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강혜준,정재필 한국마이크로전자및패키징학회 2019 마이크로전자 및 패키징학회지 Vol.26 No.4
Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.
강혜준(Hyejun Kang),백범규(Bumgyu Baek),정재필(Jae Pil Jung) 대한용접·접합학회 2020 대한용접·접합학회지 Vol.38 No.6
A solder has been extensively used for long time in electronics packaging field, and there are various Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, Sn-Bi and etc. Recently, the low temperature solder, typically Sn-58wt%Bi-X alloys, attract attention from industry because of flexible printed circuit board (FPCB) application and to avoid bending or warpage of big size electronic devices after high temperature soldering. In the Sn-58wt%Bi-X solder, basic important issues are melting temperature, wettability, microstructure, mechanical properties and etc. Specifically, the Sn-58wt%Bi-X solder receives much attention to improve the brittleness by grain refinement of Bi-phase. In this paper, recent studies about Sn-58wt%Bi-X solders were reviewed including melting temperature, microstructure and mechanical properties.
황승준,강혜준,김정오,정재필 한국마이크로전자및패키징학회 2019 마이크로전자 및 패키징학회지 Vol.26 No.3
In this paper, the principles, types and characteristics of the laser and laser soldering are introduced. Laser soldering methods for electronics, metals, semiconductors are also presented. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled beam. Demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro joint. Laser absorption ratio depends on materials, and each material has different absorption or reflectivity of the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance. In this paper, the performance of Nd:YAG laser soldering is compared to the hot blast reflow. Meanwhile, a diode laser gives different wavelength and smaller parts with high performance, but it has various reliability issues such as heat loss, high power, and cooling technology. These issues need to be improved in the future, and further studies for laser micro-joining and soldering are required.
김장백,서성민,강혜준,조도훈,스리 하리니 라젠드란,정재필,Kim, Jang Baeg,Seo, Seong Min,Kang, Hye Jun,Cho, Do Hoon,Rajendran, Sri Harini,Jung, Jae Pil 한국마이크로전자및패키징학회 2021 마이크로전자 및 패키징학회지 Vol.28 No.1
Sn-3wt%Ag-0.5wt%Cu (SAC305) solder is most popular solder in electronics industry. However, SAC305 has also drawbacks such as growth of β-Sn phase, intermetallic compounds (IMCs) of Ag3Sn, Cu6Sn5 and Cu3Sn which can result in deterioration of solder joints in terms of metallurgically, mechanically and electrically. Thus, improvement of SAC305 solders have been investigated continuously by addition of alloying elements, nano-particles and etc. In this paper, recent improvements of SAC solders including nano-composite alloys and related solderabilty and metallurgical and mechanical properties are investigated.
TSV (Through-Si-Via) 기술을 이용한 반도체의 3차원 적층 실장
조도훈(Do Hoon Cho),강혜준(Hye Jun Kang),서성민(Seong Min Seo),김장백(Jang Baeg Kim),스리하리니 라젠드란(Sri Harini Rajendran),정재필(Jae Pil Jung) 대한용접·접합학회 2021 대한용접·접합학회지 Vol.39 No.3
Recently, the electronics industry is developing toward artificial intelligence, the Internet of things, fifth-generation technology, and high-performance computing. High-density electronics packaging, high speed, high performance, and miniaturized size are required to satisfy these trends. Three-dimensional Si-chip stacking using through-Si via (TSV) has attracted the attention of industries related to these requirements. In this study, TSV fabrication using the deep reactive ion-etching process and the coating of functional layers on the TSV wall, such as insulating, adhesion, and seed layers, were investigated. In addition, Cu electroplating in the TSV was analyzed in detail. The solutions to other accompanied technical barriers for packaging high-density electronics can improve smartness and convenience.
New High Entropy Alloy (HEA) Reinforced SAC 305 Solder
Sri Harini Rajendran(라젠드란 스리 하리니),Hye Jun Kang(강혜준),Jae Pil Jung(정재필) 대한용접·접합학회 2021 대한용접학회 특별강연 및 학술발표대회 개요집 Vol.2021 No.5
In order to meet the demands for the developing packaging technologies and to be in pace with the WEEE (2012-19-EU) and RoHS (2002-95-EU) implementations, series of lead-free solders has been developed. Sn-3.0Ag-0.5Cu and Sn-58Bi are the interesting solders fulfilling the demands and environmental standards of consumer electronic industries. However, the brittle phases remain a serious threat in terms of mechanical reliability. Many methods have been adopted by the researches to enhance the reliability of existing solders such as micro-alloying and the addition of second phase particles. However, the quest for new solders remains among the researchers. In the present work, new high entropy alloys have been incorporated in the soldering field. Varying compositions of high entropy solder reinforced SAC alloys were prepared by mechanical mixing. The solder paste was printed and reflowed with 1608 chip capacitor. The microstructure and intermetallic phase evolution along the solder/capacitor for the high entropy solder addition has been characterized by scanning electron microscope. The optimum composition with good solderability were analyzed using wetting and spreading test (JIS-Z-319). The shear tests were analyzed for the mechanical reliability and the data is interpreted using Weibull statistical distribution. High entropy solders added have optimistic microstructure and solderability. Besides, high entropy solders are found to be beneficial in their mechanical properties.
Do Hoon Cho(조도훈),Sri Harini Rajendran,Hye Jun Kang(강혜준),Jae Pil Jung(정재필) 대한용접·접합학회 2021 대한용접학회 특별강연 및 학술발표대회 개요집 Vol.2021 No.5
The nickel-based superalloy of Inconel 600 containing high chromium content was developed as a superior corrosion resistance in acidic environments. Since the Inconel 600 shows high corrosion resistance and good fatigue strength, the Inconel 600 has been utilized in high temperature environments such as heat treatment furnace parts and industrial vacuum equipment components. Inconel X-750 is also a austenitic nickel alloy, is widely used in heat exchanger, chemical containers and metallurgical industries because of its good corrosion resistance and heat resistance. Fiber laser welding is an advanced welding method which gives high energy density, minimization of heat-affect zone, high heating-cooling speed, less thermal-stress, and so on. The joint can be applicable to the high temperature parts such as various engine and airframe components, exhaust liners, muffles, turbine seals and etc. In the present study, Inconel 600 and X-750 were welded using QCW fiber laser from IPG and their microstructure and the mechanical properties were analyzed. The experimental results showed that Inconel 600 and Inconel X-750 were welded successfully with good bead appearance. The welded joint gave deep penetration, and the microstructure of fusion zone exhibited mainly columnar dendrites. The as-welded samples were subjected to heat treatment at various temperature. The microstructure of the weld pool and the corresponding tensile strength & elongation for welded joints were characterized from Scanning Electron Microscope and weld-joint tensile tests. The hardness of the weld zone before and after heat treatment were evaluated using Vickers micro hardness tester.