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Binyu Wang,Jianpeng Wang,Dingkun Ma,Laili Wang,Fengtao Yang,Xinying Li,Youbo Tan 전력전자학회 2019 ICPE(ISPE)논문집 Vol.2019 No.5
Due to a series of advantages compared with other existing power converters, modular multilevel converters (MMCs) have been widely used in the last decade. However, in some applications, such as the offshore wind power transmission, the MMC submodules (SMs) are subjected to harsh operating environment and adverse mission profiles which can easily lead to failures in the solder layers of IGBT modules. Therefore, the lifetime estimation is very important to predict the reliability of MMC. This paper studies the fundamental-frequency thermal cycles and proposes a lifetime estimation method of MMC SMs based on the combination of finite element analysis (FEA) and the physical lifetime model. This method provides a deeper physical description of the failure mechanism and considers the thermal coupling among the chips, which make the lifetime calculation more accurate. The simulation time of FE in this research is acceptable. The distribution of lifetime is presented in the form of a colorful cloud map, rather than a single number, from which we can know the most vulnerable part of the solder layers. This can help us find the appropriate measures to improve the reliability of MMC SMs. In this paper, the principle and reliability issues of MMC are first analyzed. Second, the loss of the SM is calculated through simulation and curve fitting. Then, a 3D finite element (FE) model of MMC SM is developed and the FE simulation is performed. Finally, the lifetime of the SM is obtained based on the FEA results and Morrow lifetime model.
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Liang Li,Zhang Fengmei,Feng Naibo,Kuang Biao,Fan Mengtian,Chen Cheng,Pan Yiming,Zhou Pengfei,Geng Nana,Li Xingyue,Xian Menglin,Deng Lin,Li Xiaoli,Kuang Liang,Luo Fengtao,Tan Qiaoyan,Xie Yangli,Guo Fen 생화학분자생물학회 2023 Experimental and molecular medicine Vol.55 No.-
Osteoarthritis (OA) is a full-joint, multifactorial, degenerative and inflammatory disease that seriously affects the quality of life of patients due to its disabling and pain-causing properties. ER stress has been reported to be closely related to the progression of OA. The inositol-requiring enzyme 1α/X-box-binding protein-1 spliced (IRE1α/XBP1s) pathway, which is highly expressed in the chondrocytes of OA patients, promotes the degradation and refolding of abnormal proteins during ER stress and maintains the stability of the ER environment of chondrocytes, but its function and the underlying mechanisms of how it contributes to the progression of OA remain unclear. This study investigates the role of IRE1α/ERN1 in OA. Specific deficiency of ERN1 in chondrocytes spontaneously resulted in OA-like cartilage destruction and accelerated OA progression in a surgically induced arthritis model. Local delivery of AdERN1 relieved degradation of the cartilage matrix and prevented OA development in an ACLT-mediated model. Mechanistically, progranulin (PGRN), an intracellular chaperone, binds to IRE1α, promoting its phosphorylation and splicing of XBP1u to generate XBP1s. XBP1s protects articular cartilage through TNF-α/ERK1/2 signaling and further maintains collagen homeostasis by regulating type II collagen expression. The chondroprotective effect of IRE1α/ERN1 is dependent on PGRN and XBP1s splicing. ERN1 deficiency accelerated cartilage degeneration in OA by reducing PGRN expression and XBP1s splicing, subsequently decreasing collagen II expression and triggering collagen structural abnormalities and an imbalance in collagen homeostasis. This study provides new insights into OA pathogenesis and the UPR and suggests that IRE1α/ERN1 may serve as a potential target for the treatment of joint degenerative diseases, including OA.
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