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엄용성,손지혜,배현철,최광성,이진호 한국전자통신연구원 2016 ETRI Journal Vol.38 No.6
A chemorheological analysis of a no-flow underfill was conducted using curing kinetics through isothermal and dynamic differential scanning calorimetry, viscosity measurement, and solder (Sn/27In/54Bi, melting temperature of 86 °C) wetting observations. The analysis used an epoxy system with an anhydride curing agent and carboxyl fluxing capability to remove oxide on the surface of a metal filler. A curing kinetic of the no-flow underfill with a processing temperature of 130 °C was successfully completed using phenomenological models such as autocatalytic and nth-order models. Temperaturedependent kinetic parameters were identified within a temperature range of 125 °C to 135 °C. The phenomenon of solder wetting was visually observed using an optical microscope, and the conversion and viscosity at the moment of solder wetting were quantitatively investigated. It is expected that the curing kinetics and rheological property of a no-flow underfill can be adopted in arbitrary processing applications.
Optimization of Material and Process for Fine Pitch LVSoP Technology
엄용성,손지혜,배현철,최광성,최흥섭 한국전자통신연구원 2013 ETRI Journal Vol.35 No.4
For the formation of solder bumps with a fine pitch of 130 μm on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of 220°C. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 μm, 18.3 μm, and 12.0 μm, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field.
엄용성,장건수,손지혜,배현철,최광성 한국전자통신연구원 2019 ETRI Journal Vol.41 No.6
A highly reliable conductive adhesive obtained by transient liquid‐phase sintering (TLPS) technologies is studied for use in high‐power device packaging. TLPS involves the low‐temperature reaction of a low‐melting metal or alloy with a high‐melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag‐coated Cu, a Sn96.5‐Ag3.0‐Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 °C, consistent with the transient behavior of Ag3Sn + Cu6Sn5 → liquid + Cu3Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.
반도체 패키징용 에폭시 기반 접합 소재 및 공정 기술 동향
엄용성,최광성,최광문,장기석,주지호,이찬미,문석환,문종태,Eom, Y.S.,Choi, K.S.,Choi, G.M.,Jang, K.S.,Joo, J.H.,Lee, C.M.,Moon, S.H.,Moon, J.T. 한국전자통신연구원 2020 전자통신동향분석 Vol.35 No.4
Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.
Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life
엄용성,선지혜,장건수,이학선,배현철,최광성,최흥섭 한국전자통신연구원 2014 ETRI Journal Vol.36 No.3
For the fine-pitch application of flip-chip bonding withsemiconductor packaging, fluxing and hybrid underfillswere developed. A micro-encapsulated catalyst wasadopted to control the chemical reaction at room andprocessing temperatures. From the experiments with adifferential scanning calorimetry and viscometer, thechemical reaction and viscosity changes werequantitatively characterized, and the optimum type andamount of micro-encapsulated catalyst were determinedto obtain the best pot life from a commercial viewpoint. Itis expected that fluxing and hybrid underfills will beapplied to fine-pitch flip-chip bonding processes and behighly reliable.