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A1-25Nb계와 (A1,X)-25Nb계 (X = Cr, Cu, Fe, Mn)의 기계적 합금화에 의한 금속간 화합물의 형성 거동에 관한 연구
최재웅,강성군,Choi, Jae-Woong,Kang, Sung-Goon 한국재료학회 2001 한국재료학회지 Vol.11 No.9
In Al-25Nb binary system, it was observed only formation of $D0_{22}$ $Al_3Nb$ intermetallic compound after 5hr milling but it was not observed formation of meta stable phase like L1$_2$ phase. In this state, $D0_{22}$ $Al_3Nb$ fabricated had nano sized grain of approximately 20nm. Ternary systems, transition metals such as Cr, Cu, Fe, Mn were added 6~12at.% as substitution of Al, showed formation of $D0_{22}$ $Al_3Nb$ like Al-25Nb binary system. In Al- l2Cu-25Nb system, it was observed that broad XRD pattern like amorphization of Al and not observed formation of $D0_{22}$ $Al_3Nb$ after 5hr milling. But there was mixed phase of a lot of amorphous Al and little $D0_{22}$ $Al_3Nb$ through TEM. In the states of unalloyed, 5~7hr milling time, those showed exothermic reaction at 35$0^{\circ}C$, which was formation of $D0_{22}$ $Al_3Nb$ like Al-25Nb binary system. With increasing milling time to 10hr, $D0_{22}$ $Al_3Nb$ was transformed to mixed phase of amorphous and nanocryatlline, having approximately 10nm grain but the meta stable $Al_3Nb$ was not fabricated by adding transition metals.
Al-Ni계의 기계·화학적 방법으로 제조된 Raney Ni의 미세 구조 분석
최재웅,이창래,강성군,Choi, Jae-Woong,Lee, Chang-Rae,Kang, Sung-Goon 한국재료학회 2003 한국재료학회지 Vol.13 No.1
The Raney Ni catalyst was fabricated by mechanochemically process(MC process) in the Al-Ni system. Intermetallic compound obtained by mechanical alloying was leached in an alkaline solution. The characteristics of the mechanically alloyed powder and Raney Ni catalyst were analyzed by XRD, ICP-AES and EXAFS. In Al-50wt.%Ni, the metastable intermetallic compound phase close to AlNi phase was obtained by mechanical alloying unlike Al-Ni equilibrium phase diagram. The metastable intermetallic compound was transformed into $Al_3$$Ni_2$phase via the annealing at $750^{\circ}C$. The microstructure of Raney Ni fabricated by MC process was mainly bcc Ni including fcc Ni.
무전해 Ni-B 도금을 이용한 플라즈마 디스플레이 버스 전극의 확산 방지막 제조
최재웅,홍석준,이희열,강성군,Choi, Jae-Woong,Hong, Seok-Jun,Lee, Hee-Yeol,Kang, Sung-Goon 한국재료학회 2003 한국재료학회지 Vol.13 No.2
In this study, we have investigated the availability of the electroless Ni-B plating for a diffusion barrier of the bus electrode. The Ni-B layer of 1$\beta$: thick was electroless deposited on the electroplated Cu bus electrode for AC plasma display. The layer was to encapsulate Cu bus electrode to prevent from its oxidation and to serve as a diffusion barrier against Cu contamination of the transparent dielectric layer in AC plasma display. The microstructure of the as-plated barrier layer was made of an amorphous phase and the structure was converted to crystalline at about 30$0^{\circ}C$. The concentration of boron was about 5∼6 wt.% in the electroless Ni-B deposit regardless of DMAB concentration. The electroless Ni-B deposit was coated on the surface of the electroplated Cu bus electrode uniformly. And the electroless Ni-B plating was found to be an appropriate process to form the diffusion barrier.
무전해 Ni-B 도금을 이용한 플라즈마 디스플레이 버스 전극용 확산방지막의 열처리 영향
최재웅,황길호,홍석준,강성군,Choi Jae Woong,Hwang Gil Ho,Hong Seok Jun,Kang Sung Goon 한국재료학회 2004 한국재료학회지 Vol.14 No.8
Thin Ni-B films, 1 ${\mu}m$ thick, were electrolessly deposited on Cu bus electrode fabricated by electro deposition. The purpose of these films is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier against copper contamination of dielectric layer in AC-plasma display panel. The layers were heat treated at $580^{\circ}C$(baking temperature of dielectric layer) with and without pre-annealing at $300^{\circ}C$($Ni_{3}B$ formation temperature) for 30 minutes. In the layer with pre-annealing, amount of Cu diffusion was lower about 5 times than that in the layer without pre-annealing. The difference of Cu concentration could be attributed to Cu diffusion before $Ni_{3}B$ formation at grain boundaries. However, the diffusion behavior of the layer with pre-annealing was similar to that of the layer without pre-annealing after $Ni_{3}B$ formation. With increasing annealing time, Cu concentration of both layers increased due to grain growth.
기계적 합금화법과 방전 플라즈마 소결법으로 제조된 Al-25Ti-8Mn 금속간 화합물의 산화 거동
최재웅,김기홍,황길호,홍석준,강성군,Choi J. W.,Kim K. H.,Hwang G. H.,Hong S. J.,Kang S. G. 한국재료학회 2005 한국재료학회지 Vol.15 No.7
The oxidation behavior and the thermal stability of nanocrystalline Al-25Ti-8Mn intermetallic compound were investigated. $Al_3Ti$ intermetallic compound, which has a potential for high temperature structural material, was fabricated by mechanical alloying(MA) with $8at.\%$ Mn to enhance the thermal stability and ductility. And Al-25Ti-8Mn intermetallic compound was sintered by spark plasma sintering(SPS) at $700^{\circ}C$. After sintering process, cubic $Ll_2$ structure was maintained without phase transformation and the grain size was about 50nm. To investigate the oxidation behavior of the specimens, thermal gravimetric analysis(TGA) was performed at 700, 800, 900, and $1000^{\circ}C$ for 24 h in $O_2$. As the temperature increased from $700^{\circ}C\;to\;900^{\circ}C$ the weight gain of specimens increased. However at $1000^{\circ}C$, unlike the oxidation behavior of $700^{\circ}C\;to\;900^{\circ}C$, the weight gain of specimen decreased drastically and the transition from linear rate region to parabolic rate region occurred rapidly due to the dense $\alpha-Al_2O_3$.
무전해 도금법으로 제조된 Ni-B 확산 방지막의 Cu 확산 거동
최재웅,황길호,한원규,이완희,강성군,Choi, Jae-Woong,Hwang, Gil-Ho,Han, Won-Kyu,Lee, Wan-Hee,Kang, Sung-Goon 한국재료학회 2005 한국재료학회지 Vol.15 No.9
Thin Ni-B layer, $1{\mu}m$ thick, was electrolessly deposited on Cu electrode fabricated by electro-deposition. The purpose of the layer is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier. The layers were annealed at $580^{\circ}C$ with and without pre-annealing at $300^{\circ}C$ for . 30minutes. In the layer with pre-annealing, the amount of Cu diffusion was lower about 5 times than the layer without pre-annealing. The difference in Cu concentration may be attributed to $Ni_3B$ formation prior to Cu diffusion. However, the difference in Cu concentration decreased during the annealing time of 5 h due to the grain growth of Ni.
Cu 미세 배선을 위한 무전해 Ni-B 확산 방지막의 Cu 확산에 따른 상변태 거동
최재웅,황길호,송준혜,강성군,Choi J. W.,Hwang G. H.,Song J. H.,Kang S. G. 한국재료학회 2005 한국재료학회지 Vol.15 No.11
The phase transformation of Ni-B diffusion barrier by Cu diffusion was studied. The Ni-B diffusion barrier, thickness of 10(Inn, was electrolessly deposited on the electroplated Cu interconnect. The specimens were annealed either in Ar atmosphere or in $H_2$ atmosphere from $300^{\circ}C\;to\;800^{\circ}C$ for 30min, respectively. Although the Ni-B coated specimens showed the decomposition of $Ni_3B$ above $400^{\circ}C$ in both Ar atmosphere and $H_2$ atmosphere, Ni-B powders did not show the decomposition of $Ni_3B$. The $Ni_3B$ was decomposed to Ni and B in hi atmospherr: and the metallic Ni formed the solid solution with Cu and the free B was oxidized to $B_2O_3$. However, both the boron hydride and free B were not observed in the diffusion barrier after the annealing in $H_2$ atmos There. These results revealed that the decomposition of $Ni_3B$ by Cu made the Cu diffusion continued toward the Ni-B diffusion barrier.
Inconel 738LC의 Pt Modified-pack Aluminizing 내산화 코팅의 산화저항성에 미치는 Palladium 완충층의 영향
한원규,최재웅,홍석준,황길호,강성군,Han W. K.,Choi J. W.,Hong S. J.,Hwang G. H.,Kang S. G. 한국재료학회 2005 한국재료학회지 Vol.15 No.4
In this study, the effects of Pd buffer layer on the oxidation resistance of Pt modified-pack aluminized Inconel 738LC, used for gas turbine, were investigated. Pd was electroplated on Inconel 738LC, and Pt was electroplated on the electroplated Pd surface. Thus, the thickness of electroplated Pt/Pd was $10\;{\mu}m$ and the atomic ratio of Pt : Pd was about 6 : 4. After Pt/Pd electroplating, Inconel 738LC was pack aluminized to form the oxidation resistant layer. To investigate the oxidation resistance of Pt/Pd modified-pack aluminized Inconel 738LC, iso-thermal oxidation and cyclic oxidation were performed. The iso-thermal oxdation and the cyclic oxidation data indicated that the Pt/Pd modified-pack aluminized Inconel 738LC was more oxidation resistant than the Pt modified-pack aluminized Inconel 738LC. It was thought that the difference of thermal expansion coefficient between Inconel 738LC and Pt was lowered by the Pd buffer layer.