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RISS 인기검색어
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- 저자 : 최한우(H. W. Choi) (검색결과 7 건)
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소명옥(M. O. So),류길수(K. S. Rhyu),정재학(J. H. Chung),이윤형(Y. H. Lee),진선호(S. H. Jin),최한우(H. W. Choi) 한국해양대학교 해사산업연구소 2003 海事産業硏究所論文集 Vol.14 No.-
Generally, the main difficulty in the composition of tank-level control system may be in the point that plant parameters are severely varied according to the change of operating point. In order to cope with this difficulty, in this paper, an adaptive control is employed using model-following technique based on the optimal control law. Through the simulations and experiments the following results were observed. 1) The steady state error was not founded under the parameter variations caused by the change of operating point. 2) In spite of the change of operating point, the corresponding gains which were stored in the computer were found to be automatically updated so that the controller could have the adaptive ability. And also, the control specifications in view of transient response were found to be satisfied.
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컨테이너 크레인 시뮬레이터 개발을 위한 환경설정에 관한 기초연구
소명옥(M. O. So),최한우(H. W. Choi),이윤형(Y. H. Lee),윤학진(H. J. Yeun),최재준(J. J. Choi) 한국해양대학교 해사산업연구소 2003 海事産業硏究所論文集 Vol.14 No.-
The skill of the crane operator has influence on the overall profitability of a transport. But, It is very hard to train crane operators effectively by actual crane. Therefore, it is desirable for the crane simulator to be used properly, considering various condition of the crane operation. The purpose of the container crane simulator is to provide a facility for training and evaluation of crane operators and aspirants. Training using crane simulator provides crane operators with the increased safety and high efficiency. Hence, as the basic study on crane simulator, this paper introduces developers the kinds of training education programs and the setting up of environmental conditions for virtual reality crane simulator.
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우형주,최한우,배영호,최우범,Woo H-J,Choi H-W,Bae Y-H,Choi W-B 한국진공학회 2005 Applied Science and Convergence Technology Vol.14 No.2
양성자 주입과 웨이퍼접합기술을 접목한 ion-cut기술로서 SOI 웨이퍼를 제조하는 기술을 개발하였다. SRIM 전산모사에 의하면 일반 SOI 웨이퍼 (200nm SOI, 400nm BOX) 제조에는 65keV의 양성자주입이 요구된다. 웨이퍼분리를 위한 최적 공정조건을 얻기 위해 조사선량과 열처리조건(온도 및 시간)에 따른 blistering 및 flaking 등의 표면변화를 조사하였다. 실험결과 유효선량범위는 $6\~9times10^{16}H^+/cm^2$이며, 최적 아닐링조건은 $550^{\circ}C$에서 30분 정도로 나타났다. RCA 세정법으로서 친수성표면을 형성하여 웨이퍼 직접접합을 수행하였으며, IR 조사에 의해 무결함접합을 확인하였다 웨이퍼 분리는 예비실험에서 정해진 최적조건에서 이루어졌으며, SOI층의 안정화를 위해 고온열처리($1,100^{\circ}C,\;60$분)를 시행하였다. TEM 측정상 SOI 구조결함은 발견되지 않았으며, BOX(buried oxide)층 상부계면상의 포획전하밀도는 열산화막 계면의 낮은 밀도를 유지함을 확인하였다. The silicon-on-insulator (SOI) wafer fabrication technique has been developed by using ion-cut process, based on proton implantation and wafer bonding techniques. It has been shown by SRIM simulation that 65keV proton implantation is required for a SOI wafer (200nm SOI, 400nm BOX) fabrication. In order to investigate the optimum proton dose and primary annealing condition for wafer splitting, the surface morphologic change has been observed such as blistering and flaking. As a result, effective dose is found to be in the $6\~9\times10^{16}\;H^+/cm^2$ range, and the annealing at $550^{\circ}C$ for 30 minutes is expected to be optimum for wafer splitting. Direct wafer bonding is performed by joining two wafers together after creating hydrophilic surfaces by a modified RCA cleaning, and IR inspection is followed to ensure a void free bonding. The wafer splitting was accomplished by annealing at the predetermined optimum condition, and high temperature annealing was then performed at $1,100^{\circ}C$ for 60 minutes to stabilize the bonding interface. TEM observation revealed no detectable defect at the SOI structure, and the interface trap charge density at the upper interface of the BOX was measured to be low enough to keep 'thermal' quality.
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An ERD-TOF System for the Depth Profiling of Light Elements
김영석,우형주,김준곤,김덕경,최한우,홍완,Kim, Y. S.,Woo, H. J.,Kim, J. K.,Kim, D. K.,Choi, H. W.,Hong, W. The Korean Vacuum Society 1996 Applied Science and Convergence Technology Vol.5 No.1
An ERD-TOF system is constructed for the nondestructive depth profiling of light elements in thin films in the range of several thousand angstroms. The particles, recoiled by 10 $MeV^{35}Cl$ projectiles, were detected by a Time-Of-Flight spectrometer composed of a MCP (Micro Channel Plate) and a SSB (Silicon Surface Barrier) detector. A two parameter data acquisition system composed of two PC's was constructed for registering simultaneous time and energy signals. A $Si_3N_4$/poly-Si/$SiO_2$/Si sample was anlayzed and the result is compared with RBS. The detection limit, maximum probable depth and depth resolution for light elements in silicon are about $4\times10^{14}atoms/\textrm{cm}^2$, 5, 000$\AA$ and 100$\AA$, respectively.
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김준곤,우형주,최한우,김기동,홍완,Kim Joonkon,Woo H. J.,Choi H. W.,Kim G. D.,Hong W. The Korean Vacuum Society 2005 Applied Science and Convergence Technology Vol.14 No.2
지난 10년 동안 유전체 내부에 형성된 나노미터 크기의 규소알갱이는 발광센터로서 주목 받아왔다 나노미터 크기인 결정질 규소의 엑시토닉 전자-홀의 쌍들이 발광결합에 기여한다고 여겨진다. 그러나 규소결정에 존재하는 여러가지 결함들은 비발광 천이의 경로가 되어 나노규소결접립의 발광천이와 경쟁하여 발광효율을 저하시키는 요인이 된다. 이러한 결정 결함들은 고온 열처리과정에서 대부분 소멸되나 $1000^{\circ}C$ 이상의 공정 에서도 나노규소와 유전체의 계면에 존재하는 결함들은 나노규소결정립의 발광을 억제하게 된다. 일반적으로 수소로서 규소결정립의 계면을 마감처리하게 되면 규소결정립의 발광효율이 획기적으로 향상되나 불행하게도 매질 내 수소의 높은 이동성으로 말미암아 후속 열처 리 과정에서 수소마감효과는 쉽게 손실된다. 따라서 본 연구에서는 온도가역적인 수소 대신 인을 이온주입 방법으로 첨가하여 수소와 같은 계면 마감효과를 얻으며 또한 후속 고온공정 에 대한 내구력을 증대시켰다. 모재인 산화규소 기판에 400keV, $1\times10^{17}\; Si/cm^2$와 그 주위에 균일한 함량을 도핑하기 위하여 다중에너지의 인을 주입하였다. 규소와 인을 이온주입 후 Ar 분위기에서 $1100^{\circ}C$ , 두 시간의 후열처리를 통하여 규소결정립을 형성하였으며 향상된 내열효과를 시험하기 위하여 Ar 분위기에서 $1000^{\circ}C$까지 열처리하였다. 인으로 마감된 나노미터 크기인 규소 결정립의 향상된 광-발광(PL)효과와 감쇄시간, 그리고 발광파장의 변화에 대하여 논의하였다. Nanometric crystalline silicon (no-Si) embedded in dielectric medium has been paid attention as an efficient light emitting center for more than a decade. In nc-Si, excitonic electron-hole pairs are considered to attribute to radiative recombination. However the surface defects surrounding no-Si is one of non-radiative decay paths competing with the radiative band edge transition, ultimately which makes the emission efficiency of no-Si very poor. In order to passivate those defects - dangling bonds in the $Si:SiO_2$ interface, hydrogen is usually utilized. The luminescence yield from no-Si is dramatically enhanced by defect termination. However due to relatively high mobility of hydrogen in a matrix, hydrogen-terminated no-Si may no longer sustain the enhancement effect on subsequent thermal processes. Therefore instead of easily reversible hydrogen, phosphorus was introduced by ion implantation, expecting to have the same enhancement effect and to be more resistive against succeeding thermal treatments. Samples were Prepared by 400 keV Si implantation with doses of $1\times10^{17}\;Si/cm^2$ and by multi-energy Phosphorus implantation to make relatively uniform phosphorus concentration in the region where implanted Si ions are distributed. Crystalline silicon was precipitated by annealing at $1,100^{\circ}C$ for 2 hours in Ar environment and subsequent annealing were performed for an hour in Ar at a few temperature stages up to $1,000^{\circ}C$ to show improved thermal resistance. Experimental data such as enhancement effect of PL yield, decay time, peak shift for the phosphorus implanted nc-Si are shown, and the possible mechanisms are discussed as well.
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