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시아노기를 도입한 파라계 아라미드 공중합체의 합성과 특성분석
여문진,구남대,장은지,강찬솔,정영규,백두현,Yeo, Moon Jin,Gu, Nam Dae,Jang, Eun Ji,Kang, Chan Sol,Jeong, Young Gyu,Baik, Doo Hyun 한국섬유공학회 2014 한국섬유공학회지 Vol.51 No.3
Poly(p-phenylene terephthalamide) (PPTA) and poly(2-cyano-1,4-phenylene terephthalamide) (CNPPTA)-based copolymers were synthesized using a low temperature polycondensation reaction between terephthaloyl chloride, 2-cyano-1,4-phenylene diamine, and/or 1,4-phenylene diamine in a N-methylpyrrolidinone solvent containing 2% $CaCl_2$. The molecular structures and thermal stabilities of PPTA, CNPPTA, and copolymers of the two with different cyano group contents were characterized using FT-IR spectroscopy and thermogravimetric analysis, respectively. The liquid crystalline states and polymer concentration-dependent viscosities of NMP/$CaCl_2$ solutions containing different CNPPTA copolymer concentrations were investigated using polarized optical microscopy and viscometry, respectively. It was found that CNPPTA polymers with higher cyano group contents were more soluble in polar organic solvents, such as NMP, DMAc, and DMF, and that CNPPTA polymer solutions based on the NMP/$CaCl_2$ system formed liquid crystalline structures above certain critical polymer concentrations. In addition, TGA results revealed that, although the initial degradation temperatures of CNPPTA copolymers were quite comparable to that of PPTA, their char yields at $800^{\circ}C$ were far higher.
Development of acrylic adhesives with high heat resistance and wettability for heating process
조원섭,김현주,여문진,김정렬,최환정,심종배 한국공업화학회 2016 한국공업화학회 연구논문 초록집 Vol.2016 No.1
This work relates to adhesives for use in fabrication of chip on film and, more particularly, to development heat-resistant adhesives to minimize damage on substrate after heat process for use in printed circuit boards in display industry. This adhesive has many advantages to adapt in the industry such as, above all, a fine adhesiveness difference, high cohesion, excellent removal property, and low glass transition temperation(Tg) between before and after heating process. To be more specific, to obtain low Tg of the adhesive, flexible monomer with -OH group was used and softly removed from substrate without zipping sound even adapting to large size of substrate after heat process. Additionally, to minimize damage of substrate, the adhesive has been designed with high molecular weight, decreasing anchoring effect and minimizing hydrogen bond donor in molecular structure. To prove adhesion, peel strength was measured according to removal speed between before and after heat process.
1P-585 공정보호용 열-UV 이중경화형 아크릴 점착제
김현주,조원섭,여문진,김정렬,최환정,심종배,최광식 한국공업화학회 2017 한국공업화학회 연구논문 초록집 Vol.2017 No.1
공정보호용 점착 필름은 물질을 공정과정간 스크래치 오염 방지를 위해 부착시킨다. 이러한 공정 보호용 점착 필름은 높은 응집력과 웨팅성이 기본적으로 요구되며 피착면, 공정에 따라 고 점착, 연신율, 내열성 등이 추가적으로 요구되고 있다. 본 연구는 공정 보호용 점착제 중 공정과정간 높은 점착력과 웨팅성이 구현되며 공정 후엔 UV조사 처리 하여 낮은 점착력이 구현되는 열-UV 이중경화 방식을 채택한 점착제의 연구이다.
지민호,강찬솔,여문진,백두현,Jee, Min Ho,Kang, Chan Sol,Yeo, Moon Jin,Baik, Doo Hyun 한국섬유공학회 2015 한국섬유공학회지 Vol.52 No.6
Polyhydroxyamide (PHA) was synthesized by low-temperature solution polymerization of 3,3'-dihydroxybenzidine and terephthaloyl chloride. Then, pure PHA and PHA nanocomposite fibers, including multi-walled carbon nanotube (MWNT), were prepared by a wet-spinning process. The structural characteristics, thermal properties, and mechanical performances, such as tensile strength, initial modulus, and compressive strength, of the PHA fibers were investigated using FT-IR, TGA, and a tensile testing machine. The TGA results show that the PHA fiber has excellent thermal stability at high temperatures and can undergo thermal cyclization to yield PBO fiber. The tensile mechanical properties of PHA nanocomposite fibers were better than those of pure PHA fiber, and they were improved on increasing the MWNT content. The highly improved mechanical properties of the nanocomposite fibers are thought to be related to the strong interfacial interactions between the PHA matrix and MWNT.
강찬솔,지민호,여문진,백두현 한국섬유공학회 2018 Fibers and polymers Vol.19 No.8
We report the preparation of polybenzoxazole (PBO) fiber from polyhydroxyamide (PHA) precursor fiber which is free from strong acid such as polyphosphoric acid. We prepared the PHA fibers with different spin-draw ratios (SDRs) using a wet-spinning method and the PBO fibers with an SDR of 3.5 (SDR-3.5 PBO fibers) were prepared by various heattreatment temperatures, and investigated their morphology, crystalline structure, and mechanical properties. The simultaneous thermogravimetric analysis-mass spectrometry (STA-MS) and field-emission scanning electron microscopy (FE-SEM) results confirmed that the diameter of the SDR-3.5 PBO fiber was much smaller than that of the SDR-3.5 PHA fiber, due to the release of water during the thermal cyclization reaction which forms the PBO structure. The wide-angle Xray diffraction (WAXD) pattern of the SDR-3.5 PBO fiber heat-treated at 350 oC (SDR-3.5 PBO 350 fiber) showed two peaks, at 2θ=14.83 o and 24.38 o, and the diffraction angles dropped with increasing heat-treatment temperature. In addition, the initial modulus and tensile strength of the SDR-3.5 PBO fiber heat-treated at 550 oC (SDR-3.5 PBO 550 fiber) were found to be 19.1 GPa and 449.2 MPa, which were much higher than those of the SDR-3.5 PHA fiber, 9.3 GPa and 227.0 MPa, respectively.