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Xuelin Chen,Jin-Yuan Tang,Han Ding,Anmin Liu 대한기계학회 2021 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY Vol.35 No.4
The evolution of chip morphology, chip formation, and surface topography (Ra, Rz) with cutting parameters has become an increasingly important way to achieve higher manufacturing efficiency and better surface topography. In this investigation, the relationships of chip morphology, chip formation, and surface topography with respect to cutting parameters are developed in dry milling of cast aluminum alloys with a PCD inserter. The feed rate affects the surface roughness, although no unanimous trend is observed between cutting parameters and surface topography. Surface crack propagation directly affects the saw-tooth chip morphology and the surface topography. The chip morphology is transformed from saw-tooth to continuous type at a chip deformation ratio of 3; chip deformation ratios of 2.5, 1.875, and 1.25 achieve cutting velocities of 32.71, 35.98, and 39.25 m/s, respectively, in which a continuous chip is formed by surface crack propagation and the predominant effect of thermal softening and surface topography is significantly improved.
Yaqiang Li,Penghui Ren,Yuanhang Zhang,Shengxu Wang,Jinqiu Zhang,Peixia Yang,Anmin Liu,Guangzhao Wang,Zhidong Chen,Maozhong An 한국공업화학회 2023 Journal of Industrial and Engineering Chemistry Vol.118 No.-
Finding proper additive to achieve copper superconformal electrodeposition is significantly important. Brilliant Green exhibits excellent suppressing ability to the copper electrodeposition according to electrochemicalanalysis. Meanwhile, 100 mg/L was selected as the optimum value based on the convectiondependentadsorption behavior analysis of Brilliant Green. The interaction among three different additiveswas also investigated by applying chronopotentiometry as well as Brilliant Green compete to absorbon the cathode surface with SPS. Besides, the introduction of Brilliant Green can improve the transport ofcupric ions (Cu2+). The nucleation and growth of copper deposition is 3D diffusion-controlled instantaneousgrowth process at high overpotential but 3D diffusion-controlled mixing growth process at lowoverpotential. The synergistic suppressing mechanism was proposed to explain strong suppressing effectof BG on reduction of Cu2+ and the reaction pathways was studied theoretically. Copper interconnectlayer with high FP values (80.52 % to 84.38 %) was obtained with low SDT (about 28 lm) after electroplatingprocess was optimized. The surface morphology under the influence of Brilliant Green is compactand uniform and the grain size is reduced by Brilliant Green.