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3차원 패키징용 TSV의 열응력에 대한 열적 전기적 특성
정일호,기세호,정재필,Jeong, Il Ho,Kee, Se Ho,Jung, Jae Pil 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.21 No.2
Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.
Analysis of the Electrical Characteristics and Structure of Cu-Filled TSV with Thermal Shock Test
정일호,노명훈,Flora Jung,Wan Ho Song,Michael Mayer,정재필 대한금속·재료학회 2014 ELECTRONIC MATERIALS LETTERS Vol.10 No.3
The electrical characteristics and failure of a Through-Silicon Via (TSV) were investigated using a thermal shock test. The electrical characteristics, such as resistance (R), self-inductance (Ls), self-capacitance (Cs), and mutual capacitance (Cm), were extracted using a T-equivalent circuit. A cross section of the Cu-filled via was observed by field emission-scanning electron microscopy and the electrical characteristics were measured using a commercial Agilent E4980A LCR Meter. The experimental results revealed R, Ls, Cs, and Cm values of 3.2 mΩ, 29.3 pH, 12 fF, and 0.42 pF, respectively. Cm occurred between the charge-holding TSVs, which changed from 0.42 pF to 0.26 pF due to a permittivity transition of the Cu ion drift. After 1,000 cycles of a thermal shock test, cracks were observed between the opening and around the side of the TSV and Si wafer due to mismatch of the coefficient of thermal expansion between the Cu-plug and Si substrate.
정일호,서상원,장봉기,Jung, Il Ho,Seo, Sang Won,Jang, Bong Ki 한국품질경영학회 2017 품질경영학회지 Vol.45 No.3
Purpose: The purpose of this study is to analyze quality control strengthening pilot project in development stages of weapon systems which ensures zero-defect. In order to achieve that, we propose collaboration support system between related organizations. Methods: First, we analyze how quality control methods has been developed from reviewing the preliminary study in commercial and defense industry. Then, we suggest improvement plans for quality control in defense industry and propose a pilot study which able to improve the recognized problems. Results: The results of this study ensures the participants in defense industry recognize the importance of quality control and form a consensus by sharing a case study. Finally, we propose the standardized work process by utilizing manual and manpower dispatching. Conclusion: As a result, this study clarifies the scope and role of relevant organizations to achieve the defense quality assurance in the total life cycle(TLC). Also, this paper guides the collaboration system between the relevant organization which differs from the commercial industry currently divided into development-production-quality.
다물체 동역학을 이용한 DC 모터 소음 저감에 관한 연구
정일호(Il-Ho Jung),박태원(Tae-Won Park),박지연(Ji-Yeon Park) 대한기계학회 2004 대한기계학회 춘추학술대회 Vol.2004 No.4
The DC Motor of a vehicle may cause noise and vibration due to high-speed revolution, which can make a driver feel uncomfortable. There have been various studies that attempted to solve these problems, mostly focusing on the causes of noise and vibration and the means of preventing them. The CAE methodology is more efficient than a real test for the purpose of looking for various design parameters to reduce the noise and vibration of the DC motor. In this study, a design process for reducing brush noise is presented with the use of a computer model, which is made by using a multi-body dynamics program (DADS). The design parameters to reduce the brush noise and vibration were proposed using a computer model. They were used to reduce the noise and vibration of a DC motor and verified by the test results of a fan DC motor in a vehicle. This method may be applicable to various DC motors.
정일호(Ilho Jung),이진형(Jinhyoung Lee),박태원(Taewon Park),김혁(Hyuk Kim),조동협(Donghyeob Cho),박중경(Joongkyung Park) 한국자동차공학회 2005 한국자동차공학회 춘 추계 학술대회 논문집 Vol.2005 No.5_2
In this paper, a computer aided engineering (CAE) method is proposed for a fatigue life prediction in the early design stages using the multibody dynamics analysis and the linear damage rule. From a dynamic analysis of the OHT vehicle system, dynamic load time histories of vehicle components are calculated. From a finite element analysis of components, modal stresses are calculated. Through the dynamic load time history and the static stress of the component, a dynamic stress time history is produced using the superposition principle. Using the linear damage rule and the cycle counting method, the fatigue life is predicted from the dynamic stress time history. The process of predicting the fatigue life using the proposed computer models in this paper may be applied to structures of various dynamic systems.
정일호(Ilho Jung),이수호(Sooho Lee),서종휘(Jonnghwi Seo),박태원(Taewon Park),정래훈(Raehun Jung) 한국자동차공학회 2003 한국자동차공학회 춘 추계 학술대회 논문집 Vol.- No.-
Analysis of brake characteristics has progressed rapidly in recent years, as computer techniques have developed. However, there are many problems in predicting braking characteristics, due to the numerous design variables of the brake system. Therefore, a synthetic braking performance analysis is required for all brake system parts such as master cylinder, booster, control valve and split system.<br/> In this paper, a program which can analyze braking performance such as force distribution, braking efficiency, pedal force and pedal travel, is presented. The preprocessor of the program helps users prepare input files through a dialog box. An additional postprocessor makes the graph presentation of solved results. Also, a simple example problem is applied to show the usefulness of the presented program.<br/>