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영업사원의 판매 역량이 판매 행동과 단기적 판매 성과에 미치는 영향
전우석,이호택 한국유통경영학회 2022 유통경영학회지 Vol.25 No.4
Purpose: The purpose of this study was to investigate the effect of salespeople’s individual sales capabilities on selling behaviors. And figure out short-term sales performance that affected by salespeople’s selling behaviors in door-to-door personal selling channel. And we attempted to provide meaningful implications for companies that want to increase sales performance. Research design, data, and methodology: The collected method was conducted by surveying door-to-door salespeople in South Korea and their sales performance during three months. And 214 data were collected. The hypotheses are tested using the structural equation modeling technique. Reliability test and confirmatory factor analysis were performed for research validity and reliability of the study. Results: First, salespeople’s individual sales capabilities have a positive effect on the selling behavior. Second, the salespeople’s individual sales capabilities have a greater impact on customer-oriented selling behavior than salesoriented selling behavior. Third, sales-oriented selling behavior only has significant positive effects on sales performance. Fourth, the salespeople’s sales-oriented selling behavior has a greater impact than customer-oriented selling behavior. Fifth, the effect of salespeople’s individual sales capabilities to performance was not adopted because it showed statistically insignificant results. Implications: The study offers practical and theoretical insights into understanding how they affect the individual selling capabilities of salespeople, their selling behaviors and short-term sales performance. Based on the results, the impacts of individual sales capabilities may differ in other contexts. Firms should focus on salespeople’s selection and concentration. Which are required depending on whether the salespeople’s goal is to secure performance through long-term customer satisfaction and loyalty or to pursue performance improvement for short-term goals.
마이크로 머신(MEMS) 소자 패키지의 열응력에 대한 연구
전우석,백경욱,Jeon, U-Seok,Baek, Gyeong-Uk 한국재료학회 1998 한국재료학회지 Vol.8 No.8
마이크로 머신 소자는 일반전자 소자와 달리 소자 자체에 미세한 기계적 구조물을 갖고 있으며, 이의 구동을 통하여 센서 또는 엑츄에이터의 기능을 갖게 된다. 이 소자들은 그 작동 요구특성에 따라 패키지의 기계적, 환경적 격리를 요구하거나 분위기조절이 요구되는 등 까다로운 패키지 특성을 필요로 한다. 또한 미세한 작동소자들로 인하여 열 및 열응력에 매우 민감하며, 패키지방법에 따라 구동부위의 작동 특성이 크게 변화할 수 있다. 본 연구에서는 마이크로 머신 소자가 패키지 상에 접촉되어 패키지 될 때, 소자의 접촉 재료 및 공정온도, 크기 등이 마이크로 머신 소자에 미치는 열응력을 연구하였다. 유한요소해석법을 사용하여 소자에 미치는 열응력과 이로 인한 마이크로머신 소자의 물리적 변형을 예측하고, 이를 통하여 마이크로 머신 소자 패키지에 최소한의 열응력을 미치는 소자접속 재료의 선별과 패키지 설계의 최적화를 이루고자 하였다. Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.
전우석,이현미,이제완 한국가구학회 2020 한국가구학회지 Vol.31 No.4
This study aimed to update a database of anatomical characteristics of commercial coniferous trees, mainly distributed in Korea, and to observe anatomical characteristics. The wood samples were for example Pinus densiflora (ages: 90, diameter at breast height: 34.4 cm), Pinus rigida (ages: 50, diameter at breast height: 33.7 cm), Larix gmelinii (ages: 84, diameter at breast height: 33.5 cm), and Larix kaempferi (ages: 93, diameter at breast height: 40.6 cm). Three sections of each wood samples were examined with an optical microscope to observe the anatomical features, and the tracheid length was measured in units of five growth rings from the pith to the bark. Also, the width of the growth ring and the ratio of the latewood were measured to estimate the wood properties. Typical anatomical characteristics have been found in samples of coniferous trees. However, the average tracheid length value was the longest for Larix kaempferi, 2.91 mm for earlywood, and 3.31 mm for latewood. When the juvenile wood and mature wood were classified according to the difference in tracheid length, the boundary line is considered to be 20~25 growth rings. The width of the growth ring and the latewood ratio were also marginally greater in Larix kaempferi. Since coniferous woods are used for various purposes, such as wood structures and furniture, the results of this study are expected to provide basic data for the use of coniferous woods.