic methods to secure HO process and to achieve high efficiency. The formal verification by the AVISPA tool shows that the proposed scheme is secure against various malicious attacks and the simulation result indicates that it outperforms the existing schemes in terms of communication and computation cost.
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Yaqian Sun,Jing Wang,Xundi Zhang,Chenlin Yang,Anmin Hu,Tao Hang,Yunwen Wu,Huiqin Ling,Ming Li 대한금속·재료학회 2021 ELECTRONIC MATERIALS LETTERS Vol.17 No.6
At present, thermal compression bonding based on Cu and lead-free Sn based solder is often limited by high bonding temperature,which is higher than the melting point of solder (218 ℃). In this paper, we reported a low-temperature solid stateinsertion bonding method based on electroless Cu-Co-P micro-cones array. By adjusting the mass ratio of CuSO 4 ·5H 2 O andCoSO 4 ·7H 2 O, a series of Cu-Co-P micro-cones with diff erent morphologies were prepared. The Cu-Co-P micro-cones withhigher proportion of copper were sharper and denser and (111) orientation was also more. It was found that reducing theheight and density of micro-cones was conducive to achieve seamless bonding at lower temperature and force such as 170℃ and 750 gf. By optimizing the morphology of micro-cones, such as height, bottom diameter, vertex angle and density, theseamless and reliable bonding with high shear strength (39.9 MPa) could be achieved at 170 ℃ bonding temperature and1000 gf bonding force. The transmission electron microscopy results showed that intermetallic compounds including Cu 6 Sn 5and Cu 3 Sn existed at bonding interface, which indicated that signifi cant atomic diff usion had occurred between Cu-Co-Pmicro-cones and Sn based solder. Probable mechanisms for low-temperature insertion bonding were discussed.
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Yaqiang Li,Penghui Ren,Yuanhang Zhang,Shengxu Wang,Jinqiu Zhang,Peixia Yang,Anmin Liu,Guangzhao Wang,Zhidong Chen,Maozhong An 한국공업화학회 2023 Journal of Industrial and Engineering Chemistry Vol.118 No.-
Finding proper additive to achieve copper superconformal electrodeposition is significantly important. Brilliant Green exhibits excellent suppressing ability to the copper electrodeposition according to electrochemicalanalysis. Meanwhile, 100 mg/L was selected as the optimum value based on the convectiondependentadsorption behavior analysis of Brilliant Green. The interaction among three different additiveswas also investigated by applying chronopotentiometry as well as Brilliant Green compete to absorbon the cathode surface with SPS. Besides, the introduction of Brilliant Green can improve the transport ofcupric ions (Cu2+). The nucleation and growth of copper deposition is 3D diffusion-controlled instantaneousgrowth process at high overpotential but 3D diffusion-controlled mixing growth process at lowoverpotential. The synergistic suppressing mechanism was proposed to explain strong suppressing effectof BG on reduction of Cu2+ and the reaction pathways was studied theoretically. Copper interconnectlayer with high FP values (80.52 % to 84.38 %) was obtained with low SDT (about 28 lm) after electroplatingprocess was optimized. The surface morphology under the influence of Brilliant Green is compactand uniform and the grain size is reduced by Brilliant Green.
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Numerical Analysis and Experiment Study of Magnetic Fluid Boundary in Seals
Yibiao Chen,Decai Li,Yanjuan Zhang,Anmin Xi 한국자기학회 2018 Journal of Magnetics Vol.23 No.2
Magnetic fluid seals are widely used technical applications of magnetic fluid. This paper presents a numerical simulation model to obtain the boundary of magnetic fluid in seals. The magnetic field in the seal is solved by finite element method, and the boundary is calculated by using Navier-Stokes equations in magnetic fluid. In order to observe the surface and obtain the seal capacity, the plane magnetic fluid seal experiment is carried out. The relationship between the seal capacity and the magnetic fluid volume is presented. The seal capacity which is obtained by the theoretical analysis has well congruence with the result of the experiment. The displacement of boundary with the pressure difference is quantitatively depicted.
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Zhou Jian,Ding Feng,Yang Jiaxuan,Pei Zhengqiang,Wang Chenxu,Zhang Anmin 대한조선학회 2021 International Journal of Naval Architecture and Oc Vol.13 No.1
This paper proposes a decision support model for USVs to improve the accuracy of collision avoidance decision-making. It is formed by Navigation Safety Domain (NSD) and domain-based Collision Risk Index (CRI), capable of determining the collision stage and risk between multiple ships. The NSD is composed of a warning domain and a forbidden domain, which is constructed under the constraints of COLREGs (International Regulations for Preventing Collisions at Sea). The proposed domain based CRI takes the radius of NSD in various encounter situations as threshold parameters. It is found that the value of collision risk in any directions can be calculated, including actual value and risk threshold. A catamaran USV and 6 given vessels are taken as study objects to validate the proposed model. It is found that the judgment of collision stage is accurate and the azimuth range of risk exists can be detected, hence the ships can take direct and effective collision avoidance measures. According to the relation between the actual value of CRI and risk threshold, the decision support rules are summarized, and the specific terms of COLREGs to be followed in each encounter situation are given.
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