동축 구조의 인쇄회로기판을 사용한 테스트 소켓의 S-파라미터 추출

김문정 한국소프트웨어감정평가학회 2022 한국소프트웨어감정평가학회 논문지 Vol.18 No.2

To cope with various pitches and pin arrangements, S-parameter analysis of test sockets utilizes printed circuit boards. It is known that a de-embedding process is required to remove parasitic components of a printed circuit board. In general, a wiring design process of a printed circuit board applies a transmission line having a microstrip structure. However, in this paper, a printed circuit board is designed using a coaxial transmission line, and a test fixture is constructed by assembling the test socket and the printed circuit boards in the vertical direction. The vertical assembly method of the test socket and the printed circuit boards in this paper can shorten the signal transmission path and minimize the parasitic components of the fixture. In this paper, the diameters of the signal pad, the ground pad, and the via and printed circuit board thickness are designed. The S-parameters are calculated using 3-dimensional electromagnetic field simulation. It is expected that the coaxial structure design of the printed circuit board using the placement of the via structure and the fixture structure of the vertical assembly method can be utilized as an S-parameter extraction method for the test socket.

RF 통신 시스템의 면적 축소를 위한 8층 시스템-인-보드 임베디드 인쇄회로기판

정진우(Jinwoo Jeong),이재훈(Jae-Hoon Yi),전국진(Kukjin Chun) 大韓電子工學會 2011 電子工學會論文誌-SD (Semiconductor and devices) Vol.48 No.2

삼중대역(2.3/2.5/3.5㎓) m-WiMAX 시스템의 제작을 위한 8층의 인쇄회로기판을 제작하였다. 고주파 동작시에도 우수한 성능을 확보하기 위하여 저유전율을 사용한 인쇄회로기판을 제작하였다. 또한 시스템 전체의 크기를 축소하기 위하여 수동소자를 삽입시킨 임베디드 인쇄회로기판을 제작하였다. 그 결과 시스템 면적의 9%를 줄일 수 있었다. 제작된 인쇄회로기판을 사용하여 삼중대역 m-WiMAX 시스템이 제작되었으며, 인터넷 연결 테스트를 성공적으로 수행하였다. 개발된 임베디드 인쇄회로기판은 시스템의 면적 축소와 저신호 손실 RF 통신 시스템에 효과적인 대응을 가능하게 할 것이다. 8-layer printed circuit board is designed and implemented for triple band(2.3/2.5/3.5㎓) m-WiMAX system. In order to maintain excellent RF performance, low dielectric constant material is used for implementation of the printed circuit board. Also, embedded printed circuit board which embed passive devices is manufactured to reduce total system area. As a result, total system area is cut off by 9%. Triple band m-WiMAX system is produced using embedded printed circuit board. Furthermore, internet connecting test is performed and proved successful running of the system. The developed embedded printed circuit board will provide a effective solution for system area reduction and low loss signal RF communication system.

Difference of Potential Range Formed at the Anode Between Water Drop Test and Temperature Humidity Bias Test to Evaluate Electrochemical Migration of Solders for Printed Circuit Board

( Young Ran Yoo ),( Young Sik Kim ) 한국부식방식학회 2023 Corrosion Science and Technology Vol.22 No.3

Two types of accelerated tests, Water Drop Test (WDT) and Temperature-Humidity-Bias Test (THBT), can be used to evaluate the susceptibility to electrochemical migration (ECM). In the WDT, liquid water is directly applied to a specimen, typically a patterned conductor like a printed circuit board. Time to failure in the WDT typically ranges from several seconds to several minutes. On the other hand, the THBT is conducted under elevated temperature and humidity conditions, allowing for assessment of design and life cycle factors on ECM. THBT is widely recognized as a more suitable method for reliability testing than WDT. In both test methods, localized corrosion can be observed on the anode. Composition of dendrites formed during the WDT is similar to that formed during THBT. However, there is a lack of correlation between the time to failure obtained from WDT and that obtained from THBT. In this study, we investigated the relationship between electrochemical parameters and time to failure obtained from both WDT and THBT. Differences in time to failure can be attributed to actual anode potential obtained in the two tests.

Development of Build-up Printed Circuit Board Manufacturing Process Using Rapid Prototyping Technology and Screen Printing Technology

Im, Yong-Gwan,Cho, Byung-Hee,Chung, Sung-Il,Jeong, Hae-Do Korean Society for Precision Engineering 2003 International Journal of the Korean Society of Pre Vol.4 No.4

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

Stretchable strain-tolerant soft printed circuit board: a systematic approach for the design rules of stretchable interconnects

조현,이윤택,이병문,변정환,정승준,홍용택 한국정보디스플레이학회 2020 Journal of information display Vol.21 No.1

Reported herein is a stretchable strain-tolerant soft printed circuit board (SPCB) following optimized circuit design rules. Inkjet-printed interconnects with a wrinkled structure and rigid epoxy patterns allow the outstanding stretchability and strain distribution controllability of the SPCB, respectively. The prototype circuits show reliable operation under various mechanical deformations, even in the 180° folding state and the irregular deformed state with 25% tensile strain. This research paves a promising route for the realization of highly reliable soft printed circuits with a high degree of design freedom, which can thus be used for driver chip mounting or driver board interconnection for the stretchable display applications.

Flexible Printed Circuit Board를 이용한 Light Emitting Diode Package Substrate 제작 및 특성평가

박정갑,박정호,이정우,김석훈,신세희,김태유,박종환,김선우,최호준,오용수,서수정 한국진공학회 2017 한국진공학회 학술발표회초록집 Vol.2017 No.2

위상 특징을 활용한 딥러닝 기반의 모아레 패턴 복원 방법

김찬회,김태정,박태형 제어·로봇·시스템학회 2024 제어·로봇·시스템학회 논문지 Vol.30 No.5

In this paper, we focus on the restoration of a 3D height to inspect the components of a printed circuit board. The majority of automatic optical inspectors encounter issues with reflections and shadows caused by the lighting on the components. These conditions obstruct accurate measurements of shapes and heights. To efficiently restore these shadowed and reflected areas, we first define the regions of reflection and shadow based on the pixel values in an image. Then, we propose a network that incorporates a loss function by utilizing the characteristics of moiré patterns for restoration. The effectiveness of our proposed method is demonstrated through experimental results.

연성인쇄회로기판의 액중 레이저 절단

김택구(Teakgu Kim),김주한(Joohan Kim) 한국생산제조학회 2013 한국생산제조학회지 Vol.22 No.1

The laser cutting process which is flexible and rapid usually provides a better result in cutting of flexible printed circuit boards (FPCB). However, circuit-short by the re-deposition of debris from laser ablation or its heat affect zone (HAZ) on the cutting surfaces can be a problem. A laser cutting process of FPCB in the presence of liquid can minimize these negative effects. The temperature distribution of copper and polymer parts of FPCB was analyzed with numerical simulation and the experimental results were presented to evaluate this process. Generally, laser cutting under liquid has advantages of less re-deposition of carbides and less HAZ on the cutting edges. However, bubble generation and laser beam control through the liquid media should be considered carefully to obtain a successful result.

연성 인쇄 회로 기판을 이용한 초고주파 MEMS 송신기 연구

명성식(Seong-Sik Myoung),김선일(Seon-Il Kim),정주용(Joo-Yong Jung),육종관(Jong-Gwan Yook) 한국전자파학회 2008 한국전자파학회논문지 Vol.19 No.1

본 논문에서는 멤스 기술의 하나인 연성 인쇄 회로 기판을 이용하여 임의의 형태로 변형이 가능한 초고주파 멤스 송신기를 제안하였다. 연성 인쇄 회로 기판은 그 무게가 가볍고 두께가 얇아 경량 소형화 모듈을 만드는데 유리한 장점이 있다. 또한, 연성 인쇄 회로 기판은 종이와 같이 유연한 특성을 가지고 있어 평면이 아닌 임의의 곡면 등에 실장할 수 있는 장점을 가지고 있다. 본 논문에서는 근거리 센서 네트워크 구성을 위한 직교 주파수분할 다중 전송 방식을 위한 선형 무선 송신기를 설계 제작하였다. 송신 모듈의 능동 회로는 전력효율이 높고 선형성이 우수하여 전력 증폭기에 많이 사용되고 있는 InGaP/GaAs HBT 공정을 사용하여 설계 및 제작하였으며, 매칭 회로 및 필터 등의 수동 회로는 연성 인쇄 회로 기판에 직접 집적화하여 제작하였다. 제작된 멤스 송신기는 EVM 특성을 통하여 시스템 성능을 분석하였다. This paper presents the flexible MEMS transmitter based on flexible printed circuit board or FPCB, which can be transformed to arbitrary shape. The FPCB is suitable to fabricate light weight and small size modules with the help of its thin thickness. Moreover a module based on FPCB can be attached on the arbitrary curved surface due to its flexible enough to be rolled up like paper. In this paper, the flexible MEMS transmitter integrated on FPCB for a short-distance sensor network which is based on orthogonal frequency division multiplexing(OFDM) communication system is proposed. The active device of the proposed flexible MEMS transmitter is fabricated on InGaP/GaAs HBT process which has been used for power amplifier design to take advantages of high linear and high efficient characteristics. Moreover, the passive devices such as the filter and signal lines are integrated and fabricated on the FPCB board. The performance of the fabricated flexible MEMS transmitter is analyzed with EVM characteristics of the output signal.

ARM을 이용한 카메라 시스템 보드 개발에 관한 연구

최영규 한국정보전자통신기술학회 2018 한국정보전자통신기술학회논문지 Vol.11 No.6

In modern society, CCTV, which is the eye of surveillance, is being used to collect image data in various ways in daily life. CCTV is used not only for security, surveillance, and crime prevention but also in many fields such as automobile and black box. In this paper, we have developed a STM32F407 ARM chip based camera system for various applications. In order to develop camera system, modeling of camera system based on 3D structure was carried out in SolidWorks environment. The PCB board design was developed to extract the PCB parts from the camera system modeling files into iges files, convert them from the Altium Designer tool into 3D and 2D boards, After designing the camera system circuit and PCB, we have been studying the implementation of the stable system by using TRM (Thermal Risk Management) tool to cope with the heat simulation generated on the board. 현대 사회는 감시의 눈이라 하는 CCTV가 일상생활 속에서 다양한 방법으로 영상데이터를 수집하기 위해 사용되고 있다. 치안 및 감시, 방범용으로 CCTV를 활용할 뿐만 아니라 자동차에 블랙박스 등 많은 분야에서 활용되고 있다. 본 논문에서는 STM32F407 ARM 칩을 기반으로 다양한 분야에 응용할 수 있는 카메라 시스템을 개발하기 위해 연구를 진행하였다. 카메라 시스템 개발을 위해 솔리드 웍스 환경에서 전체적인 구조를 3D를 기반으로 카메라 시스템을 모델링을 진행하였다. PCB 보드 설계는 카메라 시스템 모델링 파일에서 PCB 부품을 iges 파일로 추출하여 Altium Designer 툴에서 3D와 2D 보드로 변환하여 PCB 설계 진행함으로써 완성도 높은 조립성을 가질 수 있도록 진행하였다. 카메라 시스템 회로 및 PCB를 설계한 후, TRM(Thermal Risk Management) 툴을 활용해서 보드에서 발생하는 발열 시뮬레이션을 진행을 통해 대처할 수 있도록 함으로써 안정적인 시스템 구현에 관한 연구를 진행하였다.